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  87834-6021 Datasheet PDF File

For 87834-6021 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87834-4419

Molex Electronics Ltd.
Part No. 87834-4419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator
2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13楼矛m (5楼矛) Gold (Au) Plating, Black, without PCB Locator

File Size 115.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 10118615-936021LF
Description BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 36 Positions ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87834-5095

Molex Electronics Ltd.
Part No. 87834-5095
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05渭m (2渭) Gold (Au) Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 68602-102HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 2 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87834-5021

Molex Electronics Ltd.
Part No. 87834-5021
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13渭m (5渭) Gold (Au) Flash Plating, Nylon Housin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.27K  /  3 Page

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Amphenol Communications Solutions

Part No. 68602-138HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87834-5019

Molex Electronics Ltd.
Part No. 87834-5019
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, 50 Circuits, 0.13渭m (5渭) Gold (Au) Plating, Black, without PCB Locator
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 50 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 114.98K  /  3 Page

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Amphenol Communications Solutions

Part No. 68602-160HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87834-5011

Molex Electronics Ltd.
Part No. 87834-5011
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 50 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 50 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.42K  /  3 Page

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Amphenol Communications Solutions

Part No. 59112-T36-02-115LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 4 Positions.
Tech specs    

Official Product Page

    87834-4095

Molex Electronics Ltd.
Part No. 87834-4095
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.34K  /  3 Page

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Amphenol Communications Solutions

Part No. 10145226-0211P13LF
Description DDR4 DIMM, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
Tech specs    

Official Product Page

    87834-2641

Molex Electronics Ltd.
Part No. 87834-2641
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. RJE031660210H
Description Modular Jack - Right Angle, Input Output Connectors 6P6C, Without Shield, Without Panel Stop, High Temperature.
Tech specs    

Official Product Page

    87834-2645

Molex Electronics Ltd.
Part No. 87834-2645
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 26 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.68K  /  3 Page

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Amphenol Communications Solutions

Part No. RJE291660210
Description Modular Jacks, Input Output Connectors, 6P6C, RA, Without Shield.
Tech specs    

Official Product Page

    87834-2695

Molex Electronics Ltd.
Part No. 87834-2695
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.34K  /  3 Page

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Amphenol Communications Solutions

Part No. 10145226-0212N13LF
Description DDR4 Memory Module Sockets, Storage and Server System, Vertical, Through Hole, 288 Position, 0.85mm (0.033in) pitch.
Tech specs    

Official Product Page

    87834-2619

Molex Electronics Ltd.
Part No. 87834-2619
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 26 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 10136656-0212LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 2 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

For 87834-6021 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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