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  HM15-21000LF Datasheet PDF File

For HM15-21000LF Found Datasheets File :: 68+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 |   

    HHM1522B1-15

TDK Electronics
Part No. HHM1522B1-15
Description Multilayer Balun
File Size 67.97K  /  6 Page

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Amphenol Communications Solutions
Part No. 10133343-21000LF
Description HPCE CTB VT HEADER 8LP with latch and screw
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    HHM1518A3

TDK Electronics
Part No. HHM1518A3
Description Multilayer Chip Baluns For DCS-PCS/Tx & Rx
File Size 38.71K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-110021000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    HHM1515B2-15

TDK Electronics
Part No. HHM1515B2-15
Description Multilayer Balun
File Size 67.16K  /  6 Page

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Amphenol Communications Solutions
Part No. 10137807-21000LF
Description HPCE CTB R/A HEADER 4HP8S
Tech specs 　 　

Official Product Page

    HHM1520A2 HHM1520-15

TDK Electronics
Part No. HHM1520A2 HHM1520-15
Description Multilayer Balun
File Size 67.66K  /  6 Page

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Amphenol Communications Solutions
Part No. 10127417-21000LF
Description HPCE CTB VT HEADER 16HP
Tech specs 　 　

Official Product Page

    HHM1583B1

TDK Electronics
Part No. HHM1583B1
Description Multilayer Chip Baluns For UWB
File Size 42.26K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-103121000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    HHM1523B3

TDK Electronics
Part No. HHM1523B3
Description Multilayer Chip Baluns For AGSM/Tx & Rx
File Size 38.68K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-403021000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    HHM1522A7

TDK Electronics
Part No. HHM1522A7
Description Multilayer Chip Baluns For AGSM/Tx & Rx
   Multilayer Chip Baluns For AGSM/Tx & Rx
File Size 38.53K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-806021000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    HHM1522A7-15

TDK Electronics
Part No. HHM1522A7-15
Description Multilayer Balun
File Size 67.65K  /  6 Page

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Amphenol Communications Solutions
Part No. 54122-110221000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 22 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    HHM1591D1

TDK Electronics
Part No. HHM1591D1
Description Multilayer Balun
File Size 67.21K  /  6 Page

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Amphenol Communications Solutions
Part No. 10156612-1000LF
Description Minitek® Board-In, Wire to Board Connectors, Right Angle housing 2.00mm 10 positions
Tech specs 　 　

Official Product Page

    HHM1570B1

TDK Electronics
Part No. HHM1570B1
Description MULTILAYER BALUN SPECIFICATION
File Size 47.02K  /  2 Page

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Amphenol Communications Solutions
Part No. 54112-111121000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

For HM15-21000LF Found Datasheets File :: 68+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 |   

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