solder-bond technology pdf Datasheet P1 Description --- IC-ON-LINE


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solder-bond technology Datasheet PDF File

For solder-bond technology Found Datasheets File :: 150+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				Motorola Mobility Holdings, Inc.
Part No.	MPC603PFE220LX MPC603PFE240LX MPC603PFE233LX MPC603PFE180LX MPC603PFE200LX MPC603PFE166LX MPC603PFE160LX
Description	32-BIT, 220 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 32-BIT, 240 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 32-BIT, 233 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 32-BIT, 180 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 32-BIT, 200 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 32-BIT, 166 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 32-BIT, 160 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
File Size	165.40K / 40 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc.
Part No.	MPC603EFE100LX MPC603EFE133LX MPC603EEC
Description	MPC603e RISC Microprocessor Family PID6-603e Hardware Specification Advance Information 32-BIT, 133 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
File Size	156.09K / 32 Page	View it Online	Download Datasheet

				Cree, Inc Marktech Corporate
Part No.	C450UT190-0319-30 C460UT190-0319-30 C450UT190-0318-30 C460UT190-0318-30 C450UT190-SXXXX-30 C470UT190-SXXXX-30 CXXXUT190-SXXXX-30 C460UT190-SXXXX-30 C527UT190-SXXXX-30 C470UT190-0312-30 C450UT190-0312-30 C470UT190-0303-30 C470UT190-0302-30 C527UT190-0304-30 C470UT190-0305-30 C527UT190-0303-30 C450UT190-0317-30
Description	Small Chip 190 x 190 x 85 Single Wire Bond Structure Cree UltraThin Gen III LEDs Small Chip 190 x 190 x 85 Single Wire Bond Structure
File Size	188.80K / 6 Page	View it Online	Download Datasheet

				HOKURIKU ELECTRIC INDUSTRY CO.,LTD HOKURIKU ELECTRIC INDUS...
Part No.	CR16AU-103KV CR16AU-103NV CR16AU-103FB CR16AU-103MB CR16AU-103HB CR16AU-103MV CR16AU-103JV CR16AU-103KB UCR16AU-103FV CR16AU-103NB CR16AU-103HV CR16AU-103JB UCR16AU-103FB UCR16AU-103HB UCR16AU-103HV UCR16AU-103JB UCR16AU-103JV UCR16AU-103KB UCR16AU-103KV UCR16AU-103MB UCR16AU-103MV UCR16AU-103NB UCR16AU-103NV CR16AU103FV CR16AU103JV
Description	Wire-bond Purpose Chip Resistor
File Size	146.96K / 1 Page	View it Online	Download Datasheet

For solder-bond technology Found Datasheets File :: 150+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |