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  90143-0114 Datasheet PDF File

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    0901430034 90143-0034

Molex Electronics Ltd.
Part No. 0901430034 90143-0034
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 34 Circuits

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Amphenol Communications Solutions

Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901430032 90143-0032

Molex Electronics Ltd.
Part No. 0901430032 90143-0032
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 32 Circuits

File Size 250.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-430
Description BERGSTIK II .100CC DR-STRAIGHT
Tech specs    

Official Product Page

    0901430106 90143-0106

Molex Electronics Ltd.
Part No. 0901430106 90143-0106
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 6 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 6 Circuits

File Size 250.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    0901430108 90143-0108

Molex Electronics Ltd.
Part No. 0901430108 90143-0108
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 8 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 8 Circuits

File Size 250.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    0901430110 90143-0110

Molex Electronics Ltd.
Part No. 0901430110 90143-0110
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 10 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 10 Circuits

File Size 250.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    0901430112 90143-0112

Molex Electronics Ltd.
Part No. 0901430112 90143-0112
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 12 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 12 Circuits

File Size 250.46K  /  2 Page

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Amphenol Communications Solutions

Part No. GSD090143HR
Description Sd Card Connector, Push-push Type, 9 Position.
Tech specs    

Official Product Page

    0901430116 90143-0116

Molex Electronics Ltd.
Part No. 0901430116 90143-0116
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 16 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 16 Circuits

File Size 250.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    0901430118 90143-0118

Molex Electronics Ltd.
Part No. 0901430118 90143-0118
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 18 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 18 Circuits

File Size 250.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0039290143-18

Molex Electronics Ltd.
Part No. 0039290143-18
Description Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 14 Circuits, without Snap-in Plastic Peg PCB Lock, Gold, Natural

File Size 36.02K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    0901430104 90143-0104

Molex Electronics Ltd.
Part No. 0901430104 90143-0104
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 2 Polarizing Buttons, 4 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 2 Polarizing Buttons, 4 Circuits

File Size 250.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

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