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For 1336 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    51336-1510 0513361510

Molex Electronics Ltd.
Part No. 51336-1510 0513361510
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 15Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 15Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612G-11D
Description Paladin 6-Pair, 16 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, NiS
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    51336-1710 0513361710

Molex Electronics Ltd.
Part No. 51336-1710 0513361710
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 17Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612A-21D
Description Paladin 6-Pair, 4 Column, Direct Orthogonal Header, Double End Wall, 2.5mm Wipe, NiS
Tech specs    

Official Product Page

    51336-0710 0513360710

Molex Electronics Ltd.
Part No. 51336-0710 0513360710
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 7Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 7Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612C-21H
Description Paladin 6-Pair, 8 Column, Direct Orthogonal Header, Double End Wall, 2.5mm Wipe, APP
Tech specs    

Official Product Page

    BDP948 BDP950 Q62702-D1338 Q62702-D1336

Siemens Semiconductor G...
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
SIEMENS A G
Part No. BDP948 BDP950 Q62702-D1338 Q62702-D1336
Description From old datasheet system
PNP Silicon AF Power Transistor (For AF drivers and output stages High collector current High current gain)

File Size 41.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 133-612A-12H
Description Paladin Plus 6-Pair, 4 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, APP
Tech specs    

Official Product Page

    51336-1910 0513361910

Molex Electronics Ltd.
Part No. 51336-1910 0513361910
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 19 Circuits

File Size 98.92K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612D-22D
Description Paladin Plus 6-Pair, 10 Column, Direct Orthogonal Header, Double End Wall, 2.25mm Wipe, NiS
Tech specs    

Official Product Page

    ST1335 ST1355-CW4 ST1335-BD10 ST1335-BD15 ST1335-BW2 ST1335-BW4 ST1335-CD10 ST1335-CD15 ST1335-CW2 ST1335-CW4 ST1336 ST1

SGS Thomson Microelectronics
STMICROELECTRONICS[STMicroelectronics]
意法半导
ST Microelectronics
STMicroelectronics N.V.
Part No. ST1335 ST1355-CW4 ST1335-BD10 ST1335-BD15 ST1335-BW2 ST1335-BW4 ST1335-CD10 ST1335-CD15 ST1335-CW2 ST1335-CW4 ST1336 ST1336-BD10 ST1336-BD15 ST1336-BW2 ST1336-BW4 ST1336-CD10 ST1336-CD15 ST1336-CW2 ST1336-CW4 ST1355 ST1355-BD10 ST1355-BD15 ST1355-BW2 ST1355-BW4 ST1355-CD10 ST1355-CD15 ST1355-CW2 ST1335-CD15/XXYY ST1335-CD10/XXYY ST1336-BD10/XXYY ST1336-BD15/XXYY ST1335-BD10/XXYY ST1335-BD15/XXYY ST1355-CD15/XXYY ST1336-CD15/XXYY ST1355-BD15/XXYY ST1336-CD10/XXYY ST1355-CD10/XXYY -ST1335-BD10 -ST1355-BD15
Description 5-CONTACT MEMORY CARD IC 272 BIT EEPROM WITH ADVANCED SECURITY MECHANISMS
5V, 3.3V, ISR™ High-Performance CPLDs
NX2LP DEVELOPMENT KIT
KIT DEV MOBL-USB FX2LP18
MoBL® 4-Mbit (256K x 16) Static RAM
MoBL® 1-Mbit (64K x 16) Static RAM
MoBL® 1 Mbit (128K x 8) Static RAM
MoBL® 2-Mbit (128K x 16) Static RAM
(ST1335/13361355) 5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms
MoBL&#174; 1-Mbit (64K x 16) Static RAM EEPROM
5V, 3.3V, ISR&#153; High-Performance CPLDs EEPROM
MoBL&#174; 4-Mbit (256K x 16) Static RAM EEPROM
5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms 5,联系记忆卡IC 272位具有高级安全机制的EEPROM

File Size 35.28K  /  3 Page

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Amphenol Communications Solutions

Part No. 133-612G-22H
Description Paladin Plus 6-Pair, 16 Column, Direct Orthogonal Header, Double End Wall, 2.25mm Wipe, APP
Tech specs    

Official Product Page

    51336-1810 0513361810

Molex Electronics Ltd.
Part No. 51336-1810 0513361810
Description 1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 18Circuits
1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 18Circuits

File Size 98.92K  /  2 Page

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Amphenol Communications Solutions

Part No. 133-612D-11D
Description Paladin 6-Pair, 10 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, NiS
Tech specs    

Official Product Page

    S-MOS Systems
Part No. SED1336F0A
Description LCD controller IC

File Size 386.22K  /  148 Page

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Amphenol Communications Solutions

Part No. 133-612F-11H
Description Paladin 6-Pair, 14 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, APP
Tech specs    

Official Product Page

    ST Microelectronics
Part No. ST1335D ST1355D ST1336D
Description (ST1335D / ST1336D / ST1355D) 5-Contact Memory Card IC 272-bit EEPROM

File Size 131.85K  /  4 Page

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Amphenol Communications Solutions

Part No. 133-612E-12D
Description Paladin Plus 6-Pair, 12 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, NiS
Tech specs    

Official Product Page

    ON Semi
Part No. MC74HC10A ON1336
Description TRIPLE 3-INPUT NAND GATE
From old datasheet system

File Size 130.28K  /  5 Page

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Amphenol Communications Solutions

Part No. 133-612A-22D
Description Paladin Plus 6-Pair, 4 Column, Direct Orthogonal Header, Double End Wall, 2.25mm Wipe, NiS
Tech specs    

Official Product Page

For 1336 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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Part: 133E60990
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