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Panasonic
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| Part No. |
ERX12LJ33M ERX12LJ39MP ERX1LJ33MP ERX2LJ33ME ERX12LJ27ME
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| OCR Text |
...olerance resistance value forming & taping matrix code v p e we straight lead wire type axial paping type (straight lead) cut & forming type radial taping type (e type) radial taping type (we type) forming / packaging the ?rst t... |
| Description |
Leaded Metal Film Resistors/Low Resistance Value
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| File Size |
228.71K /
7 Page |
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it Online |
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Everlight Electronics C...
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| Part No. |
EALP03SXDYA0-AM
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| OCR Text |
...recautions for use 1. lead forming ? during lead formation , the leads should be bent at a point at least 3mm from the base of the epoxy bu lb. ? lead forming should be done before soldering. ? avoid stressing the led ... |
| Description |
High Flux Output.
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| File Size |
388.00K /
16 Page |
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it Online |
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Everlight Electronics C...
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| Part No. |
EALP03SXBYA0-AM
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| OCR Text |
...r notice. notes 1. lead forming ? during lead formation , the leads should be bent at a point at least 3mm from the base of the epoxy bulb. ? lead forming should be done before soldering. ? avoid stressing the led p... |
| Description |
Low profile.
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| File Size |
499.20K /
15 Page |
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it Online |
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Everlight Electronics C...
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| Part No. |
EALP03SXAYA0-AM
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| OCR Text |
...cas . com notes 1. lead forming ? during lead formation , the leads should be bent at a point at least 3mm from the base of the epoxy bulb. ? lead forming should be done before soldering. ? avoid stressing the led p... |
| Description |
Colorless clear resin.
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| File Size |
480.78K /
14 Page |
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it Online |
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Everlight Electronics C...
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| Part No. |
EALP00SXBYA0-AM
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| OCR Text |
...r notice. notes 1. lead forming ? during lead formation , the leads should be bent at a point at least 3mm from the base of the epoxy bulb. ? lead forming sho uld be done before soldering. ? avoid stressing the led ... |
| Description |
P-LED
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| File Size |
526.60K /
15 Page |
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it Online |
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Lite-On Technology Corp...
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| Part No. |
LTL-4251N-072A
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| OCR Text |
...r ming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering, at norm... |
| Description |
Through Hole Lamp
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| File Size |
615.88K /
12 Page |
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it Online |
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Lite-On Technology Corp...
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| Part No. |
LTW-87HD4B
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| OCR Text |
... leds if necessary. 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the leadframe as a fulcrum duri ng forming. lead forming must be d... |
| Description |
Lead (Pb) free product - RoHS compliant
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| File Size |
153.16K /
9 Page |
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it Online |
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Lite-On Technology Corp...
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| Part No. |
LTL1CHKEK-071A
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| OCR Text |
...he leds if necessary. 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming mus... |
| Description |
Through Hole Lamp
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| File Size |
527.80K /
12 Page |
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it Online |
Download Datasheet |
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Lite-On Technology Corp...
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| Part No. |
LTL1CHKEK-002
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| OCR Text |
...e leds if necessary. 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must ... |
| Description |
Through Hole Lamp
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| File Size |
465.51K /
12 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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