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  HM15-21000LF Datasheet PDF File

For HM15-21000LF Found Datasheets File :: 68+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 |   

    BITECH[Bi technologies]
Part No. HM15-10330LF HM15-21000LF HM15 HM15-10150LF HM15-10220LF HM15-10470LF HM15-10680LF HM15-10820LF HM15-11000LF HM15-20150LF HM15-20220LF HM15-20330LF HM15-20470LF HM15-20680LF HM15-20820LF
Description Encapsulated Low Power Inductors

File Size 312.54K  /  1 Page

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Amphenol Communications Solutions

Part No. 10133343-21000LF
Description HPCE CTB VT HEADER 8LP with latch and screw
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HM1500

HUMIREL[Humirel]
Part No. HM1500
Description RELATIVE HUMIDITY MODULE

File Size 107.31K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-110021000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HM1520

Humirel
Part No. HM1520
Description RELATIVE HUMIDITY MODULE

File Size 77.73K  /  4 Page

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Amphenol Communications Solutions

Part No. 10137807-21000LF
Description HPCE CTB R/A HEADER 4HP8S
Tech specs    

Official Product Page

    HM1520

Humirel
Part No. HM1520
Description    RELATIVE HUMIDITY MODULE

File Size 76.09K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127417-21000LF
Description HPCE CTB VT HEADER 16HP
Tech specs    

Official Product Page

    HHM1506-15

TDK Electronics
Part No. HHM1506-15
Description Multilayer Balun

File Size 67.88K  /  6 Page

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Amphenol Communications Solutions

Part No. 54121-103121000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HHM1517

TDK Corporation
TDK Electronics
Part No. HHM1517
Description For Bluetooth & IEEE802.11b/g
MULTILAYER BALUN SPECIFICATION

File Size 46.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-403021000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HHM1521-15

TDK Electronics
Part No. HHM1521-15
Description Multilayer Balun

File Size 67.34K  /  6 Page

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Amphenol Communications Solutions

Part No. 54121-806021000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HHM1525

TDK Electronics
Part No. HHM1525
Description Multilayer Chip Baluns For DCS-PCS/Tx & Rx

File Size 38.67K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-110221000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 22 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    HHM1517-15

TDK Electronics
Part No. HHM1517-15
Description Multilayer Balun

File Size 67.71K  /  6 Page

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Amphenol Communications Solutions

Part No. 10156612-1000LF
Description Minitek® Board-In, Wire to Board Connectors, Right Angle housing 2.00mm 10 positions
Tech specs    

Official Product Page

    HHM1545

TDK Electronics
Part No. HHM1545
Description Multilayer Balun

File Size 66.99K  /  6 Page

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Amphenol Communications Solutions

Part No. 54112-111121000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For HM15-21000LF Found Datasheets File :: 68+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 |   

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