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Amphenol Communications Solutions |
Part No. |
54122-109161650LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-809161600LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-809161650LF
|
Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68691-616
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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Part No. |
PCF85103C-2P/0011
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Description |
256 x 8-bit CMOS EEPROM with I2C-bus interface; Package: SOT97-1 (DIP8); Container: Tube 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8
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File Size |
140.22K /
20 Page |
View
it Online |
Download Datasheet |
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Bom2Buy.com
Price and Availability
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