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| (R) STPS5L25B LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS n 5A 25 V 150C 0.35 V 2 3 4 (TAB) 4 n n n VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION AND REDUCED HEATSINK OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH MEANS THE HIGHEST EFFICIENCY IN THE APPLICATIONS HIGH POWER SURFACE MOUNT MINIATURE PACKAGE AVALANCHE CAPABILITY SPECIFIED 2 1 NC 3 DPAK DESCRIPTION Single Schottky rectifier suited to Switched Mode Power Supplies and high frequency DC to DC converters. This device is especially intended for use as a Rectifier at the secondary of 3.3V SMPS units. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt *: Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage Tc = 145C = 0.5 tp = 10 ms Sinusoidal tp=2 s square F=1kHz tp = 100 s square tp = 1s Tj = 25C Value 25 7 5 75 1 2 3000 - 65 to + 150 150 10000 Unit V A A A A A W C C V/s dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) 1/4 July 2003 - Ed: 5A STPS5L25B THERMAL RESISTANCES Symbol Rth(j-c) Junction to case Parameter Value 2.5 Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * VF * Tests Conditions Reverse leakage current Forward voltage drop Tests Conditions Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 380 s, < 2% Min. Typ. 55 Max. 350 115 0.47 0.35 0.59 0.50 Unit A mA V VR = VRRM IF = 5 A IF = 5 A IF = 10 A IF = 10 A 0.41 0.31 Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 2.5 2.0 1.5 1.0 T Fig. 2: Average forward current versus ambient temperature (=0.5). IF(av)(A) Rth(j-a)=Rth(j-c) 6 = 0.1 = 0.05 =1 = 0.2 = 0.5 5 4 3 2 T Rth(j-a)=70C/W 0.5 IF(av) (A) 0.0 0 1 2 3 4 =tp/T tp 1 5 6 0 =tp/T tp Tamb(C) 50 75 100 125 150 0 25 Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1s) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 0 25 50 75 100 125 150 2/4 STPS5L25B Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). IM(A) 1.0 0.8 Tc=25C Tc=75C Fig. 5: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) 100 80 60 40 0.6 0.4 = 0.5 = 0.2 Tc=100C T 20 0 1E-3 IM t 0.2 =0.5 Single pulse = 0.1 t(s) 1E-2 1E-1 1E+0 tp(s) 0.0 1.0E-4 1.0E-3 1.0E-2 =tp/T tp 1.0E-1 1.0E+0 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). 3E+2 1E+2 1E+1 1E+0 1E-1 Tj=25C Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(pF) IR(mA) Tj=150C 2000 F=1MHz Tj=25C Tj=125C 1000 500 1E-2 VR(V) 1E-3 0 5 10 15 20 25 200 VR(V) 100 1 2 5 10 20 30 Fig. 9: Forward voltage drop versus forward current (maximum values). Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35m). Rth(j-a) (C/W) 100 100.0 IFM(A) Typical values Tj=150C 80 Tj=125C 10.0 60 40 1.0 Tj=25C 20 VFM(V) 0.1 0.0 0 0 2 4 6 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 8 10 12 S(Cu) (cm) 14 16 18 20 3/4 STPS5L25B PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. A A1 A2 B B2 C C2 D E G H L2 L4 V2 FOOT PRINT DIMENSIONS (in millimeters) 6.7 Millimeters Min. Max 2.20 2.40 0.90 1.10 0.03 0.23 0.64 0.90 5.20 5.40 0.45 0.60 0.48 0.60 6.00 6.20 6.40 6.60 4.40 4.60 9.35 10.10 0.80 typ. 0.60 1.00 0 8 Inches Min. Max. 0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.018 0.023 0.236 0.244 0.251 0.259 0.173 0.181 0.368 0.397 0.031 typ. 0.023 0.039 0 8 6.7 3 3 1.6 2.3 2.3 1.6 Ordering type STPS5L25B STPS15LB-TR n Marking STPS5L25B STPS5L25B Package DPAK DPAK Weight 0.30g 0.30g Base qty 75 2500 Delivery mode Tube Tape & reel Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 4/4 |
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