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For resin Found Datasheets File :: 36479 Search Time::1.234ms
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				HSMC[Hi-Sincerity Mocroelectronics]
Part No.	HSA733SP
OCR Text	... plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reser...
Description	PNP EPITAXIAL PLANAR TRANSISTOR
File Size	23.71K / 3 Page	View it Online	Download Datasheet

				Hi-Sincerity Mocroelectroni... Hi-Sincerity Mocroelectronics
Part No.	HSA733
OCR Text	... plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reser...
Description	PNP EPITAXIAL PLANAR TRANSISTOR
File Size	35.95K / 4 Page	View it Online	Download Datasheet

				乐山无线电股份有限公 LRC[Leshan Radio Company]
Part No.	HVY202A
OCR Text	...compact ET tuner. * Ultra small resin Package (URP) is suitable for surface mount design. 1 HVU202A 2 SOD- 323 1 CATHODE 2 ANODE DEVICEMARKING HVU202A = Q ABSOLUTE MAXIMUM RATINGS (TA = 25C) Item Reversevoltage Junction ...
Description	OSCILLATORS 100PPM -20 70 3.3V 4 66.000MHZ TS HCMOS 3.2X2.5 4PAD SMD Variable Capacitance Diode for Electronic Tuning
File Size	44.45K / 2 Page	View it Online	Download Datasheet

				Hi-Sincerity Mocroelect... Hi-Sincerity Mocroelectronics Hi-Sincerity Microelectronics
Part No.	HXL1225 HML1225
OCR Text	...plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserv...
Description	0.8A 300.380 VOLTAGE SCRS IGT<200uA 28.37 Kbytes 0.8A 300.380 VOLTAGE SCRS IGT<200uA
File Size	27.33K / 2 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	ILX524KA ILX524
OCR Text	...ition, the cover glass and seal resin may overlap with the notch or ceramic may overlap with the notch of the plastic portion. 3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace ca...
Description	2700 pixel X 3 line CCD Linear Sensor (Color)
File Size	118.47K / 11 Page	View it Online	Download Datasheet

				NICHIA CORPORATION Electronic Theatre Controls, Inc. ETC[ETC] List of Unclassifed Manufacturers
Part No.	NSPW300 NSPW300BS
OCR Text	...e's page. Material as follows ; resin(Mold) : Leadframe : Epoxy resin (over YAG Phosphor) Ag plating Copper Alloy -1- Nichia STSE-CW2157B <Cat.No.031110> 4.PACKAGING * The LEDs are packed in cardboard boxes after packaging in anti...
Description	NICHIA WHITE LED
File Size	329.17K / 15 Page	View it Online	Download Datasheet

				NICHIA CORPORATION ETC[ETC] List of Unclassifed Manufacturers
Part No.	NSPW310BS
OCR Text	...e's page. Material as follows ; resin(Mold) : Leadframe : Epoxy resin (over YAG Phosphor) Ag plating Copper Alloy -1- Nichia STSE-CW2117B <Cat.No.031110> 4.PACKAGING * The LEDs are packed in cardboard boxes after packaging in anti...
Description	SPECIFICATION FOR NICHIA WHITE LED
File Size	320.49K / 15 Page	View it Online	Download Datasheet

				NICHIA CORPORATION List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
Part No.	NSPW500BS
OCR Text	...e's page. Material as follows ; resin(Mold) : Leadframe : Epoxy resin (over YAG Phosphor) Ag plating Copper Alloy -1- Nichia STSE-CW2159A <Cat.No.020826> 4.PACKAGING * The LEDs are packed in cardboard boxes after packaging in anti...
Description	SPECIFICATION FOR NICHIA WHITE LED
File Size	409.00K / 15 Page	View it Online	Download Datasheet

				PANASONIC[Panasonic Semiconductor]
Part No.	PNZ323B
OCR Text	...doption of visible light cutoff resin (1.5) 2.54 31.251.0 1.50.2 6.00.2 7.50.2 (2) 5.50.2 1.0 22.251.0 0.5 1.32 2- 0.60.1 0.5 Absolute Maximum Ratings (Ta = 25C) Parameter Reverse voltage (DC) Power dissipation Opera...
Description	PIN Photodiode
File Size	45.23K / 2 Page	View it Online	Download Datasheet

				Toshiba Corporation TOSHIBA[Toshiba Semiconductor]
Part No.	TODX270
OCR Text	...n wafer crystallization or mold resin stress. The detailed causes are, however, not clear. The lifetime of light emitters is greatly influenced by the operating conditions and the environment in which it is used as well as by the lifetime c...
Description	CONNECTOR ACCESSORY FIBER OPTIC TRANSCEIVING MODULE FOR DUPLEX DIGITAL SIGNAL COMMUNICATION
File Size	170.27K / 9 Page	View it Online	Download Datasheet

For resin Found Datasheets File :: 36479 Search Time::1.234ms
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