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				PANASONIC[Panasonic Semiconductor]
Part No.	AN8819 AN8819NFB
OCR Text	... BSEL I Pin switching the dry cell and charger battery for battery voltage detection circuit 30k 70k 9 7.8k 10 9.9k 10 VSEN I Battery voltage detection input pin for battery voltage detection circuit 7k ...
Description	4Ch. Linear Driver IC DC-DC Converter Control for CD
File Size	114.84K / 11 Page	View it Online	Download Datasheet

				VISAY[Vishay Siliconix]
Part No.	LH1520AAC LH1520AACTR LH1520AB
OCR Text	...olation voltage (S1 to S2) 1), (dry air, dust free, at sea level) Output power dissipation (continuous) 1) 2) Test condition IR 10 A IL 50 A Symbol IF VR VL IL IL Value 50 8.0 350 150 110 2) Unit mA V V mA mA t = 100 ms ...
Description	Dual 1 Form A Solid State Relay
File Size	210.94K / 8 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	PCA1673 PCA1673U PCA1672 PCA1672U PCA1675 PCA1675U PCA1676 PCA1676U/10 PCA1677 PCA1677U
OCR Text	...0 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering PCA167x series Wave soldering techniques can be used for all SO packages if the following condition...
Description	32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
File Size	69.26K / 12 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	SAA3323 SAA3323GP SAA3323H
OCR Text	...ring it is recommended that the dry Packing instructions in the "Quality Reference Pocketbook" are followed. The pocketbook can be ordered using the code 9398 510 34011. May 1994 2 Philips Semiconductors Preliminary specificatio...
Description	Drive processor for DCC systems
File Size	263.07K / 56 Page	View it Online	Download Datasheet

				TOSHIBA[Toshiba Semiconductor]
Part No.	TMP93CF77F TMP95CS54F TMP96C141BF TMP91C016F TMP91C025F TMP91C219F TMP91C815F TMP91C824F TMP91C829F TMP91CU10F TMP91CW11F TMP91CW12AF TMP91CW12F TMP91CW18AF TMP91CY22F TMP91PW10F TMP91PW11F TMP91PW12F TMP91PW18AF TMP95C061BF TMP94C251AF TMP95CS64F TMP95CS66F TMP95CW64F TMP95CW65F TMP95PW64F TMP95C265F TMP95PS54F TMP93CM40F TMP93CT76F TMP93PS40DF TMP93PS40F TMP93PS42AF TMP93PS44F TMP93CU44DF TMP93C071F TMP96PM40F TMP96CM40F TMP96C031ZF TMP93CS32F TMP93CW40DF TMP93CW41DF TMP93CW44DF TMP93CW46AF TMP93CW76F TMP93CS20F TMP93CF76F TMP96C041BF TMP93CW40D TMP94C241CF TMP95C063F TMP93CS45F TMP93PW44ADF TMP95FW54AF TMP93PW20AF TMP93PW40DF TMP93PW46AF TMP95C001F TMP95CU54AF TMP95CW54AF TMP95FY64F TMP93PW32F TMP91FY22F TMP93PW76F TMP91FY12AF TMP93CS40DF TMP93CS40F TMP93CS41DF TMP93CS41F TMP93CS42AF TMP93CS44F TMP93CU76F TMP94FU81F
OCR Text	...oof) 2.1.1 Precaution for dry Pack Figure 2.2 shows the tray type of the dry pack form. Precaution for handling dry pack products are as follows. x Do not toss or drop to avoid damaging the devices and/or the moisture proof bag. y ...
Description	Quality And Reliability Assurance / Handling Precautions
File Size	369.80K / 48 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	CGY2010G CGY2011G
OCR Text	...0 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging...
Description	GSM 4 W power amplifiers
File Size	73.43K / 12 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors
Part No.	CGY2013G CGY2013GC1
OCR Text	...0 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging...
Description	GSM 4 W power amplifier
File Size	86.11K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	CGY2021G
OCR Text	...0 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging...
Description	DCS/PCS 2 W power amplifier
File Size	72.33K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	CGY2030M
OCR Text	...0 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging...
Description	DECT 500 mW power amplifier
File Size	93.24K / 12 Page	View it Online	Download Datasheet

				PANASONIC[Panasonic Semiconductor]
Part No.	MA2YD15
OCR Text	...) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be re...
Description	Schottky Barrier Diodes (SBD)
File Size	60.18K / 3 Page	View it Online	Download Datasheet

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