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Amphenol Communications Solutions |
| Part No. |
77315-801-18LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77315-801-23LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 23 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77315-801-28LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 28 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77315-801-08LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0363 15-80-1501 0015801501
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77315-801-05LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 5 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0341 15-80-1061 0015801061
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77315-801-35LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0343 15-80-1101 0015801101
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.38K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77315-801-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0344 15-80-1121 0015801121
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77315-801-20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0346 15-80-1161 0015801161
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77315-801-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 10 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0348 15-80-1201 0015801201
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77315-801-32LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: T-113006 |
| Maker: N/A |
| Pack: N/A |
| Stock: 18 |
| Unit price
for : |
|
50: $1.99 |
|
100: $1.89 |
| 1000:
$1.79 |
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Email: oulindz@gmail.com |
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