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  bumped Datasheet PDF File

For bumped Found Datasheets File :: 609    Search Time::1.422ms    
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    AS1351 AS13511

austriamicrosystems AG
Part No. AS1351 AS13511
OCR Text ...n QFN 3x3mm package and a wafer bumped package. Figure 5. 12-Pin QFN 3x3mm Package. www.austriamicrosystems.com Revision 1.21 7 - 10 AS1351 Data Sheet - Ty p i c a l A p p l i c a t i o n www.austriamicrosystems.com Rev...
Description Programmable Dual LDO

File Size 225.24K  /  10 Page

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    EMMICRO[EM Microelectronic - MARIN SA]
Part No. EM4569 EM4469
OCR Text ...ith EM4469. However, EM4569 has bumped enlarged pads intended for direct connection of coil to big bumps. EM4569 also has an extended reading range which makes it particularly suitable for animal tracking applications. Features Extended...
Description 512 bit Read/Write Contactless Identification Device

File Size 46.06K  /  1 Page

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    UC1697V UC1697VGAA

ETC
Part No. UC1697V UC1697VGAA
OCR Text ...7 ORDERING INFORMATION GOLD bumped DIE Part Number UC1697vGAA MTP Yes I2 C No Description Gold bumped die, with MTP function. General Notes APPLICATION INFORMATION For improved readability, the specification contains many applicatio...
Description 128 x 128RGB C-STN LCD Controller-Driver w/ 16-bit per RGB On-Chip SRAM

File Size 880.38K  /  77 Page

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    A3904EEWTR-P A3904ECGTR A3904ECW

Allegro MicroSystems
Part No. A3904EEWTR-P A3904ECGTR A3904ECW
OCR Text ... bare die on wafer (suffix CW); bumped wafer level chip scale package (WLCSP) (suffix CG); and complete thin profile (0.38 mm nominal overall height) DFN package, with NiAuPd leadframe plating and an exposed tab for enhanced thermal dissipa...
Description Low Voltage Voice Coil Motor Driver

File Size 254.69K  /  9 Page

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    ETC[ETC]
Part No. UC1602I
OCR Text ... PP: GU: GD: Fn: Packaging Gold bumped, face up Gold bumped, face down Type n TCP film Drivers 65 COM x 102 SEG Mux Rate Supported 1/65, 1/49 Versions G Description Part Number UC1602I Memory 65 x 102 General Notes APPLICATION INF...
Description 65x102 Matrix LCD Controller-Driver

File Size 702.12K  /  38 Page

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    ONSEMI[ON Semiconductor]
Part No. NLAS4685FCT1G NLAS4685 NLAS4685FCT1
OCR Text ... is available in a 2.0 x 1.5 mm bumped die array, with a 3 x 4 arrangement of solder bumps. The pitch of the solder bumps is 0.5 mm for easy handling. Features http://onsemi.com MARKING DIAGRAM A1 Microbump-10 CASE 489AA A1 XXD * ...
Description Ultra-Low Resistance Dual SPDT Analog Switch

File Size 90.11K  /  10 Page

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    H4005

List of Unclassifed Manufacturers
EM Microelectronic
ETC[ETC]
Electronic Theatre Controls, Inc.
Part No. H4005
OCR Text ... 1.0 1016 200 325 H4105 bumped COIL1 VDD 118 118 200 160 95 Dimensions in [mm] 600 Fig. 7 IC Thickness : 280 m 25 m Bump Height : 25 m 5 m Dimensions in m Fig. 8 Ordering Information The H4005 is available...
Description ISO 11 784 / 11 785 COMPLIANT READ ONLY CONTACTLESS IDENTIFICATION DEVICE
From old datasheet system

File Size 136.83K  /  6 Page

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    HITACHI[Hitachi Semiconductor]
Part No. HD66760
OCR Text ...ions Bending TCP Bending TCP Au-bumped chip Au-bumped chip Interface Parallel and clock synchronized serial interface Parallel and I2C interface Parallel and clock synchronized serial interface Parallel and I2C interface 3 HD66760 HD...
Description 104 X 80-dot Graphics LCD Controller/Driver for 256 Colors

File Size 633.55K  /  105 Page

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    ONSEMI[ON Semiconductor]
Part No. NLAS4684MR2G NLAS4684 NLAS4684FCT1 NLAS4684FCT1G NLAS4684MNR2 NLAS4684MNR2G NLAS4684MR2
OCR Text ... is available in a 2.0 x 1.5 mm bumped die array. The pitch of the solder bumps is 0.5 mm for easy handling. Features http://onsemi.com MARKING DIAGRAMS * Ultra-Low RON, t0.5 W at 2.7 V * Threshold Adjusted to Function with 1.8 V Contro...
Description Ultra-Low Resistance Dual SPDT Analog Switch

File Size 131.69K  /  14 Page

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For bumped Found Datasheets File :: 609    Search Time::1.422ms    
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