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    IGC11T120T6L

Infineon Technologies AG
Part No. IGC11T120T6L
OCR Text ...assembly 2 ) not subject to production test - verified by design/characteriza tion static characteristics (tested on wafer ) , t j =25 c value parameter symbol conditions min. typ. max. unit collector - e ...
Description IGBT4 Low Power Chip

File Size 72.16K  /  5 Page

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    IGC109T120T6RM

Infineon Technologies AG
Part No. IGC109T120T6RM
OCR Text ...assembly 2 ) not subject to production t est - verified by design/characterization static characteristics (tested on wafer ) , t j =25 c value parameter symbol conditions min. typ. max. unit collector - e ...
Description IGBT4 Medium Power Chip

File Size 66.09K  /  5 Page

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    IGC109T120T6RL

Infineon Technologies AG
Part No. IGC109T120T6RL
OCR Text ...assembly 2 ) not subject to production test - verified by design/characterization static characteristics (tested on wafer ) , t j =25 c value parameter symbol conditions min. typ. max. unit collector - e m...
Description IGBT4 Low Power Chip

File Size 66.64K  /  5 Page

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    Samsung Electronic
Part No. S3F49FAX
OCR Text ...amsung. s3f49fax is under mass production. (x means a version number for firmware and hardware revision) 1.2 s3f49fax controller features 1.2.1 features ? pc card-ata / true ide / compactf lash compatible host interface. ? ecc fu...
Description S3F49FAX CompactFlash/USB Controller

File Size 127.16K  /  21 Page

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    BTS118D

Infineon Technologies A...
INFINEON[Infineon Technologies AG]
Part No. BTS118D
OCR Text ... be limited. IN 2not subject to production test, specified by design 3V Loaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 4 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70m thick) cop...
Description Smart Lowside Power Switch

File Size 331.57K  /  10 Page

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