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  L60-3015-0001-B Datasheet PDF File

For L60-3015-0001-B Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

   
Part No. L60-3049-0510-C L61-3049-0510-B L61-9002-0820-A L61-3047-0001-B L61-3020-1000-A L60-3022-0001-C L61-3022-0001-A L60-3020-2700-A L60-3008-0680-A L61-3008-0680-B L60-3015-0001-B L60-3015-0000-A L60-3015-0330-A
Description SINGLE COLOR LED
DUAL COLOR LED
File Size 77.22K  /  1 Page

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Rochester Electronics LLC
Part No. CA3015
Description CA3015 - Operational Amplifier; General Purpose
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    Zarlink
Part No. ZL60001
Description High speed 2.5 Gbps 850nm VCSEL
From old datasheet system
File Size 325.95K  /  6 Page

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Rochester Electronics LLC
Part No. CA3015A/B
Description CA3015A - Operational Amplifier; General Purpose
Tech specs 　 　

Official Product Page

    K4G323222A-QC/L45 K4G323222A-QC/L50 K4G323222A-QC/L70 K4G323222A-QC/L60 K4G323222A-QC/L7C K4G323222A-PC/L45 K4G323222A-P

Samsung Electronic
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4G323222A-QC/L45 K4G323222A-QC/L50 K4G323222A-QC/L70 K4G323222A-QC/L60 K4G323222A-QC/L7C K4G323222A-PC/L45 K4G323222A-PC/L50 K4G323222A-PC/L60 K4G323222A-PC/L70 K4G323222A-PC/L7C
Description 512K x 32Bit x 2 Banks Synchronous Graphic RAM Data Sheet
32Mbit SGRAM 32兆SGRAM
File Size 1,129.22K  /  49 Page

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Amphenol Communications Solutions
Part No. 10129381-940001BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    K4S640832K K4S641632K K4S641632K-T K4S640832K-T_UC_L75 K4S641632K-T_UC_L50 K4S641632K-T_UC_L60 K4S641632K-TUC_L50 K4S641

SAMSUNG[Samsung semiconductor]
Part No. K4S640832K K4S641632K K4S641632K-T K4S640832K-T_UC_L75 K4S641632K-T_UC_L50 K4S641632K-T_UC_L60 K4S641632K-TUC_L50 K4S641632K-TUC_L60 K4S641632K-TUC_L75 K4S640832K-TUC_L75 K4S641632K-TUC/L50 K4S641632K-TUC/L60 K4S640832K-TUC/L75 K4S641632K-TUC/L75
Description 64Mb K-die SDRAM
File Size 211.60K  /  14 Page

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Amphenol Communications Solutions
Part No. 10129380-910001BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    K4S641632C-TC/L10 K4S641632C-TC/L1H K4S641632C-TC/L1L K4S641632C-TC/L60 K4S641632C-TC/L70 K4S641632C-TC/L75 K4S641632C-T

SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4S641632C-TC/L10 K4S641632C-TC/L1H K4S641632C-TC/L1L K4S641632C-TC/L60 K4S641632C-TC/L70 K4S641632C-TC/L75 K4S641632C-TC/L80
Description 1M x 16Bit x 4 Banks Synchronous DRAM
File Size 1,162.23K  /  42 Page

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Amphenol Communications Solutions
Part No. 10129383-920001BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Zarlink Semiconductor
Part No. ZL60001TBD
Description High speed 2.5 Gbps 850 nm VCSEL.
File Size 425.87K  /  5 Page

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Amphenol Communications Solutions
Part No. 10129381-950001BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    ZARLINK[Zarlink Semiconductor Inc]
Part No. ZL60001TBD ZL60001
Description High speed 2.5 Gbps 850 nm VCSEL
File Size 410.86K  /  5 Page

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Amphenol Communications Solutions
Part No. 10129379-920001BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    ACTR3015_303.875_QCC4A ACTR3015 ACTR3015/303.875/QCC4A

Advanced Crystal Technology
Part No. ACTR3015_303.875_QCC4A ACTR3015 ACTR3015/303.875/QCC4A
Description true one-port, surface-acoustic-wave (SAW) resonator
File Size 57.42K  /  3 Page

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Amphenol Communications Solutions
Part No. 10129382-910001BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 10 Positions, 2.54mm Pitch, 5.84mm (0.23inch) Mating, 3.05mm (0.12inch) Tail
Tech specs 　 　

Official Product Page

    K4S281632K-UC_L50 K4S281632K-UC_L60 K4S280832K-UC_L75 K4S281632K-UC/L50 K4S281632K-UC/L60 K4S280832K-UC/L75 K4S281632K-U

Samsung semiconductor
Part No. K4S281632K-UC_L50 K4S281632K-UC_L60 K4S280832K-UC_L75 K4S281632K-UC/L50 K4S281632K-UC/L60 K4S280832K-UC/L75 K4S281632K-UC/L75
Description 128Mb K-die SDRAM Specification
File Size 237.10K  /  15 Page

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Amphenol Communications Solutions
Part No. 10129381-910001BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

   
Part No. ATL60 ATLS60/225 ATL60/435 ATLS60/80 ATL60/550 ATL60/235 ATLS60/208 ATLS60/160 ATL60/85 ATL60/60 ATLS60/144
Description FPGA
ATL60 [Updated 11/99. 15 Pages] The ATL60 series CMOS Gate Arrays are fabricated using a 0.6 micron drawn gate. oxide isolated. triple level metal process. Extensive cell libraries are available and support the major CAD software tools.
From old datasheet system
File Size 103.35K  /  14 Page

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Amphenol Communications Solutions
Part No. 10129382-920001BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 20 Positions, 2.54mm Pitch, 5.84mm (0.23inch) Mating, 3.05mm (0.12inch) Tail
Tech specs 　 　

Official Product Page

For L60-3015-0001-B Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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