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  stacked Datasheet PDF File

For stacked Found Datasheets File :: 2002    Search Time::0.906ms    
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    44170-0001 44170-0002 44170-0003 44170-0004 44170-0005 44170-0006

Molex Electronics Ltd.
Part No. 44170-0001 44170-0002 44170-0003 44170-0004 44170-0005 44170-0006
OCR Text ...placed on the PCB and the Molex stacked, multi-port jack can be resoldered to the board The plug latches are located at the top of the upper row providing easy thumb depression for mating and unmating Fully shielded housing features enhance...
Description Molex隆炉s New stacked Multi-port Modular Jack with Lightpipes Exceeds Category 5 Level Performance
Molex’s New stacked Multi-port Modular Jack with Lightpipes Exceeds Category 5 Level Performance

File Size 361.65K  /  2 Page

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    0760455003 760455003

Molex Electronics Ltd.
Part No. 0760455003 760455003
OCR Text ...tion: 0760455003 Active sfp_stacked_multiport_connectors Small Form-factor Pluggable Plus (SFP+) stacked 2-by-2 Multi-Port Connector with 2 Outer Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn) Tails Documents: 3D Model Draw...
Description Small Form-factor Pluggable Plus (SFP ) stacked 2-by-2 Multi-Port Connector with 2 Outer Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn) Tails

File Size 607.87K  /  6 Page

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    B32529C0103K B32529C0102K B32529C0472K B32529C0473K B32529D5225K B32529D0225K B32522C224K B32529C0474K

EPCOS
Part No. B32529C0103K B32529C0102K B32529C0472K B32529C0473K B32529D5225K B32529D0225K B32522C224K B32529C0474K
OCR Text ... terephthalate (polyester, pet) stacked-film technology for lead spacing 5 to 15 mm = code d or c in digit 7 of ordering code wound capacitor technology for lead spacing 10 to 27.5 mm = code n, q or t in digit 7 of ordering code plastic cas...
Description Film Capacitors Metallized Polyester Film Capacitors (MKT)

File Size 1,045.32K  /  31 Page

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    K4S1G0732BNBSP K4S1G0732B-TC75 K4S1G0732B

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S1G0732BNBSP K4S1G0732B-TC75 K4S1G0732B
OCR Text stacked 1Gb B-die (x8) CMOS SDRAM stacked 1Gb B-die SDRAM Specification Revision 1.1 February 2004 * Samsung Electronics reserves the right to change products or specification without notice. Rev. 1.1 February 2004 SDRAM s...
Description SDRAM stacked 1Gb B-die

File Size 124.59K  /  12 Page

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    Mitsubishi
Part No. M6MGB_T160S2BVP M6MGB E99003_A
OCR Text ...62,144-WORD BY 8-BIT) CMOS SRAM stacked-MCP (Multi Chip Package) MITSUBISHI LSIs DESCRIPTION FEATURES The MITSUBISHI M6MGB/T160S2BVP is a stacked Multi * Access time Chip Package (S-MCP) that contents 16M-bits flash memory Flash Memor...
Description 16,777,216-BIT (1,048,576 -WORD BY 16-BIT / 2,097,152-WORD BY 8-BIT) CMOS 3.3V-ONLY FLASH MEMORY
16,777,216-BIT (1,048,576 -WORD BY 16-BIT 2,097,152-WORD BY 8-BIT) CMOS 3.3V-ONLY FLASH MEMORY
From old datasheet system

File Size 255.86K  /  30 Page

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    Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. M6MGB_T160S4BVP M6MGB M6MGB160S4BVP M6MGT160S4BVP E99004_A
OCR Text ...24,288-WORD BY 8-BIT) CMOS SRAM stacked-MCP (Multi Chip Package) DESCRIPTION FEATURES The MITSUBISHI M6MGB/T160S4BVP is a stacked Multi * Access time Chip Package (S-MCP) that contents 16M-bits flash memory Flash Memory 90ns (Max.)...
Description 16,777,216-BIT (1,048,576 -WORD BY 16-BIT / 2,097,152-WORD BY 8-BIT) CMOS 3.3V-ONLY FLASH MEMORY
16,777,216-BIT CMOS 3.3V-ONLY FLASH MEMORY
CMOS 3.3V-ONLY FLASH MEMORY & CMOS SRAM stacked-MCP
From old datasheet system

File Size 254.76K  /  30 Page

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    Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. M6MGB_T162S2BVP M6MGB E99005_A M6MGB162S2BVP M6MGT162S2BVP
OCR Text stacked-MCP (Multi Chip Package) M6MGB/T162S2BVP MITSUBISHI LSIs DESCRIPTION FEATURES * Access time The MITSUBISHI M6MGB/T162S2BVP is a stacked Multi Flash Memory 90ns ( Max.) Chip Package (S-MCP) that contents 16M-bits flash...
Description 16,777,216-BIT (1,048,576 -WORD BY 16-BIT ) CMOS 3.3V-ONLY FLASH MEMORY
From old datasheet system

File Size 233.16K  /  29 Page

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    Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. M6MGB_T162S4BVP M6MGB M6MGB162S4BVP M6MGT162S4BVP E99006_A
OCR Text ...24,288-WORD BY 8-BIT) CMOS SRAM stacked-MCP (Multi Chip Package) MITSUBISHI LSIs DESCRIPTION FEATURES The MITSUBISHI M6MGB/T162S4BVP is a stacked Multi * Access time Chip Package (S-MCP) that contents 16M-bits flash memory Flash...
Description 16,777,216-BIT (1,048,576 -WORD BY 16-BIT ) CMOS 3.3V-ONLY FLASH MEMORY
16,777,216-BIT (1,048,576 -WORD BY 16-BIT) CMOS 3.3V-ONLY FLASH MEMORY
CMOS 3.3V-ONLY FLASH MEMORY & CMOS SRAM stacked-MCP
From old datasheet system

File Size 237.13K  /  29 Page

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    Mitsubishi
Part No. M6MGB_T166S2BWG M6MGB M6MGT166S2BWG E99007_A
OCR Text ...1,072-WORD BY 16-BIT) CMOS SRAM stacked-CSP (Chip Scale Package) DESCRIPTION The MITSUBISHI M6MGB/T166S2BWG is a stacked Chip Scale Package (S-CSP) that contents 16M-bits flash memory and 2M-bits Static RAM in a 72-pin S-CSP. 16M-bits Fl...
Description 16,777,216-BIT (1,048,576 -WORD BY 16-BIT ) CMOS 3.3V-ONLY FLASH MEMORY &
CMOS 3.3V-ONLY FLASH MEMORY & CMOS SRAM stacked-CSP
From old datasheet system

File Size 250.70K  /  30 Page

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    Mitsubishi
Part No. M6MGB_T166S4BWG M6MGB E99008_A
OCR Text ...2,144-WORD BY 16-BIT) CMOS SRAM stacked-CSP (Chip Scale Package) DESCRIPTION The MITSUBISHI M6MGB/T166S4BWG is a stacked Chip Scale Package (S-CSP) that contents 16M-bits flash memory and 4M-bits Static RAM in a 72-pin S-CSP. 16M-bits Fl...
Description 16,777,216-BIT (1,048,576 -WORD BY 16-BIT ) CMOS 3.3V-ONLY FLASH MEMORY
From old datasheet system

File Size 251.09K  /  30 Page

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