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  bumped Datasheet PDF File

For bumped Found Datasheets File :: 609    Search Time::1.031ms    
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    STV7623 STV7623WPB3

STMicroelectronics
Part No. STV7623 STV7623WPB3
OCR Text ...voltage bcd process technology bumped dice in tray output stage similar to stv7622 pcb-less compatible dice description the stv7623 is a 1-bit x 480 shift register with dual rail high voltage/medium current output, with global blank an...
Description 480 output high-voltage gate driver

File Size 445.09K  /  27 Page

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    EMC[ELAN Microelectronics Corp]
Part No. EM65168 EM65168H EM65168AH
OCR Text ...Bare chip (Aluminum pad without bumped); GH: Gold bumped chip; F: COF package; T: TAB (TCP) package Example EM65168H EM65168: Elan number ; H: Bare chip 3. Application Data Bank LCD toy Education computer 4 The information in t...
Description 80 COM/SEG LCD DRIVER

File Size 186.99K  /  30 Page

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    意法半导
Part No. STE2002DIE2 STE2002DIE1
OCR Text ...ontroller. type ordering number bumped wafers ste2002die1 bumped dice on waffle pack ste2002die2 81 x 128 single chip lcd controller / driver figure 1. block diagram column drivers row drivers data latches 104 x 128 ram display control logi...
Description 0.5mm Pitch DIL Vertical SMT Female Assembly, 1.5mm height, location pegs, hold-down tabs, tin, 15 15-way, Tape & Reel packing
81 X 128 SINGLE CHIP LCD CONTROLLER / DRIVER

File Size 501.68K  /  51 Page

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    ST Microelectronics
Part No. XRAG2
OCR Text ...n unbumped wafers or sawn and bumped wafers www.st.com 1 summary description xrag2 2/8 1 summary description the xrag2 is a full-featured, low-cost integrated circuit for use in radio frequency identification (rfid) transponders...
Description Contactless Memory Chip 432 bit

File Size 87.47K  /  8 Page

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    HD66717 HD66717A03TA0 HCD66717A13BP HCD66717A03 HCD66717A03BP

HITACHI[Hitachi Semiconductor]
Part No. HD66717 HD66717A03TA0 HCD66717A13BP HCD66717A03 HCD66717A03BP
OCR Text ...ernal Dimensin TCP Bare chip Au-bumped chip Au-bumped chip Up-side-down pattern of A03 Operation Voltage 2.4V to 5.5V Internal Font Japanese and European fonts 453 HD66717 LCD-II Family Comparison Item Power supply voltage LCD-II (H...
Description (Low-Power Dot-Matrix Liquid Crystal Display Controller/Driver)

File Size 711.74K  /  90 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. S6B0796
OCR Text ...o 244 289 to 292 76 73 bumped pad size 245 to 288 58 76 bumped pad height 1 to 292 14 ( typ.) m m s 6b 0796 preliminary spec. ver. 1.0 240 seg / ...
Description 240 SEG / COM DRIVER FOR STN LCD

File Size 281.54K  /  32 Page

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    Microchip Technology Inc.
Part No. DV103001 DV103002 DV103003
OCR Text ...ro id devices are available in bumped or bondable wafer format which makes them suitable for smart labels and flip-chip style assembly. package options include: die, wafer, wafer-on- frame, bumped wafer-on-frame, pdip, soic and cob modules...
Description
File Size 198.81K  /  2 Page

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    KS0794

Samsung semiconductor
Part No. KS0794
OCR Text ...108 161 to 164 187 to 190 76 58 bumped pad size 165 to 186 58 76 bumped pad height 1 to 190 14 ( typ . ) m m ks0794 preliminary spec. ver. 1.1 160 com / seg drive...
Description 160 COM / 160 SEG DRIVER FOR STN LCD

File Size 273.89K  /  31 Page

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    NJU6679

New Japan Radio
Part No. NJU6679
OCR Text ...ckage outline --- cof / tcp / bumped chip --- cof / tcp / bumped chip c-mos technology ( c-mos technology ( substrate:n) substrate:n) 2001 2001 ver.4.8 ver.4.8 nju6679 nju6679 pad location pad location chip cente...
Description 128Com × 132Seg Output Bit Map LCD Driver

File Size 476.12K  /  45 Page

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