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  90143-0114 Datasheet PDF File

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    0901430114 90143-0114

Molex Electronics Ltd.
Part No. 0901430114 90143-0114
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 14 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 14 Circuits
File Size 250.45K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    90143-0014

Molex Electronics Ltd.
Part No. 90143-0014
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 14 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-430
Description BERGSTIK II .100CC DR-STRAIGHT
Tech specs 　 　

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    90143-0022

Molex Electronics Ltd.
Part No. 90143-0022
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 22 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0050

Molex Electronics Ltd.
Part No. 90143-0050
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 50 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0056

Molex Electronics Ltd.
Part No. 90143-0056
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 56 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0040

Molex Electronics Ltd.
Part No. 90143-0040
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 40 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. GSD090143HR
Description Sd Card Connector, Push-push Type, 9 Position.
Tech specs 　 　

Official Product Page

    90143-0036

Molex Electronics Ltd.
Part No. 90143-0036
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 36 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs 　 　

Official Product Page

    90143-0060

Molex Electronics Ltd.
Part No. 90143-0060
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 60 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    90143-0028

Molex Electronics Ltd.
Part No. 90143-0028
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 28 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    90143-0064

Molex Electronics Ltd.
Part No. 90143-0064
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 64 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs 　 　

Official Product Page

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