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  32000 Datasheet PDF File

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    KM23C32000CET

Samsung Semiconductor
Part No. KM23C32000CET
Description 32M-Bit (4Mx8 / 2Mx16) CMOS Mask ROM

File Size 81.46K  /  4 Page

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Texas Instruments

Part No. BQ32000DR
Description Serial RTC with Battery Backup and Trickle Charge 8-SOIC -40 to 85
Tech specs    

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HUA FENG CIRCUIT





    KMM53632000CK

Samsung Semiconductor
Part No. KMM53632000CK
Description 32MB X 36 DRAM Simm Using 16MB X 4 & 16MB X 1

File Size 414.90K  /  20 Page

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Texas Instruments

Part No. BQ32000D
Description Serial RTC with Battery Backup and Trickle Charge 8-SOIC -40 to 85
Tech specs    

Official Product Page

    KMM53632000BK

Samsung Semiconductor
Part No. KMM53632000BK
Description 32MBx36 DRAM Simm Using 16MBx4 & 16MBx1

File Size 377.48K  /  18 Page

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Texas Instruments

Part No. 5962-9320001QXA
Description 16-Bit Transparent D-type Latches With 3-State Outputs 48-CFP -55 to 125
Tech specs    

Official Product Page

    Infineon
Part No. HYS72T32000HU-3.7-A HYS72T32000HU-5-A
Description 256MB - 2GB, 240pin

File Size 638.44K  /  40 Page

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Renesas Electronics Corporation

Part No. 84132-000
Description 4Kx4 SRAM
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. KMM53232000BV
Description 32M x 32 DRAM SIMM(32M x 32 动RAM模块)

File Size 357.48K  /  19 Page

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Renesas Electronics Corporation

Part No. 7MB6320-000
Description SRAM MODULE
Tech specs    

Official Product Page

    ICST[Integrated Circuit Systems]
Part No. MK3200SI MK3200STR MK3200 MK32000SITR MK3200S
Description 32.768 kHz Clock Oscillator

File Size 31.94K  /  4 Page

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Amphenol Communications Solutions

Part No. 10106133-2000002LF
Description PwrBlade+® , Power Connectors, 2HP PF, Right Angle, Header.
Tech specs    

Official Product Page

    KMM53232000CK

Samsung Semiconductor
Part No. KMM53232000CK
Description 32MBx32 DRAM Simm Using 16MBx4

File Size 403.02K  /  20 Page

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Amphenol Communications Solutions

Part No. 10121505-320008BLF
Description HPCE VT Receptacle with enhanced wall 32P8S
Tech specs    

Official Product Page

    HYS72T32000HP

Qimonda AG
Part No. HYS72T32000HP
Description 240-Pin Registered DDR2 SDRAM Modules

File Size 1,278.30K  /  53 Page

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Amphenol Communications Solutions

Part No. 10119109-320007LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    KM29W32000AIT KM29W32000AT

Samsung Semiconductor
Part No. KM29W32000AIT KM29W32000AT
Description 4M x 8-Bit NAND Flash Memory

File Size 382.82K  /  28 Page

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Amphenol Communications Solutions

Part No. 48232-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. KM23V32000CT KM23V32000CET
Description 32M-Bit (4Mx8 /2Mx16) CMOS Mask ROM(32M(4Mx8 /2Mx16) CMOS掩膜ROM) 32兆位Mx8 / 2Mx16)的CMOS掩模ROM2兆位Mx8 / 2Mx16)的CMOS掩膜光盘

File Size 56.80K  /  4 Page

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Amphenol Communications Solutions

Part No. 10104320-009RLF
Description Universal Contact, 1.30mm Height
Tech specs    

Official Product Page

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