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  87834-6021 Datasheet PDF File

For 87834-6021 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    87834-1811 0878341811

Molex Electronics Ltd.
Part No. 87834-1811 0878341811
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 18 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 10118615-936021LF
Description BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 36 Positions ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0878341221

Molex Electronics Ltd.
Part No. 0878341221
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 68602-102HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 2 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0878341019

Molex Electronics Ltd.
Part No. 0878341019
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 10 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 68602-138HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0878341095

Molex Electronics Ltd.
Part No. 0878341095
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.53K  /  3 Page

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Amphenol Communications Solutions

Part No. 68602-160HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0878341219

Molex Electronics Ltd.
Part No. 0878341219
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 12 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 114.98K  /  3 Page

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Amphenol Communications Solutions

Part No. 59112-T36-02-115LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 4 Positions.
Tech specs    

Official Product Page

    0878341045

Molex Electronics Ltd.
Part No. 0878341045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 10 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 10145226-0211P13LF
Description DDR4 DIMM, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
Tech specs    

Official Product Page

    87834-4043 0878344043

Molex Electronics Ltd.
Part No. 87834-4043 0878344043
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without PCB Locator

File Size 93.39K  /  3 Page

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Amphenol Communications Solutions

Part No. RJE031660210H
Description Modular Jack - Right Angle, Input Output Connectors 6P6C, Without Shield, Without Panel Stop, High Temperature.
Tech specs    

Official Product Page

    87834-4041 0878344041

Molex Electronics Ltd.
Part No. 87834-4041 0878344041
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. RJE291660210
Description Modular Jacks, Input Output Connectors, 6P6C, RA, Without Shield.
Tech specs    

Official Product Page

    87834-5041 0878345041

Molex Electronics Ltd.
Part No. 87834-5041 0878345041
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 112.73K  /  3 Page

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Amphenol Communications Solutions

Part No. 10145226-0212N13LF
Description DDR4 Memory Module Sockets, Storage and Server System, Vertical, Through Hole, 288 Position, 0.85mm (0.033in) pitch.
Tech specs    

Official Product Page

    0878341017

Molex Electronics Ltd.
Part No. 0878341017
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, Gold (Au) Flash, Polyester Housing

File Size 104.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 10136656-0212LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 2 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

For 87834-6021 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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