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For impregnated Found Datasheets File :: 721 Search Time::4.047ms
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				Hittite Microwave Corporati... HITTITE[Hittite Microwave Corporation]
Part No.	HMC468LP3
OCR Text	...LDED PLASTIC SILICA AND SILICON impregnated. 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY 3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 6. PAD BURR...
Description	1 dB LSB GaAs MMIC 3-BIT DIGITAL POSITIVE CONTROL ATTENUATOR, DC - 6.0 GHz
File Size	204.15K / 6 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC469MS8G
OCR Text	...LDED PLASTIC SILICA AND SILICON impregnated. 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY 3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER S...
Description	SiGe HBT DUAL CHANNEL GAIN BLOCK MMIC AMPLIFIER, DC - 5.0 GHz
File Size	303.35K / 8 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC471MS8G
OCR Text	...LDED PLASTIC SILICA AND SILICON impregnated. 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY 3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER S...
Description	SiGe HBT DUAL CHANNEL GAIN BLOCK MMIC AMPLIFIER, DC - 5.0 GHz
File Size	307.38K / 8 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC481MP86
OCR Text	...LDED PLASTIC SILICA AND SILICON impregnated. 2. LEADFRAME MATERIAL: COPPER ALLOY 3. LEADFRAME PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. ALL GROUND LEADS M...
Description	SiGe HBT GAIN BLOCK MMIC AMPLIFIER/ DC - 5.0 GHz SiGe HBT GAIN BLOCK MMIC AMPLIFIER, DC - 5.0 GHz
File Size	199.17K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC485MS8G
OCR Text	...LDED PLASTIC SILICA AND SILICON impregnated. 2. LEAD MATERIAL: COPPER ALLOY 3 LEAD PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOL...
Description	HIGH IP3 GaAs MMIC MIXER with INTEGRATED LO AMPLIFIER, 1.7 - 2.2 GHz
File Size	245.67K / 8 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC488MS8G
OCR Text	...LDED PLASTIC SILICA AND SILICON impregnated. 2. LEAD MATERIAL: COPPER ALLOY 3 LEAD PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOL...
Description	GaAs MMIC MIXER W/ INTEGRATED LO AMPLIFIER/ 4.0 - 7.0 GHz GaAs MMIC MIXER W/ INTEGRATED LO AMPLIFIER, 4.0 - 7.0 GHz
File Size	193.37K / 6 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC491LP3
OCR Text	...LDED PLASTIC SILICA AND SILICON impregnated. 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY 3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 6. PAD BURR...
Description	GaAs MMIC LOW NOISE AMPLIFIER w/ BYPASS MODE/ 3.4 - 3.8 GHz GaAs MMIC LOW NOISE AMPLIFIER w/ BYPASS MODE, 3.4 - 3.8 GHz
File Size	226.21K / 8 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC492LP3
OCR Text	...LDED PLASTIC SILICA AND SILICON impregnated. 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY 3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 6. PAD BURR...
Description	SMT GaAs HBT MMIC DIVIDE-BY-2/ DC - 18 GHz SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 18 GHz
File Size	249.62K / 6 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC493LP3
OCR Text	...LDED PLASTIC SILICA AND SILICON impregnated. 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY 3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 6. PAD BURR...
Description	SMT GaAs HBT MMIC DIVIDE-BY-4/ DC - 18 GHz SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 18 GHz
File Size	246.34K / 6 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC506LP4
OCR Text	...LDED PLASTIC SILICA AND SILICON impregnated. 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY 3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 6. PAD BURR...
Description	MMIC VCO w/ BUFFER AMPLIFIER, 7.8 - 8.7 GHz From old datasheet system
File Size	252.05K / 6 Page	View it Online	Download Datasheet

For impregnated Found Datasheets File :: 721 Search Time::4.047ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |