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For thickness Found Datasheets File :: 42040    Search Time::1.688ms    
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    MBR10120FP

Cystech Electonics Corp.
Part No. MBR10120FP
OCR Text ...n: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your...
Description 10Amp. Schottky Barrier Rectifiers

File Size 123.18K  /  4 Page

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    M62431FP M62431 M62431E

Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. M62431FP M62431 M62431E
OCR Text ...m X 70mm *copper pattern *board thickness : 1.6mm copper thickness: 18m *board material : Glass epoxy copper size : 0.25mm (width) X 25mm (length/lead) RELATIONSHIPS BETWEEN DATA AND CLOCK LATCH SIGNAL H DATA L D0 D1 D8 D9 D0" H CL...
Description 7-ELEMENT GRAPHIC EQUALIZER WITH MICROCOMPUTER INTERFACE
From old datasheet system

File Size 90.92K  /  7 Page

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    CYStech Electronics
Part No. HBNPZ1NS6R
OCR Text ... : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your...
Description General Purpose NPN PNP Epitaxial Planar Transistors(dual transistors)

File Size 234.98K  /  6 Page

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    BAR40AS3 BAR40S3 BAR40SS3 BAR40CS3

Cystech Electonics Corp.
Cystech Electonics Corp...
Part No. BAR40AS3 BAR40S3 BAR40SS3 BAR40CS3
OCR Text ...n: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your...
Description Small Signal Schottky (double) diodes

File Size 211.34K  /  6 Page

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    TPSA475K010R1400

AVX Corporation
Part No. TPSA475K010R1400
OCR Text ... b 0 of the pocket and the tape thickness, k, are dependent on the component size. tape materials do not affect component solderability during storage. carrier tape thickness <0.4mm. taping suffix table taj, tps, tpm, trj, trm, thj, taw, tl...
Description Tantalum and Niobium Oxide Capacitors

File Size 105.38K  /  5 Page

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    IS1-2981RH/PROTO 5962R0052001VVC 5962R0052001QVC IS-2.81RH IS-2981RH

Intersil Corporation
Intersil, Corp.
Part No. IS1-2981RH/PROTO 5962R0052001VVC 5962R0052001QVC IS-2.81RH IS-2981RH
OCR Text ...m x 5131m (105 mils x 202 mils) thickness: 483m 25.4m (19 mils 1 mil) INTERFACE MATERIALS Glassivation Type: Nitride (Si3N4) over Silox (SiO2) Nitride thickness: 4.0kA 1.0kA Silox thickness: 12.0kA 4.0kA Metallization Top Metal 2: Ti/Al...
Description 8-Channel Source Driver, Rad-Hard
Radiation Hardened 8-Channel Source Driver(抗辐通道源极驱动
Radiation Hardened 8-Channel Source Driver 8 CHANNEL, BUF OR INV BASED PRPHL DRVR, CDIP18

File Size 39.01K  /  2 Page

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    MTP3J15N3

Cystech Electonics Corp.
Cystech Electonics Corp...
Part No. MTP3J15N3
OCR Text ...n: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your...
Description 50V P-CHANNEL Enhancement Mode MOSFET

File Size 262.07K  /  8 Page

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    MTP1406M3

Cystech Electonics Corp.
Part No. MTP1406M3
OCR Text ...n: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your...
Description P-Channel Logic Level Enhancement Mode MOSFET

File Size 198.95K  /  5 Page

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    MTP1406L3

Cystech Electonics Corp.
Part No. MTP1406L3
OCR Text ...n: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act you...
Description P-Channel Enhancement Mode Power MOSFET

File Size 240.99K  /  8 Page

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    IS9-1715ARH/PROTO 5962F0052101VXC 5962F0052101QXC IS9-1715ARH-Q IS9-1715ARH-8 IS-1.15ARH IS-1715ARH

Intersil Corporation
Intersil, Corp.
Part No. IS9-1715ARH/PROTO 5962F0052101VXC 5962F0052101QXC IS9-1715ARH-Q IS9-1715ARH-8 IS-1.15ARH IS-1715ARH
OCR Text ...m x 4420m (129 mils x 174 mils) thickness: 483m 25.4m (19 mils 1 mil) INTERFACE MATERIALS Glassivation Type: Phosphorus Silicon Glass (PSG) thickness: 8.0kA 1.0kA Top Metallization Type: AlSiCu thickness: 16.0kA 2kA Substrate: Radiation...
Description Complementary Switch FET Driver, Rad-Hard
Radiation Hardened Complementary Switch FET Driver 3 A BUF OR INV BASED MOSFET DRIVER, CDFP16

File Size 27.96K  /  2 Page

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