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Renesas Electronics Corporation |
Part No. |
PS2503-1-A
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Description |
Low Input Current, , /
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
RJK5031DPD-00#J2
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Description |
Nch Single Power Mosfet 500V 3A 3200Mohm Mp-3A/To-252
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
SLG55031VTR
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Description |
High Voltage Gate Driver
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10137785-031231LF
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Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Black Color, 3 Positions, GW Compatible, with Post, Tray packing.
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Tech specs |
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Official Product Page
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http:// Molex Electronics Ltd.
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Part No. |
0879331007 87933-1007
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Description |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05μm (2μ) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05渭m (2渭) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
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File Size |
344.32K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
10137785-031132LF
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Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 3 Positions, GW Compatible, without Post, Tray packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
76350-310-24LF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 24 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
86503-116HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
86503-138HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
86503-158HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
DDR503122007K
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Description |
DDR5 Memory Module Sockets,Vertical, Surface Mount, 288 Position, 0.85mm (0.0335in) pitch, 30u\\ Gold on Contact Area, Standard Housing and Latch, Metal Tab, Without MYLAR.
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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