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1N3156A 4VHC1G 2PT61 MMC4027 SXXXXC PC810 WM8758B A1209
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  90136-1108 Datasheet PDF File

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    0901361108 90136-1108

Molex Electronics Ltd.
Part No. 0901361108 90136-1108
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2222

Molex Electronics Ltd.
Part No. 90136-2222
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 162.01K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2102

Molex Electronics Ltd.
Part No. 90136-2102
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-2132

Molex Electronics Ltd.
Part No. 90136-2132
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MB110805022HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black.
Tech specs    

Official Product Page

    90136-2122

Molex Electronics Ltd.
Part No. 90136-2122
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 22 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MC110802022HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black.
Tech specs    

Official Product Page

    90136-2310

Molex Electronics Ltd.
Part No. 90136-2310
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.44K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MC110805022HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 7.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black.
Tech specs    

Official Product Page

    90136-1210

Molex Electronics Ltd.
Part No. 90136-1210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68771-108HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2318

Molex Electronics Ltd.
Part No. 90136-2318
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.34K  /  5 Page

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Amphenol Communications Solutions

Part No. 85854-1108LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body, 4 Mod.
Tech specs    

Official Product Page

    90136-2315

Molex Electronics Ltd.
Part No. 90136-2315
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 15 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.34K  /  5 Page

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Amphenol Communications Solutions

Part No. 54121-108141700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-1212

Molex Electronics Ltd.
Part No. 90136-1212
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114829-11108LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 8 Positions
Tech specs    

Official Product Page

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