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MC74HC14A Hex Schmitt-Trigger Inverter
High-Performance Silicon-Gate CMOS
The MC74HC14A is identical in pinout to the LS14, LS04 and the HC04. The device inputs are compatible with Standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. The HC14A is useful to "square up" slow input rise and fall times. Due to hysteresis voltage of the Schmitt trigger, the HC14A finds applications in noisy environments.
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14 PDIP-14 N SUFFIX CASE 646 1
* * * * * * * *
Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 mA High Noise Immunity Characteristic of CMOS Devices In Compliance With the JEDEC Standard No. 7.0 A Requirements Chip Complexity: 60 FETs or 15 Equivalent Gates Pb-Free Packages are Available
14 1
MC74HC14AN AWLYYWWG
14 14 1 SOIC-14 D SUFFIX CASE 751A 1 HC14AG AWLYWW
14 14 1 TSSOP-14 DT SUFFIX CASE 948G 1 HC 14A ALYWG G
14 SOEIAJ-14 F SUFFIX CASE 965 1 A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location) 74HC14A ALYWG
14 1
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2006
October, 2006 - Rev. 11
1
Publication Order Number: MC74HC14A/D
MC74HC14A
Pinout: 14-Lead Packages (Top View)
VCC 14 A6 13 Y6 12 A5 11 Y5 10 A4 9 Y4 8 A1
LOGIC DIAGRAM
1 2 Y1
A2
3
4
Y2
A3 1 A1 2 Y1 3 A2 4 Y2 5 A3 6 Y3 7 GND A4
5
6
Y3 Y=A
9
8
Y4
Pin 14 = VCC Pin 7 = GND
A5
11
10
Y5
FUNCTION TABLE
Inputs A L H Outputs Y H L
A6
13
12
Y6
ORDERING INFORMATION
Device MC74HC14AN MC74HC14ANG MC74HC14AD MC74HC14ADG MC74HC14ADR2 MC74HC14ADR2G MC74HC14ADT MC74HC14ADTG MC74HC14ADTR2 MC74HC14ADTR2G MC74HC14AF MC74HC14AFG MC74HC14AFEL MC74HC14AFELG Package PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* TSSOP-14* TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free) SOEIAJ-14* SOEIAJ-14* 50 Units / Rail 2500 / Tape & Reel 55 Units / Rail 25 Units / Rail Shipping
96 Units / Rail
2500 / Tape & Reel
2000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free.
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MC74HC14A
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MAXIMUM RATINGS
VCC Vin Iin Vout Iout PD SymbolIIIIIIIIIIIIII Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) Value Unit - 0.5 to + 7.0III V V V - 0.5 to VCC + 0.5 - 0.5 to VCC + 0.5 20 25 50 750 500 450 DC Output Voltage (Referenced to GND) DC Input Current, per Pin mA mA mA DC Output Current, per Pin ICC DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP SOIC Package TSSOP Package mW Tstg TL Storage Temperature Range - 65 to + 150 260 _C _C Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP, SOIC or TSSOP Package
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol VCC Parameter Min 2.0 0 Max 6.0 Unit V V DC Supply Voltage (Referenced to GND)
Vin, Vout TA
DC Input Voltage, Output Voltage (Referenced to GND)
VCC
Operating Temperature Range, All Package Types Input Rise/Fall Time (Figure 1)
- 55 0 0 0
+ 125
_C ns
tr, tf
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
No Limit* No Limit* No Limit*
*When Vin = 50% VCC, ICC > 1mA
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MC74HC14A
DC CHARACTERISTICS (Voltages Referenced to GND)
Symbol VT+ max Parameter Maximum Positive-Going Input Threshold Voltage (Figure 3) Minimum Positive-Going Input Threshold Voltage (Figure 3) Maximum Negative-Going Input Threshold Voltage (Figure 3) Minimum Negative-Going Input Threshold Voltage (Figure 3) Maximum Hysteresis Voltage (Figure 3) Condition Vout = 0.1V |Iout| 20mA VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 4.5 6.0 |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA 3.0 4.5 6.0 2.0 4.5 6.0 |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA 3.0 4.5 6.0 6.0 6.0 Guaranteed Limit -55 to 25C 1.50 2.15 3.15 4.20 1.0 1.5 2.3 3.0 0.9 1.4 2.0 2.6 0.3 0.5 0.9 1.2 1.20 1.65 2.25 3.00 0.20 0.25 0.40 0.50 1.9 4.4 5.9 2.48 3.98 5.48 0.1 0.1 0.1 0.26 0.26 0.26 0.1 1.0 85C 1.50 2.15 3.15 4.20 0.95 1.45 2.25 2.95 0.95 1.45 2.05 2.65 0.3 0.5 0.9 1.2 1.20 1.65 2.25 3.00 0.20 0.25 0.40 0.50 1.9 4.4 5.9 2.34 3.84 5.34 0.1 0.1 0.1 0.33 0.33 0.33 1.0 10 125C 1.50 2.15 3.15 4.20 0.95 1.45 2.25 2.95 0.95 1.45 2.05 2.65 0.3 0.5 0.9 1.2 1.20 1.65 2.25 3.00 0.20 0.25 0.40 0.50 1.9 4.4 5.9 2.20 3.70 5.20 0.1 0.1 0.1 0.40 0.40 0.40 1.0 40 mA mA V Unit V
VT+ min
Vout = 0.1V |Iout| 20mA
V
VT- max
Vout = VCC - 0.1V |Iout| 20mA
V
VT- min
Vout = VCC - 0.1V |Iout| 20mA
V
VHmax Note 2
Vout = 0.1V or VCC - 0.1V |Iout| 20mA
V
VHmin Note 2
Minimum Hysteresis Voltage (Figure 3)
Vout = 0.1V or VCC - 0.1V |Iout| 20mA
V
VOH
Minimum High-Level Output Voltage
Vin VT- min |Iout| 20mA Vin VT- min
V
VOL
Maximum Low-Level Output Voltage
Vin VT+ max |Iout| 20mA Vin VT+ max
Iin ICC
Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package)
Vin = VCC or GND Vin = VCC or GND Iout = 0mA
1. Information on typical parametric values along with frequency or heavy load considerations can be found in Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D). 2. VHmin > (VT+ min) - (VT- max); VHmax = (VT+ max) - (VT- min).
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MC74HC14A
AC CHARACTERISTICS (CL = 50pF, Input tr = tf = 6ns)
Symbol tPLH, tPHL Parameter Maximum Propagation Delay, Input A or B to Output Y (Figures 1 and 2) VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 Guaranteed Limit -55 to 25C 75 30 15 13 75 27 15 13 10 85C 95 40 19 16 95 32 19 16 10 125C 110 55 22 19 110 36 22 19 10 Unit ns
tTLH, tTHL
Maximum Output Transition Time, Any Output (Figures 1 and 2)
ns
Cin
Maximum Input Capacitance
pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V CPD Power Dissipation Capacitance (Per Inverter)* 22 pF * Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
tf 90% 50% 10% tPLH 90% OUTPUT Y 50% 10% tTLH
tr VCC
INPUT A
GND tPHL
tTHL
Figure 1. Switching Waveforms
TEST POINT OUTPUT DEVICE UNDER TEST CL*
*Includes all probe and jig capacitance
Figure 2. Test Circuit
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MC74HC14A
VT , TYPICAL INPUT THRESHOLD VOLTAGE (VOLTS 4
3 (VT+) VHtyp
2 (VT-)
1
2
3 4 5 VCC, POWER SUPPLY VOLTAGE (VOLTS) VHtyp = (VT+ typ) - (VT- typ)
6
Figure 3. Typical Input Threshold, VT+, VT- versus Power Supply Voltage
A
Y
(a) A Schmitt-Trigger Squares Up Inputs With Slow Rise and Fall Times VH Vin VCC VT+ VT- GND VOH Vout VOL Vout Vin VH
(b) A Schmitt-Trigger Offers Maximum Noise Immunity VCC VT+ VT- GND VOH
VOL
Figure 4. Typical Schmitt-Trigger Applications
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MC74HC14A
PACKAGE DIMENSIONS
PDIP-14 CASE 646-06 ISSUE P
14
8
B
1 7
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 --- 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 --- 10 _ 0.38 1.01
A F N -T-
SEATING PLANE
L C
H
G
D 14 PL
K
M
J M
DIM A B C D F G H J K L M N
0.13 (0.005)
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MC74HC14A
PACKAGE DIMENSIONS
SOIC-14 CASE 751A-03 ISSUE H
-A-
14 8
-B-
P 7 PL 0.25 (0.010)
M
B
M
1
7
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
G C -T-
SEATING PLANE
R X 45 _
F
D 14 PL 0.25 (0.010)
M
K TB
S
M A
S
J
DIM A B C D F G J K M P R
MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50
INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04 1 0.58
14X
14X
1.52
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74HC14A
PACKAGE DIMENSIONS
TSSOP-14 CASE 948G-01 ISSUE B
14X K REF
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
N
2X
L/2
14
8
0.25 (0.010) M
L
PIN 1 IDENT. 1 7
B -U-
N F DETAIL E K
0.15 (0.006) T U
S
J J1
SECTION N-N
C 0.10 (0.004) -T- SEATING
PLANE
D
G
H
DETAIL E
SOLDERING FOOTPRINT*
7.06 1
0.36
14X
14X
1.26
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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EEE CCC EEE CCC CCC
A -V-
K1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C --- 1.20 --- 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 -W- K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC74HC14A
PACKAGE DIMENSIONS
SOEIAJ-14 CASE 965-01 ISSUE A
14
8
LE Q1 E HE M_ L DETAIL P
1
7
Z D e A VIEW P
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 1.42 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.056
c
b 0.13 (0.005)
M
A1 0.10 (0.004)
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