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  31389-1207 Datasheet PDF File

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    31389-1207

Molex Electronics Ltd.
Part No. 31389-1207
Description 2.54mm Pitch, 0.64mm Width HDAC 64 High Density Automotive Connectors, Dual

File Size 40.04K  /  1 Page

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Texas Instruments

Part No. THS1207CDA
Description 12-Bit, 6 MSPS Simultaneous Sampling Quad Channel ADC; Includes Parallel DSP/uP I/F &amp; Ch. Auto-Scan 32-TSSOP 0 to 70
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    31389-1207 0313891207 SD-30700-120

Molex Electronics Ltd.
Part No. 31389-1207 0313891207 SD-30700-120
Description 2.54mm (.100) Pitch, 0.64mm
2.54mm (.100") Pitch, 0.64mm

File Size 478.73K  /  4 Page

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Texas Instruments

Part No. THS1207IDA
Description 12-Bit, 6 MSPS Simultaneous Sampling Quad Channel ADC; Includes Parallel DSP/uP I/F &amp; Ch. Auto-Scan 32-TSSOP -40 to 85
Tech specs    

Official Product Page

    MGA-31389-15

AVAGO TECHNOLOGIES LIMI...
Broadcom Corporation.
Part No. MGA-31389-15
Description 0.1W High Gain Driver Amplifier
0.1W High Gain Driver Amplifier 50MHz ~ 2GHz

File Size 465.46K  /  15 Page

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Amphenol Communications Solutions

Part No. 77313-899-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
Tech specs    

Official Product Page

    MOLEX INC
Part No. 31389-1209
Description COMBINATION LINE CONNECTOR

File Size 374.08K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-891-72LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 72 Positions
Tech specs    

Official Product Page

    MGA-31389-BLKG MGA-31389-TR1G

AVAGO TECHNOLOGIES LIMITED
AVAGO TECHNOLOGIES LIMI...
Part No. MGA-31389-BLKG MGA-31389-TR1G
Description 0.1W High Gain Driver Amplifier

File Size 454.85K  /  15 Page

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Amphenol Communications Solutions

Part No. 77313-890-64LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 64 Positions
Tech specs    

Official Product Page

    31389-1061 0307001061

Molex Electronics Ltd.
Part No. 31389-1061 0307001061
Description 2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveConnectors, Dual Row, Female Harness AssemblyCircuits, Polarization Option 2,
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveConnectors, Dual Row, Female Harness AssemblyCircuits, Polarization Option 2,

File Size 479.81K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-890-24LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 24 Positions
Tech specs    

Official Product Page

    1207A

ON Semiconductor
Part No. 1207A
Description Search --To NCP1207A

File Size 276.39K  /  16 Page

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Amphenol Communications Solutions

Part No. 77313-893-72LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 72 Positions
Tech specs    

Official Product Page

    F1207

Polyfet RF Devices
Part No. F1207
Description PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR

File Size 37.08K  /  2 Page

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Amphenol Communications Solutions

Part No. 77313-892-72LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 72 Positions
Tech specs    

Official Product Page

    1207-0446-06-P1 1207-0446-08-P1 1207-0446-01-P1 1207-0446-03-P1 1207-0446-02-P1 1207-0446-04-P1 1207-0446-05-P1 1207-044

List of Unclassifed Manufacturers
Part No. 1207-0446-06-P1 1207-0446-08-P1 1207-0446-01-P1 1207-0446-03-P1 1207-0446-02-P1 1207-0446-04-P1 1207-0446-05-P1 1207-0446-07-P1
Description Power Module Controlled Power Supply

File Size 60.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 77313-899-06LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 06 Positions
Tech specs    

Official Product Page

    73644-1207

Molex Electronics Ltd.
Part No. 73644-1207
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-899-10LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions
Tech specs    

Official Product Page

For 31389-1207 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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