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  87797-0602 Datasheet PDF File

For 87797-0602 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0877970602 87797-0602

Molex Electronics Ltd.
Part No. 0877970602 87797-0602
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, 25.60mm (1.043) Stacking Height

File Size 249.03K  /  4 Page

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Texas Instruments

Part No. M38510/30602B2A
Description 4-Bit Parallel-Access Shift Registers 20-LCCC -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87797-0010

Molex Electronics Ltd.
Part No. 87797-0010
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging

File Size 113.24K  /  3 Page

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Texas Instruments

Part No. LMZ30602RKGR
Description 2.95V to 6V, 2A Step-Down Power Module in 9x11x2.8mm QFN Package 39-B1QFN -40 to 85
Tech specs    

Official Product Page

    87797-1200

Molex Electronics Ltd.
Part No. 87797-1200
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, 8.00mm (.315) Stacking Height

File Size 248.24K  /  4 Page

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Texas Instruments

Part No. JM38510/30602B2A
Description 4-Bit Parallel-Access Shift Registers 20-LCCC -55 to 125
Tech specs    

Official Product Page

    87797-1800 0877971800

Molex Electronics Ltd.
Part No. 87797-1800 0877971800
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging

File Size 247.98K  /  4 Page

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Texas Instruments

Part No. JM38510/30602BEA
Description 4-Bit Parallel-Access Shift Registers 16-CDIP -55 to 125
Tech specs    

Official Product Page

    Rabbit Semiconductor
Part No. 101-0602
Description
File Size 1,898.59K  /  4 Page

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Texas Instruments

Part No. 5962L0620602V9A
Description Dual, High Precision, Rail-to-Rail Output Operational Amplifier 0-DIESALE -55 to 125
Tech specs    

Official Product Page

    VI-40602

Varitronix international limited
Part No. VI-40602
Description REMARKS: N.C = NO CONNECTION PCB LINKAGE - PIN1 & PIN2

File Size 30.85K  /  1 Page

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Texas Instruments

Part No. LMZ30602RKGT
Description 2.95V to 6V, 2A Step-Down Power Module in 9x11x2.8mm QFN Package 39-B1QFN -40 to 85
Tech specs    

Get Free Sample

Official Product Page

    Samsung Electronics
Part No. SMF-06020
Description Power Optimized GaAs FET

File Size 127.56K  /  3 Page

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Texas Instruments

Part No. M38510/30602BEA
Description 4-Bit Parallel-Access Shift Registers 16-CDIP -55 to 125
Tech specs    

Official Product Page

    ACR-0602-2193

Applied Concepts Inc.
Part No. ACR-0602-2193
Description DUAL BANK LED RAIL

File Size 252.84K  /  2 Page

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Texas Instruments

Part No. V62/05606-02XE
Description Enhanced Product 8-Bit Universal Bus Transceiver And Two 1-Bit Bus Transceivers 48-TSSOP -55 to 125
Tech specs    

Get Free Sample

Official Product Page

    ACR-0602-1897

Applied Concepts Inc.
Part No. ACR-0602-1897
Description DUAL BANK LED RAIL

File Size 329.36K  /  2 Page

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Texas Instruments

Part No. 5962L0620602VZA
Description Dual, High Precision, Rail-to-Rail Output Operational Amplifier 10-CFP -55 to 125
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. SMF-06020
Description Power Optimized GaAs FET

File Size 71.24K  /  3 Page

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Amphenol Communications Solutions

Part No. 68779-706HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For 87797-0602 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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