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SONY
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Part No. |
CXA3271AGE
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OCR Text |
...sensor gain control: 3 bits s/n ratio improved by on-chip sensor block parasitic capacitance cancel function applications fingerprint veri...substrate electrode (chip rear surface electrode) 3.3v. analog power supply 3.3v. analog gnd. test m... |
Description |
Fingerprint Sensor
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File Size |
133.21K /
15 Page |
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INTERSIL[Intersil Corporation]
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Part No. |
CA3086M96 CA3086
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OCR Text |
.... . . . . . . . . . . . . . 110 N/A SOIC Package . . . . . . . . . . . . . . . . . . . 130 N/A Maximum Power Dissipation (Any one transistor...substrate by an integral diode. The substrate (Terminal 13) must be connected to the most negative p... |
Description |
NPN Transistor Array, DC to 190MHz, General Purpose General Purpose NPN Transistor Array
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File Size |
105.72K /
7 Page |
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it Online |
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TriQuint Semiconductor,Inc. TRIQUINT[TriQuint Semiconductor]
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Part No. |
CGB240
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OCR Text |
...0 Outline
Symbol
VC1 VC1 RFIN N.C. N.C. VCTR1 VCTR2 VC2 VC2 N.C. GND RF and DC ground (pad located on backside of package) Heatsink. Therm...substrate; h = 0,2 mm; w = 0,32 mm l = 1,8 mm; FR4 substrate; h = 0,2 mm; w = 0,32 mm l = 4,0 mm; FR... |
Description |
2-Stage Bluetooth InGaP HBT Power Amplifier 2.4 to 2.5 GHz HBT Bluetooth Power Amplifier
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File Size |
177.13K /
14 Page |
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it Online |
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Price and Availability
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