|
|
|
Toshiba Electronic Devices & Storage Corporation |
Part No. |
TLP2701
|
Description |
Photocoupler (photo-IC output), 5000 Vrms, 4pin SO6L
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Toshiba Electronic Devices & Storage Corporation |
Part No. |
74HC4053FT
|
Description |
CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Toshiba Electronic Devices & Storage Corporation |
Part No. |
74HC4051FT
|
Description |
CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Toshiba Electronic Devices & Storage Corporation |
Part No. |
TCKE800NA
|
Description |
eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Auto-retry, WSON10B
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Toshiba Electronic Devices & Storage Corporation |
Part No. |
TCKE800NL
|
Description |
eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Latch, WSON10B
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Molex Electronics Ltd.
|
Part No. |
0436500802 3.00MM (.118) PITCH MICRO-FIT 3.0 HEADER, SURFACE MOUNT COMPATIBLE, SINGLE ROW,RIGHT ANGLE, WITH SNAP-IN PLASTIC PEG PCB LOCK, 8 CIRCUITS, 0.76ΜM (30Μ) GOLD (AU) SELECTIVE PLATING, GLOW WIRE COMPATIBLE 3.00MM (.118) PITCH MICRO-FIT 3.0 HEADER, SURFACE MOUNT COMPATIBLE, SINGLE ROW,RIGHT ANGLE, WITH SNAP-IN PLASTIC PEG PCB LOCK, 8 CIRCUITS, 0.76ΜM (30Μ) GOLD (AU) SELECTIVE PLATING, GLOW WIRE COMPATIBLE 3.00MM (.118) PITCH MICRO-FIT 3.0 HEADER, SURFACE MOUNT COMPATIBLE, SINGLE ROW,RIGHT ANGLE, WITH SNAP-IN PLASTIC PEG PCB LOCK, 8 CIRCUITS, 0.76ΜM (30Μ) GOLD (AU) SELECTIVE PLATING, GLOW WIRE COMPATIBLE 3.00MM (.118) PITCH MICRO-FIT 3.0 HEADER, SURFACE MOUNT COMPATIBLE, SINGLE ROW,RIGHT ANGLE, WITH SNAP-IN PLASTIC PEG PCB LOCK, 8 CIRCUITS, 0.76ΜM (30Μ) GOLD (AU) SELECTIVE PLATING, GLOW WIRE COMPATIBLE 3.00MM (.118) PITCH MICRO-FIT 3.0 HEADER, SURFACE MOUNT COMPATIBLE, SINGLE ROW,RIGHT ANGLE, WITH SNAP-IN PLASTIC PEG PCB LOCK, 8 CIRCUITS, 0.76ΜM (30Μ) GOLD (AU) SELECTIVE PLATING, GLOW WIRE COMPATIBLE 3.00MM (.118) PITCH MICRO-FIT 3.0 HEADER, SURFACE MOUNT COMPATIBLE, SINGLE ROW,RIGHT ANGLE, WITH SNAP-IN PLASTIC PEG PCB LOCK, 8 CIRCUITS, 0.76ΜM (30Μ) GOLD (AU) SELEC
|
Description |
3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Right Angle, with Snap-in Plastic Peg PCB Lock, 8 CIRCUITs, 0.76μm (30μ) Gold (Au) Selective Plating, Glow Wire Compatible
|
File Size |
161.64K /
3 Page |
View
it Online |
Download Datasheet |
|
|
|
Toshiba Electronic Devices & Storage Corporation |
Part No. |
TCKE812NL
|
Description |
eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Latch, Fixed Over Voltage Clamp, WSON10B
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Toshiba Electronic Devices & Storage Corporation |
Part No. |
TCKE712BNL
|
Description |
eFuse IC (electronic Fuse), 4.4 to 13.2 V, 3.65 A, Latch, Adjustable Over Voltage Protection, WSON10
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Toshiba Electronic Devices & Storage Corporation |
Part No. |
TCTH022BE
|
Description |
Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type / FLAG signal latch function
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Toshiba Electronic Devices & Storage Corporation |
Part No. |
TCTH021BE
|
Description |
Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Toshiba Electronic Devices & Storage Corporation |
Part No. |
TCTH011AE
|
Description |
Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type
|
Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
Part: CIRSA38301 |
Maker: CIRSA |
Pack: DIP40 |
Stock: 237 |
Unit price
for : |
50: $7.38 |
100: $7.02 |
1000:
$6.65 |
Email: oulindz@gmail.com |
Contact us |
|
|