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  bumped Datasheet PDF File

For bumped Found Datasheets File :: 538    Search Time::1.094ms    
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    HT1621B

HOLTEK[Holtek Semiconductor Inc]
Part No. HT1621B
OCR Text ...pin SKDIP package HT1621G: Gold bumped chip General Description The HT1621 is a 128 pattern (324), memory mapping, and multi-function LCD driver. The S/W configuration feature of the HT1621 makes it suitable for multiple LCD application...
Description RAM Mapping 324 LCD Controller for I/O MCU
RAM Mapping 32x4 LCD Controller for I/O MCU

File Size 171.74K  /  20 Page

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    DS2433S-Z01 DS2433T-Z01 DS2433X-Z01 DS2433Y-Z01 DS2433-Z01

Maxim Integrated Products, Inc.
DALLAS[Dallas Semiconductor]
Dallas Semiconducotr
MAXIM - Dallas Semiconductor
Part No. DS2433S-Z01 DS2433T-Z01 DS2433X-Z01 DS2433Y-Z01 DS2433-Z01
OCR Text ...st PR-35, 8-pin SOIC, or solder bumped flip chip package Reads and writes over a wide voltage range of 2.8V to 6.0V from -40C to +85C PIN ASSIGNMENT PR-35 12 3 BOTTOM VIEW NC NC DATA GND 1 2 3 4 8 7 6 5 NC NC NC NC ...
Description 4K-Bit 1-Wire EEPROM 4k1-Wire EEPROM

File Size 17.43K  /  2 Page

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    SL3ICS3001FW SL3S30 SL3S3001FTT SL3ICS30

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. SL3ICS3001FW SL3S30 SL3S3001FTT SL3ICS30
OCR Text ... 741 69118 OPTIONAL DESCRIPTION bumped, sawn wafer on FFC, 150 m, inked and mapped Packaged die in TSSOP8 package 7 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www...
Description UCODE HSL

File Size 54.21K  /  9 Page

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    DS2432 DS2432X DS2432P

MAXIM - Dallas Semiconductor
DALLAS[Dallas Semiconducotr]
DALLAS[Dallas Semiconductor]
Part No. DS2432 DS2432X DS2432P
OCR Text ...urface mount package, or solder-bumped Flipchip package Reads and writes over a wide voltage range of 2.8V to 5.25V from -40C to +85C PIN ASSIGNMENT TSOC (150mil) GND 1-WIRE NC 1 2 3 6 5 4 NC NC NC top view top view side view ...
Description 1kb Protected 1-Wire EEPROM with SHA-1 Engine
1k-Bit Protected 1-Wire EEPROM with SHA-1 Engine

File Size 162.90K  /  30 Page

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    MC79076DW MCCF79076 MC79076 ON1779

MOTOROLA[Motorola, Inc]
ON Semi
Part No. MC79076DW MCCF79076 MC79076 ON1779
OCR Text ...perating temperatures. * Solder bumped for Flip-Chip Assembly MC79076 MCCF79076 ELECTRONIC IGNITION CONTROL CIRCUIT SEMICONDUCTOR TECHNICAL DATA * * * * * * Ignition Coil Voltage Internally Limited to 375 V Coil Current Limiting ...
Description From old datasheet system
ELECTRONIC IGNITION CONTROL CIRCUIT 

File Size 62.78K  /  2 Page

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    SR176 SR176-A3S SR176-A3T SR176-A4S SR176-A4T SR176-A5S SR176-A5T SR176-SBN18 SR176-W4 -SR176-A4S

STMICROELECTRONICS[STMicroelectronics]
意法半导
STMicroelectronics N.V.
ST Microelectronics
Part No. SR176 SR176-A3S SR176-A3T SR176-A4S SR176-A4T SR176-A5S SR176-A5T SR176-SBN18 SR176-W4 -SR176-A4S
OCR Text ... Unsawn Wafer SBN18= 180m 15 m bumped and Sawn Wafer on 8-inch Frame A3T= 38mm x 38mm Copper Antenna on Continuous Tape A3S= 38mm x 38mm Copper Singulated Adhesive Antenna on Tape A4T= 15mm x 15mm Copper Antenna on Continuous Tape A4S= 15m...
Description 13.56 MHz Short Range Contactless Memory Chip 176 bit USER EEPROM and 64-bit Unique ID 13.56兆赫短距离非接触式存储器芯片176位用户EEPROM4位唯一ID

File Size 117.52K  /  5 Page

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    PCF8548 PCF8548U_2 PCF8548U_9

Philips Semiconductors
Part No. PCF8548 PCF8548U_2 PCF8548U_9
OCR Text ...NAME PCF8548U/2 PCF8548U/9 Tray bumped wafer chip with bumps in tray quarter wafer DESCRIPTION VERSION - - 2 APPLICATIONS * Telecom equipment * Portable instruments * Point of sale terminals. 3 GENERAL DESCRIPTION The PCF8548 is a low po...
Description 65 X 102 pixels matrix LCD driver

File Size 209.66K  /  40 Page

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    Samsung Electronic
Part No. S6A0070A
OCR Text ...n external resistor Bare die or bumped chip available 1 S6A0070 16COM/80SEG DRIVER & CONTROLLER FOR DOT MATRIX LCD Precautions for Light Light has characteristics to move electrons in the integrated circuitry of semiconductors, ...
Description 16 COM / 80 SEC Driver & Controller for Dot Matrix LCD
Mobile DDI

File Size 213.74K  /  42 Page

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    NJRC[New Japan Radio]
Part No. NJU6818
OCR Text ...tangle out look for COG Package bumped chip / TCP 2002/08/26 -1- Note 1) The same name PADs are shorted mutually in the LSI. Note 2) The DMY PADs are electrically open. 692: SEGA102 693: SEGB102 694: SEGC102 695: SEGA103 696: SE...
Description 80-Common X 104RGB-Segment in 4096-Color STN LCD DRIVER

File Size 842.32K  /  102 Page

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