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    290656-002

Intel Corporation
Part No. 290656-002
OCR Text ...28 3.2.1. pci bus configuration mechanism ................................................................... 28 3.2.2. logical pci bus #0 configuration mechanism.................................................. 29 3.2.3. primary pci (pci0...
Description Intel 82810/82810-DC100 Graphics and Memory Controller Hub (GMCH)

File Size 519.50K  /  120 Page

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    HY27UH088G2M HY27UH088GDM

Hynix Semiconductor
Part No. HY27UH088G2M HY27UH088GDM
OCR Text ... OTP/Unique ID area, Block Lock mechanism, Automatic Read at Power Up, Read ID2 extension. The HYNIX HY27UH088G(2/D)M series is available in 48 - TSOP1 12 x 20 mm, 52-TLGA 12 x 17mm. 1.1 Product List PART NUMBER HY27UH088G(2/D)M ORIZATI...
Description 8G-Bit NAND Flash Memory

File Size 461.58K  /  53 Page

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    Hirose Electric USA, INC.
HIROSE[Hirose Electric]
Part No. SX4BA-168S-1.27DSD SX4AB-168S-1.27DSA SX4AB-168S-1.27DSH SX4BA-168S-1.27DSA
OCR Text ...ertion in Module Board The key mechanism prevents mis-insertion in the module board. 6. Prevents Displacement of Module Board The structure to sustain the module board on both sides prevents displacement of the module board. 7. Easy...
Description 1.27mm Pitch 8Byte DIMM Socket

File Size 142.09K  /  6 Page

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    HY27US08281A HY27US08282A HY27US16281A HY27US16282A

Hynix Semiconductor
Part No. HY27US08281A HY27US08282A HY27US16281A HY27US16282A
OCR Text ... OTP/Unique ID area, Block Lock mechanism, Automatic Read at Power Up, Read ID2 extension. The Hynix HY27US(08/16)281A series is available in 48 - TSOP1 12 x 20 mm, 48 - USOP1 12 x 17 mm. 1.1 Product List PART NUMBER HY27US08281A HY27US...
Description 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Memory

File Size 342.72K  /  44 Page

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    INFINEON[Infineon Technologies AG]
Part No. SLE7736M3 SLE7736-V3M3 SLE7736E-V3C SLE7736 SLE7736-BDC SLE7736-BDM3 SLE7736-BD-V3C SLE7736-BD-V3M3 SLE7736C SLE7736E-BDC SLE7736E-BDM3 SLE7736E-BD-V3C SLE7736E-BD-V3M3 SLE7736EC SLE7736EM3 SLE7736E-V3M3 SLE7736-V3C
OCR Text ...y Authentication and Card-Trash mechanism Short Product Information December 2001 SLE 7736/36E Short Product Information Revision History: Previous Releases: Page Subjects (changes since last revision) Current Version 2001-12-21 ...
Description Security & Chip Card ICs
Security & Chip Card ICs 安全
2MB FLASH W/ECC, 3 CANS 安全
MPC5565MZP132 EVALUATION 安全

File Size 155.39K  /  8 Page

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Part No. AXL226901
OCR Text ...+105 c features 1. simple lock mechanism provided. a simple lock mechanism is used for box type. it can be used where there is light vibration or shock. also, the socket is a one-touch insertion and removal type. 2. incorrect insertion ...
Description 26 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 180.37K  /  4 Page

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    K9F5608D0C K9F5608D0C-D K9F5608D0C-H K9F5608D0C-P K9F5608D0C-Y K9F5616U0C-Y K9F5608Q0C K9F5608Q0C-D K9F5608Q0C-H K9F5608

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9F5608D0C K9F5608D0C-D K9F5608D0C-H K9F5608D0C-P K9F5608D0C-Y K9F5616U0C-Y K9F5608Q0C K9F5608Q0C-D K9F5608Q0C-H K9F5608U0C K9F5608U0C-D K9F5608U0C-F K9F5608U0C-H K9F5608U0C-P K9F5608U0C-V K9F5608U0C-Y K9F5616D0C K9F5616D0C-D K9F5616D0C-H K9F5616D0C-P K9F5616D0C-Y K9F5616Q0C K9F5616Q0C-D K9F5616Q0C-H K9F5616U0C K9F5616U0C-D K9F5616U0C-H K9F5616U0C-P K9F5616Q0C-HCB0 K9F5616Q0C-DCB0 K9F5616Q0C-DIB0 K9F5616Q0C-HIB0
OCR Text ...n' leave it N.C. Not using LOCK mechanism & POWER-ON AUTOt READ, connect it Vss.(Before) --> Not using LOCK mechanism & POWER-ON AUTO-READ, connect it Vss or leave it N.C(After) 2. 2.65V device is added. 3.Note is added. (VIL can undershoot...
Description 32M x 8 Bit / 16M x 16 Bit NAND Flash Memory
512Mb/256Mb 1.8V NAND Flash Errata
32M x 8 Bit , 16M x 16 Bit NAND Flash Memory

File Size 679.73K  /  42 Page

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    TB2904HQ

Toshiba Semiconductor
Part No. TB2904HQ
OCR Text ... 6 Application and Detection mechanism Threshold level (RS1) (+) Amp output VCC/2 Threshold level (RS2) GND t Voltage of point (A) GND t Voltage of point (B) GND RS2 t Figure 7 Wave Form 5 2004-03-26 TB2904H...
Description Maximum Power 43 W BTL 4-ch Audio Power IC
MAXIMUM POWER 43 W BTL X 4-CH AUDIO POWER IC

File Size 270.16K  /  16 Page

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    HY27UG084G2M HY27UG084G2D HY27UG084GDM

Hynix Semiconductor
Part No. HY27UG084G2M HY27UG084G2D HY27UG084GDM
OCR Text ... OTP/Unique ID area, Block Lock mechanism, Automatic Read at Power Up, Read ID2 extension. The HYNIX HY27UG(08/16)4G(2/D)M series is available in 48 - TSOP1 12 x 20 mm, 52-ULGA 12 x 17 mm. 1.1 Product List PART NUMBER HY27UG084G(2/D)M H...
Description (HY27UGxx Series) 2G-Bit NAND Flash

File Size 466.48K  /  53 Page

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    RG82845M 82845MZ 82845MP 82845MX

Intel Corporation
Part No. RG82845M 82845MZ 82845MP 82845MX
OCR Text ... Standard PCI Bus Configuration mechanism................................................................ 36 Routing Configuration Accesses ................................................................................... 37 3.3.1. PCI Bu...
Description Intel 845 Family Chipset-Mobile 82845MP/82845MZ Chipset Memory Controller Hub Mobile (MCH-M)

File Size 1,367.14K  /  157 Page

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