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resin Datasheet PDF File

For resin Found Datasheets File :: 36477 Search Time::1.141ms
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				Panasonic Corporation PANASONIC[Panasonic Semiconductor]
Part No.	LNA2701L LN159
OCR Text	...ency : PO = 1.8 mW (min.) Small resin package Long lifetime, high reliability Thin type package modified from LN59 2.80.2 2-C0.5 8 26 .5 3.80.2 2.40.2 0.8 o1.40.2 8 8 1.0 26 .5 16.91.0 Not soldered 2.0 0.8 ...
Description	GaAs Bi-directional Infrared Light Emitting Diode
File Size	43.01K / 2 Page	View it Online	Download Datasheet

				OKI electronic componets OKI electronic components
Part No.	MSM6544 MSM6544GS-2K
OCR Text	...ess Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.36 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susce...
Description	42-DOT LCD DRIVER
File Size	107.11K / 12 Page	View it Online	Download Datasheet

				OKI electronic components OKI[OKI electronic componets] OKI ELECTRIC INDUSTRY CO LTD
Part No.	MSM6595 MSM6595A MSM6595A-XXX MSM6595A-XXXRS MSM6595A-XXXJS
OCR Text	...ess Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.50 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which a...
Description	1-Mbit Serial Voice ROM From old datasheet system 1M X 1 MASK PROM, PDIP18
File Size	163.28K / 13 Page	View it Online	Download Datasheet

				OKI electronic components OKI[OKI electronic componets] OKI SEMICONDUCTOR CO., LTD.
Part No.	MSM6596A MSM6596A-XXX
OCR Text	...ess Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.50 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which a...
Description	2-Mbit Serial Voice ROM From old datasheet system
File Size	167.86K / 13 Page	View it Online	Download Datasheet

				OKI electronic componet... OKI SEMICONDUCTOR CO., LTD. OKI[OKI electronic componets] OKI electronic components
Part No.	MSM6597A MSM6597A-XXX
OCR Text	...ess Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which a...
Description	From old datasheet system 3-Mbit Serial Voice ROM
File Size	138.75K / 10 Page	View it Online	Download Datasheet

				OKI electronic components OKI[OKI electronic componets]
Part No.	MSM6599 MSM6599B MSM6599BGS-BK MSM6599BGS-K
OCR Text	...ess Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.29 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susce...
Description	80-DOT SEGMENT DRIVER From old datasheet system
File Size	128.29K / 11 Page	View it Online	Download Datasheet

				SHARP[Sharp Electrionic Components] Sharp Electronics Corp.
Part No.	PC8170NSZ PC81710NSZ PC81711NSZ PC81712NSZ PC81713NSZ PC81715NSZ PC81716NSZ PC81718NSZ PC8171NSZ PC8171XNSZ PC817XNSZ-SERIES
OCR Text	...to 2.5 Conditions Epoxy resin 0.260.1 : 0 to 13 0.50.1 IF=0.5mA VCE=5V Ta=25C Internal connection diagram 1 4 1 2 3 2 3 4 s Absolute Maximum Ratings (Ta=25C) Unit mA mA V mW V V mA mW mW C C kVrms C Anode Cathod...
Description	PC8171NSZ PC8171NSZ Low Input Current Type Photocoupler
File Size	62.42K / 5 Page	View it Online	Download Datasheet

				SHARP[Sharp Electrionic Components]
Part No.	PC817X PC817
OCR Text	...lvent you are requested package resin. 2. The LED used in the Photocoupier generally decreases the light emission power by operation. In case of long operation time, please design the circuit with considering the degradation of the light...
Description	DEVICE SPECIFICATION FOR PHOTOCOUPLER
File Size	507.10K / 11 Page	View it Online	Download Datasheet

				SHARP[Sharp Electrionic Components]
Part No.	PC817 PC817XI
OCR Text	...lvent you are requested package resin. 2. The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit with considering the degradation of the light...
Description	DEVICE SPECIFICATION FOR PHOTOCOUPLER
File Size	545.48K / 11 Page	View it Online	Download Datasheet

				Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation FAIRCHILD[Fairchild Semiconductor]
Part No.	QTLP320C-E QTLP320C-R QTLP320C-Y QTLP320CY QTLP320CE QTLP320CR
OCR Text	... from the package. 3. Protruded resin under the flange is 0.059" (1.5 mm) max. 4. All tolerances are 0.10" (0.25 mm) unless otherwise specified. DESCRIPTION This low profile, 4-pin LED provides a more uniform and evenly distributed illu...
Description	4 - PIN POWER LED T-1 SINGLE COLOR LED, ORANGE, 3 mm Orange 4 - PIN Power LED Red 4 - PIN Power LED High Efficiency Red Rectangular Solid State Lamp
File Size	333.99K / 4 Page	View it Online	Download Datasheet

For resin Found Datasheets File :: 36477 Search Time::1.141ms
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