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HYBAN STK14C88 MC9S12D XXX1M 50001 XXX1M X80143 106D1
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  90143-0114 Datasheet PDF File

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    90143-0010

Molex Electronics Ltd.
Part No. 90143-0010
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 10 Circuits

File Size 250.10K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90143-0024

Molex Electronics Ltd.
Part No. 90143-0024
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 24 Circuits

File Size 250.36K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-430
Description BERGSTIK II .100CC DR-STRAIGHT
Tech specs    

Official Product Page

    90143-0026

Molex Electronics Ltd.
Part No. 90143-0026
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 26 Circuits

File Size 250.36K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90143-0008

Molex Electronics Ltd.
Part No. 90143-0008
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 8 Circuits

File Size 250.10K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90143-0012

Molex Electronics Ltd.
Part No. 90143-0012
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 12 Circuits

File Size 250.10K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90143-0020

Molex Electronics Ltd.
Part No. 90143-0020
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 20 Circuits

File Size 250.10K  /  2 Page

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Amphenol Communications Solutions

Part No. GSD090143HR
Description Sd Card Connector, Push-push Type, 9 Position.
Tech specs    

Official Product Page

    90143-0016 90143-0018

Molex Electronics Ltd.
Part No. 90143-0016 90143-0018
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 16 Circuits
2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 18 Circuits

File Size 250.10K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    Molex, Inc.
MOLEX INC
Part No. 90143-0014 90143-0034 90143-0004 90143-0160 90143-0120
Description Connector Housing; No. of Contacts:14; Pitch Spacing:2.54mm; No. of Rows:2; Series:C-Grid III; Connector Body Material:Polyphenylene Oxide; Contact Termination:Crimp RoHS Compliant: Yes 14 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, CRIMP
Connector Housing; Number of Contacts:34; Pitch Spacing:2.54mm; Number of Rows:2; Series:C-Grid III; Connector Body Material:Polyphenylene Oxide; Contact Termination:Crimp 34 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, CRIMP
Connector Housing; No. of Contacts:4; Pitch Spacing:2.54mm; No. of Rows:2; Series:C-Grid III; Connector Body Material:Polyphenylene Oxide; Contact Termination:Crimp RoHS Compliant: Yes 4 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, CRIMP
C-Grid Modr Crp Hsg DR W/Pol Bttn 60Ckt 60 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, CRIMP
C-Grid Modr Crp Hsg DR W/Pol Bttn 20Ckt

File Size 222.95K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    Asahi Kasei Microsystem...
Part No. HG-0114
Description    Shipped in packet-tape reel(5,000pcs per reel)

File Size 123.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

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    90-0114

Maxim Integrated Products
Part No. 90-0114
Description PACKAGE LAND PATTERN, (U20E-1 / U20E 1) TSSOP 20 LEADS

File Size 20.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

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