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  1336 Datasheet PDF File

For 1336 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0513361310 51336-1310

Molex Electronics Ltd.
Part No. 0513361310 51336-1310
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 13Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 13Circuits
MOLEX Connector

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Amphenol Communications Solutions

Part No. 133-612D-11D
Description Paladin 6-Pair, 10 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, NiS
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    51336-0810 0513360810

Molex Electronics Ltd.
Part No. 51336-0810 0513360810
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 8Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 8Circuits

File Size 99.03K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612F-11H
Description Paladin 6-Pair, 14 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, APP
Tech specs    

Official Product Page

    51336-0910 0513360910

Molex Electronics Ltd.
Part No. 51336-0910 0513360910
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 9Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 9Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 9Circuits

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Amphenol Communications Solutions

Part No. 133-612E-12D
Description Paladin Plus 6-Pair, 12 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, NiS
Tech specs    

Official Product Page

    51336-1010 0513361010

Molex Electronics Ltd.
Part No. 51336-1010 0513361010
Description 1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 10 Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 10 Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612A-22D
Description Paladin Plus 6-Pair, 4 Column, Direct Orthogonal Header, Double End Wall, 2.25mm Wipe, NiS
Tech specs    

Official Product Page

    51336-1110 0513361110

Molex Electronics Ltd.
Part No. 51336-1110 0513361110
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 11Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 11Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 11Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612D-22H
Description Paladin Plus 6-Pair, 10 Column, Direct Orthogonal Header, Double End Wall, 2.25mm Wipe, APP
Tech specs    

Official Product Page

    51336-1210 0513361210

Molex Electronics Ltd.
Part No. 51336-1210 0513361210
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 12Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 12Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 12Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612C-11D
Description Paladin 6-Pair, 8 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, NiS
Tech specs    

Official Product Page

    51336-1510 0513361510

Molex Electronics Ltd.
Part No. 51336-1510 0513361510
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 15Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 15Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612E-11H
Description Paladin 6-Pair, 12 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, APP
Tech specs    

Official Product Page

    51336-1710 0513361710

Molex Electronics Ltd.
Part No. 51336-1710 0513361710
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 17Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612G-21D
Description Paladin 6-Pair, 16 Column, Direct Orthogonal Header, Double End Wall, 2.5mm Wipe, NiS
Tech specs    

Official Product Page

    51336-0710 0513360710

Molex Electronics Ltd.
Part No. 51336-0710 0513360710
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 7Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 7Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612D-12D
Description Paladin Plus 6-Pair, 10 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, NiS
Tech specs    

Official Product Page

    BDP948 BDP950 Q62702-D1338 Q62702-D1336

Siemens Semiconductor G...
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
SIEMENS A G
Part No. BDP948 BDP950 Q62702-D1338 Q62702-D1336
Description From old datasheet system
PNP Silicon AF Power Transistor (For AF drivers and output stages High collector current High current gain)

File Size 41.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 133-612G-12H
Description Paladin Plus 6-Pair, 16 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, APP
Tech specs    

Official Product Page

For 1336 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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Part: 133E60990
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