| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
70246-3404 0702463404
|
| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating
|
| File Size |
176.00K /
4 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
68046-340LF
|
| Description |
Dubox®, Board to Board connector, PCB Mounted Receptacle, Vertical, Surface Mount, Dual Entry, Double Row, 80 position, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
70246-3402 0702463402
|
| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
| File Size |
175.78K /
4 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
54242-125463400LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 46 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
70246-3401 0702463401
|
| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
| File Size |
175.77K /
4 Page |
View
it Online |
Download Datasheet
|
|

Bom2Buy.com

Price and Availability
|