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  01301 Datasheet PDF File

For 01301 Found Datasheets File :: 83+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 |   

    0901301124 90130-1124

Molex Electronics Ltd.
Part No. 0901301124 90130-1124
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
MOLEX Connector

File Size 586.06K  /  7 Page

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Texas Instruments

Part No. 8601301EA
Description 4-Bit Magnitude Comparator 16-CDIP -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901301126 90130-1126

Molex Electronics Ltd.
Part No. 0901301126 90130-1126
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)

File Size 586.04K  /  7 Page

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Texas Instruments

Part No. 7601301EA
Description Dual J-K Flip-Flops With Preset And Clear 16-CDIP -55 to 125
Tech specs    

Official Product Page

    0901301128 90130-1128

Molex Electronics Ltd.
Part No. 0901301128 90130-1128
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 67013-017LF
Description Berg Duflex Housing, single row, 17 Position.
Tech specs    

Official Product Page

    90130-1210 0901301210

Molex Electronics Ltd.
Part No. 90130-1210 0901301210
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 67013-018LF
Description Berg Duflex Housing, single row, 18 Position.
Tech specs    

Official Product Page

    90130-1212 0901301212

Molex Electronics Ltd.
Part No. 90130-1212 0901301212
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. ME1013010182011
Description MINICOOLEDGE130P,Vertical,0.6MM,SMT
Tech specs    

Official Product Page

    90130-1214 0901301214

Molex Electronics Ltd.
Part No. 90130-1214 0901301214
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 75970-130-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-1218 0901301218

Molex Electronics Ltd.
Part No. 90130-1218 0901301218
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 10120300-130-102LF
Description Receptacle, 4 Pair, 15 Column, 9mm Height, 85Ω, Without Damper, Lead Free
Tech specs    

Official Product Page

    90130-1250 0901301250

Molex Electronics Ltd.
Part No. 90130-1250 0901301250
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 50 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 50 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 10130186-G01ALF
Description Unshrouded Right angle Header, Surface Mount, Single Row, Polarized, 15 Position , 2.00mm (0.079in) Pitch
Tech specs    

Official Product Page

    90130-1240 0901301240

Molex Electronics Ltd.
Part No. 90130-1240 0901301240
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 40 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 40 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 67013-016LF
Description Berg Duflex Housing, single row, 16 Position.
Tech specs    

Official Product Page

    0901301106 90130-1106

Molex Electronics Ltd.
Part No. 0901301106 90130-1106
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 6 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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