Part Number Hot Search : 
2RS2120G C100EP 425F3XEM C3509 LC865632 MC101 SI3452 75N03
Product Description
Full Text Search
  hollow Datasheet PDF File

For hollow Found Datasheets File :: 441    Search Time::1.156ms    
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    GL5ZV302BOS

Sharp Corporation
Sharp Electrionic Components
Part No. GL5ZV302BOS
OCR Text ... Test items Chapped the surface hollow tbe surface judgement criteria The surface chapped is striking for see the lamp top Tbe surface hollow is striking for see the lamp top classifica of defec Minor defect DG996028 MODEL No. Jlld16/...
Description Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; Number of Contacts:16; Connector Shell Size:20; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle
DEVICE SPECIFICATION FOR Light Emitting Diode

File Size 616.53K  /  11 Page

View it Online

Download Datasheet





    MULTI CONTACT AG
Part No. 66.9649-26
OCR Text .... l?tanschluss . stackabl e?4mm hollow plugs for self- assembly of test leads. nickel-plated and gold- plated versions available. solder connection . fiches creuse s?4mm reprise arrire, desti - nes la confection de cordons de mesure. dispo...
Description INTERCONNECTION DEVICE

File Size 394.03K  /  7 Page

View it Online

Download Datasheet

    GL5ZS302BOS

Sharp Corporation
Sharp Electrionic Components
Part No. GL5ZS302BOS
OCR Text ...5 Test items Chappedthe surface hollow the surface I judgementcriteria The surfacechappedis striking for seethe lamp top The surfacehollow is striking for seethe lamp top classiticaof defec Minor defect DG996029 MODEL No. Jun/16/99 P...
Description DEVICE SPECIFICATION FOR Light Emitting Diode

File Size 610.78K  /  11 Page

View it Online

Download Datasheet

    BLW60 BLW60C

NXP Semiconductors
Philips Semiconductors
Part No. BLW60 BLW60C
OCR Text ...onnections are made by means of hollow rivets, whilst under the emitter leads Cu straps are used for a direct contact between upper and lower sheets. Fig.8 Component layout and printed-circuit board for 175 MHz class-B test circuit. M...
Description VHF power transistor

File Size 79.09K  /  15 Page

View it Online

Download Datasheet

    BLU20_12 BLU20/12

Philips Semiconductors
Part No. BLU20_12 BLU20/12
OCR Text .... Earth connections are made by hollow rivets and also by copper straps under the emitters and around the board to provide a direct contact between the copper on the component side and the ground plane. Dimensions in mm. Fig.8 Component ...
Description UHF power transistor

File Size 56.57K  /  11 Page

View it Online

Download Datasheet

    BLU45_12 BLU45/12

Philips Semiconductors
Part No. BLU45_12 BLU45/12
OCR Text ...ions are made by fixing screws, hollow rivets and copper straps around the board and under the bases to provide a direct contact between the copper on the component side and the ground plane. Fig.6 Printed circuit board and component lay...
Description UHF power transistor

File Size 54.86K  /  10 Page

View it Online

Download Datasheet

    BLU60_12 BLU60 BLU60-12 BLU60/12

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BLU60_12 BLU60 BLU60-12 BLU60/12
OCR Text ...ions are made by fixing screws, hollow rivets and copper straps around the board and under the bases to provide a direct contact between the copper on the component side and the ground plane. Fig.6 Printed circuit board and component lay...
Description From old datasheet system
UHF power transistor
CONNECTOR ACCESSORY

File Size 54.77K  /  10 Page

View it Online

Download Datasheet

    BLU97

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BLU97
OCR Text .... Earth connections are made by hollow rivets and also by copper straps under the emitters. Fig.8 Printed circuit board and component lay-out for 470 MHz class-B test circuit. August 1986 7 Philips Semiconductors Product spec...
Description UHF power transistor

File Size 54.90K  /  11 Page

View it Online

Download Datasheet

    BLV11

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BLV11
OCR Text ...onnections are made by means of hollow rivets, whilst under the emitter leads Cu straps are used for a direct contact between upper and lower sheets. August 1986 7 Philips Semiconductors Product specification VHF power transi...
Description VHF power transistor

File Size 81.82K  /  11 Page

View it Online

Download Datasheet

    BLV45_12 BLV45 BLV45-12 BLV45/12

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BLV45_12 BLV45 BLV45-12 BLV45/12
OCR Text .... Earth connections are made by hollow rivets and additionally by fixing screws and copper straps under the emitters to provide a direct contact between the copper of the component side and the ground plane. August 1986 6 Philips S...
Description VHF power transistor
From old datasheet system

File Size 60.31K  /  10 Page

View it Online

Download Datasheet

For hollow Found Datasheets File :: 441    Search Time::1.156ms    
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

▲Up To Search▲

 




Price and Availability




 
Price & Availability of hollow

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
1.3897619247437