90143 pdf Datasheet P1 Part Num --- IC-ON-LINE


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90143 Datasheet PDF File

For 90143 Found Datasheets File :: 42+ Page :: | <1> | 2 | 3 | 4 | 5 |

					Molex Electronics Ltd.
Part No.	90143-0014
Description	2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 14 Circuits
File Size	250.10K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87901-438HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	90143-0028
Description	2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 28 Circuits
File Size	250.36K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87901-430
Description	BERGSTIK II .100CC DR-STRAIGHT
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	90143-0012
Description	2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 12 Circuits
File Size	250.10K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87901-432HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	90143-0008
Description	2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 8 Circuits
File Size	250.10K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87901-434HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	90143-0020
Description	2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 20 Circuits
File Size	250.10K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87901-436HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	90143-0022
Description	2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 22 Circuits
File Size	250.36K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	GSD090143HR
Description	Sd Card Connector, Push-push Type, 9 Position.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	90143-0024
Description	2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 24 Circuits
File Size	250.36K / 2 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	90143-0026
Description	2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 26 Circuits
File Size	250.36K / 2 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	90143-0036
Description	2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 36 Circuits
File Size	250.24K / 2 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	90143-0040
Description	2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 40 Circuits
File Size	250.24K / 2 Page	View it Online	Download Datasheet

For 90143 Found Datasheets File :: 42+ Page :: | <1> | 2 | 3 | 4 | 5 |

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