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adhesive Datasheet PDF File

For adhesive Found Datasheets File :: 5060 Search Time::2.625ms
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				LIGITEK electronics co., ltd.
Part No.	LG2041-TRF-X
OCR Text	...ge Thickness Feed Hole Location adhesive Tape Width adhesive Tape Position Tape Width ------------------------------------------------------------- H1 20.2 17.125 20.0 26.0 24.0 21.0 H2 L P P1 P2 T W0 W1 W2 W3 ------- W0 12....
Description	TAPE AND REEL TYPE LED LAMPS
File Size	137.10K / 8 Page	View it Online	Download Datasheet

				Continental Device India Limited
Part No.	MPSL01
OCR Text	...re shall be no exposure of adhesive. 4. no more than 3 consecutive missing components are permitted. 5. a tape trailer, having at least three feed holes are required after the last component. 6. splices shall not interfere w ith the...
Description	NPN SILICON PLANAR EPITAXIAL TRANSISTOR
File Size	85.18K / 3 Page	View it Online	Download Datasheet

				LIGITEK electronics co., ltd.
Part No.	LG3330-PF-TRF-X
OCR Text	...ge Thickness Feed Hole Location adhesive Tape Width adhesive Tape Position Tape Width ------------------------------------------------------------- H1 20.2 17.125 20.0 26.0 24.0 21.0 H2 L P P1 P2 T W0 W1 W2 W3 ------- W0 12....
Description	TAPE AND REEL TYPE LED LAMPS
File Size	148.86K / 8 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	PCA1673 PCA1673U PCA1672 PCA1672U PCA1675 PCA1675U PCA1676 PCA1676U/10 PCA1677 PCA1677U
OCR Text	...must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maxi...
Description	32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
File Size	69.26K / 12 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors
Part No.	CGY2013G CGY2013GC1
OCR Text	...must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maxi...
Description	GSM 4 W power amplifier
File Size	86.11K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	CGY2030M
OCR Text	...must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maxi...
Description	DECT 500 mW power amplifier
File Size	93.24K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	CGY2032BTS
OCR Text	...must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activa...
Description	DECT 500 mW power amplifier(DECT 500 mW 功率放大
File Size	61.06K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors Philips Semiconductors
Part No.	CGY2032TS
OCR Text	...must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activa...
Description	DECT 500 mW power amplifier
File Size	60.20K / 12 Page	View it Online	Download Datasheet

				LIGITEK electronics co., ltd.
Part No.	LG3331-PF-TRF-X
OCR Text	...ge Thickness Feed Hole Location adhesive Tape Width adhesive Tape Position Tape Width ------------------------------------------------------------- H1 20.2 17.125 20.0 26.0 24.0 21.0 H2 L P P1 P2 T W0 W1 W2 W3 ------- W0 12....
Description	TAPE AND REEL TYPE LED LAMPS
File Size	135.15K / 8 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	ILX524KA ILX524
OCR Text	...N 29N 0.9Nm Ceramic portion (1) adhesive (2) (3) (4) , b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on th...
Description	2700 pixel X 3 line CCD Linear Sensor (Color)
File Size	118.47K / 11 Page	View it Online	Download Datasheet

For adhesive Found Datasheets File :: 5060 Search Time::2.625ms
Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |