| PART |
Description |
Maker |
| MLPM-6PIN |
Package Dimensions
|
IRF[International Rectifier]
|
| PM1SK1 |
Package Dimensions in mm
|
VISAY[Vishay Siliconix]
|
| X2-DFN0806-3 X3-DFN0603-2 X1-DFN1212-3 X1-DFN1006- |
PACKAGE OUTLINE DIMENSIONS
|
Diodes Incorporated
|
| LLP75-6A06 |
Package Dimensions in mm (Inches)
|
Vishay Siliconix
|
| TSSOP-8PIN |
Package Dimensions 封装尺寸
|
International Rectifier, Corp.
|
| 081029131240 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029132558 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029132611 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 8DIP300 |
8-DIP-300 Package Dimensions
|
FAIRCHILD[Fairchild Semiconductor]
|
| RQ-16 |
16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches
|
Analog Devices
|
| 528-45AB |
Heat Sink; Package/Case:Half Brick; Body Material:Aluminum; Thermal Resistance:3.2 C/W; Color:Black; Size/Dimensions:0.450H x 2.240W x 2.280L"
|
Wakefield Thermal Solutions
|
