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  87834-6021 Datasheet PDF File

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    87834-6021 0878346021

Molex Electronics Ltd.
Part No. 87834-6021 0878346021
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 10118615-936021LF
Description BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 36 Positions ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Molex, Inc.
Part No. 87834-3041
Description CGrid Hdr W/Pg/Slt 1PdNiAuLF 30Ckt 30 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 94.65K  /  1 Page

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Amphenol Communications Solutions

Part No. 68602-102HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 2 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87834-4092

Molex Electronics Ltd.
Part No. 87834-4092
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Plating, End Windows

File Size 100.59K  /  3 Page

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Amphenol Communications Solutions

Part No. 68602-138HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87834-4093

Molex Electronics Ltd.
Part No. 87834-4093
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.76μm (30μ) Gold (Au) Plating, End Windows

File Size 100.60K  /  3 Page

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Amphenol Communications Solutions

Part No. 68602-160HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87834-4021

Molex Electronics Ltd.
Part No. 87834-4021
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 59112-T36-02-115LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 4 Positions.
Tech specs    

Official Product Page

    87834-3011

Molex Electronics Ltd.
Part No. 87834-3011
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 30 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 10145226-0211P13LF
Description DDR4 DIMM, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
Tech specs    

Official Product Page

    87834-3041

Molex Electronics Ltd.
Part No. 87834-3041
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. RJE031660210H
Description Modular Jack - Right Angle, Input Output Connectors 6P6C, Without Shield, Without Panel Stop, High Temperature.
Tech specs    

Official Product Page

    87834-3019

Molex Electronics Ltd.
Part No. 87834-3019
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 30 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.08K  /  3 Page

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Amphenol Communications Solutions

Part No. RJE291660210
Description Modular Jacks, Input Output Connectors, 6P6C, RA, Without Shield.
Tech specs    

Official Product Page

    87834-1419

Molex Electronics Ltd.
Part No. 87834-1419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 14 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 10145226-0212N13LF
Description DDR4 Memory Module Sockets, Storage and Server System, Vertical, Through Hole, 288 Position, 0.85mm (0.033in) pitch.
Tech specs    

Official Product Page

    87834-4045

Molex Electronics Ltd.
Part No. 87834-4045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 10136656-0212LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 2 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

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