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  44428-0606 Datasheet PDF File

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    44428-0606 0444280606

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Molex Electronics Ltd.
Part No. 44428-0606 0444280606
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 232.70K  /  4 Page

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Texas Instruments

Part No. V62/10606-01XE
Description Enhanced Product Quad Channel, 3/1, 1Mbps, Digital Isolator 16-SOIC -55 to 125
Tech specs    

Get Free Sample

Official Product Page

HUA FENG CIRCUIT





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Part No. SD-44428-001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap

File Size 232.70K  /  4 Page

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Texas Instruments

Part No. V62/20606-01EX
Description Enhanced product, low-power, analog temperature sensor
Tech specs    

Official Product Page

    http://
Part No. SD-44428-001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg

File Size 232.70K  /  4 Page

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Texas Instruments

Part No. JM38510/50606BRA
Description Low-Power High-Performance Impact PAL Circuits 20-CDIP -55 to 125
Tech specs    

Official Product Page

    44428-1405

Molex Electronics Ltd.
Part No. 44428-1405
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 14 Circuits, 0.38μm (15μ)Gold (Au) Selective Plating

File Size 232.70K  /  4 Page

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Texas Instruments

Part No. M38510/50606BRA
Description Low-Power High-Performance Impact PAL Circuits 20-CDIP -55 to 125
Tech specs    

Official Product Page

    44428-1203

Molex Electronics Ltd.
Part No. 44428-1203
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 232.75K  /  4 Page

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Texas Instruments

Part No. LMZ30606RKGT
Description 2.95V to 6V, 6A Step-Down Power Module in 9x11x2.8mm QFN Package 39-B1QFN -40 to 85
Tech specs    

Get Free Sample

Official Product Page

    44428-2206

Molex Electronics Ltd.
Part No. 44428-2206
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, DualRow, Right Angle, without Snap-in Plastic Peg PCB Lock, 22 Circuits, 0.76μm (30μ)

File Size 232.70K  /  4 Page

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Texas Instruments

Part No. LMZ30606RKGR
Description 2.95V to 6V, 6A Step-Down Power Module in 9x11x2.8mm QFN Package 39-B1QFN -40 to 85
Tech specs    

Official Product Page

    44428-2402

Molex Electronics Ltd.
Part No. 44428-2402
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in

File Size 232.70K  /  4 Page

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Texas Instruments

Part No. V62/20606-01EX-T
Description Enhanced product, low-power, analog temperature sensor
Tech specs    

Official Product Page

    44428-1204

Molex Electronics Ltd.
Part No. 44428-1204
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 12 Circuits, Tin (Sn) Plating

File Size 232.66K  /  4 Page

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    44428-2205

Molex Electronics Ltd.
Part No. 44428-2205
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle

File Size 232.70K  /  4 Page

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    44428-2204

Molex Electronics Ltd.
Part No. 44428-2204
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 22 Circuits, Tin (Sn) Plating

File Size 232.66K  /  4 Page

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Download Datasheet

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