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  bga-5 Datasheet PDF File

For bga-5 Found Datasheets File :: 8727    Search Time::1.875ms    
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    LTM2881CV-5-PBF LTM2881IV-5-PBF LTM2881CV-3-PBF LTM2881CY-3-PBF LTM2881CY-5-PBF LTM2881IV-3-PBF LTM2881IY-3-PBF LTM2881I

Linear Technology
Part No. LTM2881CV-5-PBF LTM2881IV-5-PBF LTM2881CV-3-PBF LTM2881CY-3-PBF LTM2881CY-5-PBF LTM2881IV-3-PBF LTM2881IY-3-PBF LTM2881IY-5-PBF LTM288110 LTM2881
OCR Text ... 11.25mm x 2.8mm) Surface Mount BGA and LGA Packages applicaTions n n n Isolated RS485/RS422 Interface Industrial Networks Breaking R...5) 100mA (LTM2881-3) DI 1V/DIV 1V/DIV RO 50ns/DIV 2881 TA01a 2881fa LTM2881 ab...
Description Complete Isolated RS485/RS422 楼矛Module Transceiver Power
Complete Isolated RS485/RS422 渭Module Transceiver Power
Complete Isolated RS485/RS422 μModule Transceiver Power

File Size 452.87K  /  22 Page

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    LTM2882CV-5-PBF LTM2882IV-5-PBF LTM2882CV-3-PBF LTM2882CY-3-PBF LTM2882CY-5-PBF LTM2882IV-3-PBF LTM2882 LTM2882IY-5-PBF

Linear Technology
Part No. LTM2882CV-5-PBF LTM2882IV-5-PBF LTM2882CV-3-PBF LTM2882CY-3-PBF LTM2882CY-5-PBF LTM2882IV-3-PBF LTM2882 LTM2882IY-5-PBF LTM2882IY-3-PBF
OCR Text ... 11.25mm x 2.8mm) Surface Mount BGA and LGA Packages APPLICATIONS n n n n Isolated RS232 Interface Industrial Communication Test and ...5) VL OFF ON ON ISOLATION BARRIER DIN T1IN R1OUT T2IN R2OUT GND GND2 2882 TA01a 1Mbps Operation ...
Description Dual Isolated RS232 楼矛Module Transceiver Power
Dual Isolated RS232 渭Module Transceiver Power
Dual Isolated RS232 μModule Transceiver Power
   Dual Isolated RS232 μModule Transceiver Power

File Size 286.16K  /  18 Page

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    BRILLIANCE SEMICONDUCTOR, Inc.
CLEARLOGIC
Part No. CL7256AETC144-5 CL7256AFC256-10 CL7256AETI100-7 CL7256AEFI256-7 CL7256AQC208-10 CL7256AQC208-12 CL7256ATI144-10 CL7256AETI144-7 CL7256AQC208-7 CL7256AQC208-5 CL7256AQC208-6 CL7256AQC208-4 CL7256AETC100-7
OCR Text ...4-pin tqfp 100-pin tqfp 100-pin bga 208-pin pqfp 100-pin bga 144-pin tqfp 256-pin bga 144-pin tqfp 208-pin pqfp 256-pin bga 7ka tbl 01a pack...5,000 usable gates - 256 macrocells - 164 maximum user i/o pins u laser fuse technology provides ver...
Description Electrically-Erasable Complex PLD 电可擦除复杂可编程逻辑器件
Laser processed logic device

File Size 178.61K  /  16 Page

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    Cypress Semiconductor, Corp.
Part No. IBM0418A81DLAB-5 IBM0418A81DLAB-4 IBM0418A81DLAB-3 IBM0436A81DLAB-3F IBM0436A41DLAB-3F IBM0418A41DLAB-3F IBM0418A41DLAB-5
OCR Text ...(128Kx36 & 256Kx18) SRAM x36 BGA Pinout (Top View) 1 A B C D E F G H J K L M N P R T U V DDQ NC NC DQ23 DQ20 VDDQ DQ18 DQ25 VDDQ DQ34 DQ...5 SA SA SA VSS VSS VSS SBWb VSS V REF VSS SBWa VSS VSS VSS M2* SA TDO 6 SA NC,SA(8Mb) SA DQ10 DQ12 D...
Description x36 Fast Synchronous SRAM
x18 Fast Synchronous SRAM x18快速同步SRAM

File Size 203.06K  /  25 Page

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    1-2007614-5

Tyco Electronics
Part No. 1-2007614-5
OCR Text BGA Differential Connector System 1. 1.1. SCOPE Content This specification covers performance, tests and quality requirements for the STEP-...5. Test Requirements and Procedures Summary Test Description Initial examination of product. Require...
Description STEP-Z Mezzanine Connectors; STEP-Z 15MM PLUG 200P ( AMP )

File Size 95.47K  /  8 Page

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    HITACHI[Hitachi Semiconductor]
Part No. HM62G36256BP-5 HM62G36256 HM62G36256BP-4
OCR Text ...is packaged in standard 119bump BGA. Note: All power supply and ground pins must be connected for proper operation of the device. Features * * * * * * * * * * * * * Power supply: 3.3 V +10%, -5% Clock frequency: 200 MHz to 250 MHz Inter...
Description 8M Synchronous Fast Static RAM(256k-word x 36-bit)

File Size 135.29K  /  24 Page

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    SONY[Sony Corporation]
Part No. CXK79M36C162GB-5 CXK79M36C162GB CXK79M36C162GB-33 CXK79M36C162GB-4
OCR Text ...with the JEDEC-standard 209 pin BGA package pinout defined for SigmaRAMTM devices. It integrates input registers, high speed RAM, output reg...5. 300 MHz operation (600 Mbps) is obtained from a single 1.8V power supply. JTAG boundary scan inte...
Description From old datasheet system
18Mb 1x2Lp HSTL High Speed Synchronous SRAMs (512Kb x 36)

File Size 208.15K  /  25 Page

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    Sony, Corp.
Part No. CXK79M36C162GB-5
OCR Text ...with the jedec-standard 209 pin bga package pinout defined for sigmaram ? devices. it integrates input registers, high speed ram, output reg...5. 300 mhz operation (600 mbps) is obtained from a single 1.8v power supply. jtag boundary scan inte...
Description 18Mb 1x2Lp HSTL High Speed Synchronous SRAMs (512Kb x 36) 35.7 1x2Lp HSTL高速(512KB的36同步静态存储器

File Size 213.08K  /  25 Page

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    5-1542003-1

Tyco Electronics
Part No. 5-1542003-1
OCR Text ...FICATION OF MAXIMUM LOAD ON THE BGA PACKAGE. 3 1 4-LEG CLIP SIZE: 25mm HEATSINK TORQUE SPECIFICATIONS CONVERTED TO FORCE. BARE DIE PACKAGE: 1.5 POUND-FORCE INCH TORQUE = 8.5 POUND-FORCE (0.17 NEWTON TORQUE = 37.81 NEWTON) 2.0 PO...
Description Heat Sink Assemblies; HTS593-U=25MM HS ASSY ULTEM CL ( Tyco Electronics )

File Size 24.21K  /  1 Page

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    4-1542007-5

Tyco Electronics
Part No. 4-1542007-5
OCR Text ...FICATION OF MAXIMUM LOAD ON THE BGA PACKAGE. HEATSINK TORQUE SPECIFICATIONS CONVERTED TO FORCE. BARE DIE PACKAGE: 1.5 POUND-FORCE INCH TORQUE = 7.5 POUND-FORCE (0.17 NEWTON TORQUE = 33.36 NEWTON) C 2.0 POUND-FORCE INCH TORQUE = 10.0 P...
Description Heat Sink Assemblies; 35MM HS ASS'Y ULTEM CLIP ( Tyco Electronics )

File Size 23.32K  /  1 Page

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