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For bumped Found Datasheets File :: 609 Search Time::1.562ms
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				STMicroelectronics
Part No.	TN0280
OCR Text	...k is delivered only in sawn and bumped wafers. table 6. delivery form delivery form lri2k lri1k unsawn wafer yes 180 m sawn and bumped wafer yes yes mlp 2x3 yes tn0280 revision history doc id 17392 rev 1 11/12 8 revision history ...
Description	Migrating from the LRI2K to the LRI1K RFID IC
File Size	57.02K / 12 Page	View it Online	Download Datasheet

				ST Microelectronics
Part No.	STE2004DIE2
OCR Text	...s part numbers type ste2004die1 bumped wafers ste2004die2 bumped dice on waffle pack 102 x 65 single chip lcd controller / driver figure 1. block diagram column drivers row drivers data latches 65 x 102 ram display control logic scroll logi...
Description	102 X 65 SINGLE CHIP LCD CONTROLLER/DRIVER
File Size	578.60K / 66 Page	View it Online	Download Datasheet

				ST Microelectronics
Part No.	STE2002DIE2
OCR Text	...ontroller. type ordering number bumped wafers ste2002die1 bumped dice on waffle pack ste2002die2 81 x 128 single chip lcd controller / driver figure 1. block diagram column drivers row drivers data latches 104 x 128 ram display control logi...
Description	81 X 128 SINGLE CHIP LCD CONTROLLER/DRIVER
File Size	495.95K / 51 Page	View it Online	Download Datasheet

				Clare Inc CLARE[Clare, Inc.]
Part No.	MXED102
OCR Text	...o 35 MHz clock frequency * Gold-bumped Die @ 60 micron Output Pitch * TCP packaging * Companion to Clare Micronix MXED202 128-Channel OLED Row Driver Column Driver Block Diagram Description The MXED102 is Clare's second-generation OLED colu...
Description	240-Channel OLED Column Driver
File Size	3,765.61K / 20 Page	View it Online	Download Datasheet

				System Logic Semiconduc...
Part No.	SL20T0081
OCR Text	... 110 42 to 44, 47 to 49 120 m bumped pad size (bottom) 2 to 10, 94 to 102, 148 to 281 37 92 104 to 146, 283 to 325 92 37 11 to 41, 45, 46, 50 to 93 57 92 42 to 44, 47 to 49 67 92 1, 103, 147, 282 72 97 all pad bumped pad height 18 tab...
Description	SLS System Logic Semiconductor
File Size	203.65K / 56 Page	View it Online	Download Datasheet

				Electronic Theatre Controls, Inc.
Part No.	UC1602I
OCR Text	... pp: packaging gu: gold bumped, face up gd: gold bumped, face down f n : type n tcp film part number memory drivers mux rate supported versions uc1602i 65 x 102 65 com x 102 seg 1/65, 1/49 g ...
Description	65x102 Matrix LCD Controller-Driver
File Size	719.66K / 38 Page	View it Online	Download Datasheet

				Aeroflex, Inc. Aeroflex Inc. AEROFLEX[Aeroflex Circuit Technology]
Part No.	ACT4444 4444
OCR Text	...rer Miniature Chipscale Package bumped Chip CarrierTM (BCC++) NOTE: BCC++ and bumped Chip Carrier are Trademarks of Fujitsu Ltd. GENERAL DESCRIPTION The Aeroflex Laboratories transceiver model ACT4444 is a monolithic transceiver whic...
Description	Transceiver for MIL-STD-1553 /MACAIR in a Chipscale Package 收发器的MIL - STD - 1553在芯片级封装MACAIR
File Size	209.03K / 10 Page	View it Online	Download Datasheet

				SLS[System Logic Semiconductor]
Part No.	SL20T0081
OCR Text	...8 to 281 104 to 146, 283 to 325 bumped PAD size (Bottom) 11 to 41, 45, 46, 50 to 93 42 to 44, 47 to 49 1, 103, 147, 282 bumped PAD height Figure 2. Align Key Coordination COG Align Key Coordination 30m 30m 30m 30m 30m 30m Size Y 3000 60...
Description	SLS System Logic Semiconductor
File Size	186.00K / 56 Page	View it Online	Download Datasheet

				Analog Devices
Part No.	ADG3304 ADG3308 AD5820 AD58012 AD5805 AD5806 AD6548 AD9948AD9949 ADAU1301 AD5821 AD58202 ADM8834 ADG819 ADG787 ADL5500 ADL55001
OCR Text	...sed between the reel. 3 for bumped die or wlcsp packages, see table 2. orientation for these devices is as per eia783 ( bumps facing bottom of carrier cavity; pin 1 towards sprocket holes ) . 4 standard thickness for lfcsp is 0.85 ...
Description	Tape and Reel Packaging Tape and Reel Packaging
File Size	429.20K / 6 Page	View it Online	Download Datasheet

For bumped Found Datasheets File :: 609 Search Time::1.562ms
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