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GigaDevice
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| Part No. |
GD25Q128B
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| OCR Text |
..................... 18 7.8. q uad o utput f ast r ead (6b h) ............................................................................................................................. 19 7.9. d ual i/o f ast r ead (bbh)... |
| Description |
Dual and Quad Serial Flash
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| File Size |
1,074.25K /
44 Page |
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it Online |
Download Datasheet
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ELM
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| Part No. |
GD25Q128
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| OCR Text |
........................ 18 7.8. q uad o utput f ast r ead (6b h) ............................................................................................................................. 19 7.9. d ual i/o f ast r ead (bbh) ........... |
| Description |
Uniform sector dual and quad serial flash
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| File Size |
1,624.03K /
43 Page |
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it Online |
Download Datasheet |
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NXP Semiconductors
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| Part No. |
TFBGA100 LPC2364HBD100 LPC2364FET100 LPC2364FBD100 LPC2368FET100 LQFP100 LPC2368FBD100 LPC2365
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| OCR Text |
...0 lqfp100 plastic low profile q uad flat package; 100 leads; body 14 ? 14 ? 1.4 mm sot407-1 lpc2364hbd100 lqfp100 plastic low profile quad flat package; 100 leads; body 14 ? 14 ? 1.4 mm sot407-1 lpc2364fet100 tfbga100 plastic thin f... |
| Description |
ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC
ARM7 with 512 kB flash, 58 kB SRAM, Ethernet, USB 2.0 Device, CAN, SD/MMC, and 10-bit ADC
Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flashnull
Single-chip 16-bit/32-bit ocontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC
Single-chip 16-bit/32-bit ocontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC
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| File Size |
460.41K /
69 Page |
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it Online |
Download Datasheet |
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NXP Semiconductors N.V.
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| Part No. |
LPC2364FBD100
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| OCR Text |
...0 lqfp100 plastic low profile q uad flat package; 100 leads; body 14 ? 14 ? 1.4 mm sot407-1 lpc2364hbd100 lqfp100 plastic low profile quad flat package; 100 leads; body 14 ? 14 ? 1.4 mm sot407-1 lpc2364fet100 tfbga100 plastic thin f... |
| Description |
ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC LPC2364FBD100<SOT407-1 (LQFP100)|<<http://www.nxp.com/packages/SOT407-1.html<1<Always Pb-free,;
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| File Size |
423.17K /
69 Page |
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it Online |
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Hynix Semiconductor Inc.
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| Part No. |
HDM8513AT HDM8513AP
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| OCR Text |
............ 3 1 4.1 100 p in q uad f lat p ack ................................ ................................ ................................ ................................ 31 4.2 64 p in t hin q uad f lat p ack ................ |
| Description |
Darlington Bipolar Transistor; Power Dissipation:175W; Package/Case:TO-3; Mounting Type:Through Hole; Current Rating:20A; Voltage Rating:500V
Timer IC; Supply Voltage Max:16V; Package/Case:14-DIP; Current Rating:10A; Timer Type:Timer-Dual; Mounting Type:Through Hole
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| File Size |
277.99K /
67 Page |
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it Online |
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NXP Semiconductors N.V.
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| Part No. |
LPC2460FBD208 LPC2460FET208
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| OCR Text |
...8 lqfp208 plastic low profile q uad flat package; 208 leads; body 28 ? 28 ? 1.4 mm sot459-1 lpc2420fet208 tfbga208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 ? 15 ? 0.7 mm sot950-1 lpc2460fbd208 lqfp208 plas... |
| Description |
Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface
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| File Size |
582.56K /
87 Page |
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it Online |
Download Datasheet |
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Price and Availability
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