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  87835-2442 Datasheet PDF File

For 87835-2442 Found Datasheets File :: 130+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

    87835-2442 0878352442

Molex Electronics Ltd.
Part No. 87835-2442 0878352442
Description 2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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Amphenol Communications Solutions

Part No. 61083-124422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87835-5042

Molex Electronics Ltd.
Part No. 87835-5042
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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Amphenol Communications Solutions

Part No. L17H2442120
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 15/15 (Socket/Socket), 0.76m (30 in) Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 2*Arrowhead Boardlock
Tech specs    

Official Product Page

    87835-3442

Molex Electronics Ltd.
Part No. 87835-3442
Description 2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating,
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

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Amphenol Communications Solutions

Part No. 68024-429HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

    87835-1042

Molex Electronics Ltd.
Part No. 87835-1042
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 106.32K  /  3 Page

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Amphenol Communications Solutions

Part No. 68602-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87835-1043

Molex Electronics Ltd.
Part No. 87835-1043
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 93.15K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-124-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 42 Positions
Tech specs    

Official Product Page

    87835-1442

Molex Electronics Ltd.
Part No. 87835-1442
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 106.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 68024-424HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

    87835-5043

Molex Electronics Ltd.
Part No. 87835-5043
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 92.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 68024-421HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

    List of Unclassifed Man...
Part No. 24428
Description METRIC STANDOFFS AND SPACERS

File Size 74.65K  /  1 Page

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Amphenol Communications Solutions

Part No. 68024-427HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

    0878352642 87835-2642

Molex Electronics Ltd.
Part No. 0878352642 87835-2642
Description 2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 106.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 87052-442HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    0878350842 87835-0842

Molex Electronics Ltd.
Part No. 0878350842 87835-0842
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 8 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating

File Size 106.48K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-824-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 42 Positions
Tech specs    

Official Product Page

For 87835-2442 Found Datasheets File :: 130+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

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