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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 22 tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 tsz22111 ? 14 ? 001 www.rohm.com l ow c onsumption and high a ccuracy s hunt r egulator b uilt - in high e fficiency and l ow s tandby power, ccm corresponding secondary s ide s ynchronous r ectification controller ic b m1r00xxx f general description bm1r00xxxf is a synchronous rectification controlle r to be used in the secondary - side output. it has a built - in ultra -low consumption and high accuracy shunt regulator , which significantly reduces standby power . t he shunt regulator is constructed in a completely independent chip that enables it to operate as a gnd reference even when used in h igh s ide. at continuous mode operation , further space saving can be realized when operating with out the input switching synchronizing signal of the primary side . bm1r00xxxf also features a wide o perating power supply voltage range of 2. 7 v to 32v for various output application s . finally , by adopting the high - voltage 120v process , it is possible to monitor the drain voltage directly . features ? built -in u ltra -l ow c onsumption shunt r egulator r educ ing standby p ower c onsum ption ? synchronous r ectification fet supports high and low side ? 120v high v oltage p rocess drain terminal ? wide i nput o perating v oltage r ange of 2. 7 v to 32v ? supports llc and pwm qr controller ? no input required on the primary - side a t ccm ? built - in overvolta ge protection for sh_in and sh_out t erminal ? built - in thermal s hutdown function ? built - in auto shutdown function ? sop8 package applications ? ac -dc o utput p ower c onversion applications : c harger , adapter , tv, rice c ooker , humidifier, air co nditioning , v acuu m c leaner , etc . key specification s ? i nput voltage range: 2. 7 v to 32v ? circuit current ( no switching ): 800a (typ) ? circuit current (auto shutdown) : 120a ( typ ) ? drain terminal absolute voltage : 120v ? operating temperature range: -40c to +10 5c package w (typ) x d(typ) x h(max) 5.0 0mm x 6. 2 0mm x 1. 71mm lineup table latc h pro tection series auto restart protection series sop8 bm1r00001 1 1.3 bm1r00002 1 2 bm1r00003 1 3 bm1r00004 1 3.6 bm1r00005 1 4.6 bm1r00006 1.5 1.3 bm1r00007 1.5 2 bm1r00008 1.5 3 bm1r00009 1.5 3.6 bm1r00010 1.5 4.6 bm1r00011 2.3 1.3 bm1r00012 2.3 2 bm1r00013 2.3 3 bm1r00014 2.3 3.6 bm1r00015 2.3 4.6 bm1r00016 2.8 1.3 bm1r00017 2.8 2 bm1r00018 2.8 3 bm1r00019 2.8 3.6 bm1r00020 2.8 4.6 bm1r00021 3.5 1.3 bm1r00022 3.5 2 bm1r00023 3.5 3 bm1r00024 3.5 3.6 bm1r00025 3.5 4.6 bm1r00026 none 1.3 bm1r00027 none 2 bm1r00028 none 3 bm1r00029 none 3.6 bm1r00030 none 4.6 function name compulsion on time ( s) compulsion off time ( s) bm1r00121 1 1.3 bm1r00122 1 2 bm1r00123 1 3 bm1r00124 1 3.6 bm1r00125 1 4.6 bm1r00126 1.5 1.3 bm1r00127 1.5 2 bm1r00128 1.5 3 bm1r00129 1.5 3.6 bm1r00130 1.5 4.6 bm1r00131 2.3 1.3 bm1r00132 2.3 2 bm1r00133 2.3 3 bm1r00134 2.3 3.6 bm1r00135 2.3 4.6 bm1r00136 2.8 1.3 bm1r00137 2.8 2 bm1r00138 2.8 3 bm1r00139 2.8 3.6 bm1r00140 2.8 4.6 bm1r00141 3.5 1.3 bm1r00142 3.5 2 bm1r00143 3.5 3 bm1r00144 3.5 3.6 bm1r00145 3.5 4.6 bm1r00146 none 1.3 bm1r00147 none 2 bm1r00148 none 3 bm1r00149 none 3.6 bm1r00150 none 4.6 function name compulsion on time ( s) compulsion off time ( s) datashee t
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2 / 22 tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 b m1r00xxxf typical application circuit s pin con f iguration pin descriptio n pin no. pin n ame function 1 vcc power s upply 2 sh_in shunt r egulator r eference 3 sh_out shunt r egulator o utput 4 sh_gnd shunt r egulator g round 5 max_ton set m aximum o n t ime 6 gate gate d rive 7 sr_gnd synchronous r ectification g round 8 drain drain m onitor low side application ( flyback ) high side application ( flyback ) (top view) s h _ i n s h _ o u t s h _ g n d g a t e 8 6 5 1 2 3 4 d r a i n v c c 7 s r _ g n d m a x _ t o n + - v o u t p r i m a r y c o n t r o l e r g n d s h _ i n g a t e s h _ g n d d r a i n 8 6 5 1 2 3 4 v c c s h _ o u t 7 s r _ g n d m a x _ t o n + - v o u t p r i m a r y c o n t r o l e r g n d s h _ i n g a t e s h _ g n d d r a i n 8 6 5 1 2 3 4 v c c s h _ o u t 7 s r _ g n d m a x _ t o n
3 / 22 tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 b m1r00xxxf block diagra m bm1r00001 - 030 : include timer latch bm1r00121 - 150: without timer latch v o u t p r i m a r y s i d e c o n t r o l l e r + - + - - 1 0 0 m v s q r + - v c c x 1 . 4 c o m p u l s i o n o n t i m e - 6 m v m a x _ t o n b l o c k m a x _ t o n v c c d r i v e r g n d l d o b l o c k + - s h _ i n + - 0 . 8 v s h _ o u t p r o t e c t i o n b l o c k ? s h _ o u t _ o v p ? s h _ i n _ o v p ? t s d d r a i n g a t e s r _ g n d d r a i n _ c o m p s e t _ c o m p r e s e t _ c o m p s h u n t _ r e g u l a t o r a u t o s h u t d o w n b l o c k c o m p u l s i o n o f f t i m e t i m e r l a t c h 2 k o h m s h _ g n d
4 / 22 tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 b m1r00xxxf description of block 1. set_comp block monitor s the drain terminal voltage , and outputs a signal to turn on the fet if the drain terminal voltage is less than or equal to - 100mv (typ). 2. reset_comp block monitors the drain terminal volta ge and outputs a signal to turn off the fet if the drain terminal voltage is more than or equal to - 6mv (typ). 3. c ompulsion on time block when the fet is turned on due to set_comp detection , noise occurs on the drain terminal . to prevent the noise from turn ing off the fet, an on state should be forced for a certain time. compuls ion on time is with in a range of 0s (none) to 3.5s , which is different for each series number (refer to p age .1 table ) . 4. compulsion off time block when the fet is turned off due to r e set_comp detection , resonance waveforms appear on the drain terminal . to prevent the noise from turning on the fet, an off state should be forced for a certain time. compulsion off time is with in a range of 1.3s to 4. 6 s , which is different for each seri es number (refer to page.1 table). o peration sequence of each block is shown on the figure below . about m aximum i nput f requency the m aximum o perating f requency of the ic depends on the compulsion on/off t ime . for example, b m1r00026f and bm1r00146f compulsion on and off t ime is both equal to s. c onsidering a variation of 9% , the maximum input frequency is given by the following : f max vv[ 1.09) = 706khz however , since the frequency varies greatly due to the input voltage and load , it will be necessary to select the series in accordance with each application . figure 1 . operation sequence 0 v
5 / 22 tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 b m1r00xxxf description of block C (3) (4) (6) (5) (1) period allotted for g 1 and g 2 to avoid concurrent on state at continuous mode operation. v ds2 i 1 i 2 v g 1 v g 2 t max_on t max_on v cc x 1 . 4 figure 2 . the drive sequence in continuous mode operation ? ? ? ? ? ? s k s t k r ton max ton max ? / 10 _ _ ? ? ? ? 0 v - 1 0 0 m v - 1 0 0 m v m a x _ t o n t i m e r c o m p u l s i o n o f f t i m e r s t a r t c o m p u l s i o n o f f t i m e r s t a r t - v f v o u t p r i m a r y s i d e c o n t r o l l e r + - + - - 1 0 0 m v s q r + - v c c x 1 . 4 c o m p u l s i o n o n t i m e - 6 m v m a x _ t o n b l o c k m a x _ t o n v c c d r i v e r g n d l d o b l o c k + - d r a i n g a t e s r _ g n d d r a i n _ c o m p s e t _ c o m p r e s e t _ c o m p c o m p u l s i o n o f f t i m e v g 1 i 1 i 2 v d s 2 v g 2 n p n s v h r m a x _ t o n r 1 c 1 v f d 1 r d r a i n 1 r d r a i n 2 l f b ? ? ? ? ? ? k s k s 100 / 10 10 ?
6 / 22 tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 b m1r00xxxf absolute maximum ratings (ta = 25c) parameter symbol rating unit vcc input voltage v max_vcc - 0.3 to +40 (n ote 1) v max_ton input voltage v max_max_ton - 0.3 to +40 (n ote 1) v sh_in input voltage v max_sh_in - 0.3 to + 40 (n ote 2) v sh_out input voltage v max_sh_out - 0.3 to + 40 (n ote 2) v gate input voltage v max_gate - 0.3 to 15.5 (n ote 1) v drain input voltage v max_drain 120 (note 1)(n ote 3) v maximum junction temperature t jmax + 150 c operating temperature range t opr - 40 to +105 c storage temperature t str - 55 to +150 c (note 1) refer ence sr_gnd (note 2) reference sh_gnd ( n ote 3) when a negative voltage is applied , current flows through the esd protection device . this current value is about 6ma or less and will require a current limiting resistor to the drain terminal caution: operati ng the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an op en circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as add ing a fuse in case the ic is operated over the absolute maximum ratings. thermal resistance ( note 1) parameter symbol thermal resistance (typ) unit 1s ( note 3 ) 2s2p ( note 4) sop8 junction to ambient j a 197.4 109.8 c /w junction to top characteri zation parameter ( note 2) jt 21 19 c /w (note 1) based on jesd51 - 2a(still - air) (note 2) the thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface o f the component package. (note 3) using a pcb board based on jesd51 - 3. (note 4) using a pcb board based on jesd51 - 7. layer number of measurement board material board size single fr - 4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and t races wp layer number of measurement board material board size 4 layers fr - 4 114.3mm x 76.2mm x 1.6mmt top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces wp 74. 2mm x 74.2mm wp 74.2mm x 74.2mm wp recommended operating conditions ( ta = 25c ) parameter symbol min typ max unit supply voltage v cc 2. 7 20 32 v max_ton resistor range r max_ton 56 - 30 0 n max_ton r1 r 1 0.5 1 2 n max_ton c1 c 1 68 0 100 0 220 0 pf
7 / 22 tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 b m1r00xxxf electrical characteristics ( unless otherwise specified v cc = 20 v ta=25 c ) parameter symbol spec unit condition s min typ max circuit current circuit current1 i on1 0.5 1 2 ma f sw = 5 0khz at switching mode (gate=open) circuit current at s leep m ode i sleep 60 120 200 $ at shutdown mode circuit current at normal m ode i act 350 800 1400 $ switching stop mode , circuit current at uvlo m ode i off 18 35 60 $ v cc = 1.9 v vcc item vcc uvlo threshold voltage1 v uvlo1 2. 0 0 2.30 2. 65 v v cc sweep up vcc uvlo threshold voltage2 v uvlo2 1.9 5 2.25 2. 60 v v cc sweep down sr controller block gate turn on threshold v gon n - 150 - 100 - 50 mv v drain = - 300 m v to +300 m v gate turn off threshold v go ff - 10 - 6 - 1 mv v drain = - 300 m v to +300 m v c ompulsion on time ( note 5) t con - 9 - 9 % excluding bm1r00026 - 30 and bm1r00146 - 150 which has no compulsion on time compulsion off time ( note 5) t coff - 9 - 9 % max_ton block max_ton timer start threshold voltage v max_on_start 24 28 32 v v cc =2 0v, drain terminal voltage max_ton timer t max_on 9. 4 10 10. 6 v r max_ton n , v cc =3v, v drain = - 0.3 < 7 v max_ton output voltage v max_on 0. 24 0.40 0. 56 v auto shutdown block auto shutdown detect time t shd 120 200 320 v no pulse to drain terminal auto shutdown cancel pulse number p act - 265 - time input pulse to dran terminal drain monitor block drain sink current i d_sink 130 250 550 $ v drain =120v drain terminal source current1 i drain_so1 - 23 - 11 - 5 $ v drain =0.1v drain terminal source current2 i drain_so2 - 3 - 1 - 0.3 $ v drain = - 0.2v driver block gate terminal high voltage v gate_h1 11 12 1 4 v v cc =20v high side fet on - resistance (v cc =2. 7 v) r hionr1 12.0 23.0 50.0 v cc =2. 7 v, i out = - 10ma high side fet on - r esistance (v cc =5v) r hionr2 6.0 12.0 24.0 v cc =5.0v, i out = - 10ma high side fet on - resistance (v cc =10v) r hionr3 4.0 9.0 18.0 v cc =10v, i out = - 10ma low side fet on - resistance (v cc =2. 7 v) r lowonr1 1. 1 2.2 4.4 v cc =2. 7 v, i out = +10ma low side fet on - resistance (v cc =5v) r lowonr2 0.9 1.8 3.6 v cc =5.0v, i out = +10ma propagation delay to fet turn on t delay_on - 50 - ns v drain = - 300mv to +300mv propagation delay to fet turn off t delay_off - 10 0 - ns v drain = - 300mv to +300mv (note 5 ) see the lineup ta ble in page1 .
8 / 22 tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 b m1r00xxxf electrical characteristics ( unless otherwise specified v sh_out = 20 v ta=25 c ) parameter symbol spec unit condition s min typ max shunt regulator block (other chip ) reference voltage v shref 0.796 0.800 0.804 v v sh_out =5v sh_out sink current =100a reference voltage changing ratio by temperature v shemp - - 4 - mv v sh_out =5v sh_out sink current =100a temperature =25c to 105 c sh_out coefficient of the reference voltage1 v shref1 - 1 - mv v sh_out = 2. 7 v to 5v sh_o ut sink current =100a sh_out coefficient of the reference voltage2 v shref2 - 2 - mv v sh_out =5v to 20v sh_out sink current =100a reference input current i sh_in - 0.2 0.0 0.2 $ v sh_in =2v dynamic impedance1 z sh_out1 - 0.3 - sh_out sink current =100a to 300a ( v sh_out =2. 7 v) dynamic impedance2 z sh_out2 - 0.2 - sh_out sink current =100a to 300a ( v sh_out =20v) sh_out current at sh_in=low i sh_out 20 40 75 $ v sh_in =0v, v sh_out = 2 0v sh_out sink current i sh_out_min 1 - - ma v sh_in =0.85v, v sh_out = 2. 7 v sh_ in ovp detection voltage1 v shi_ovp1 0.90 1.00 1.10 v v sh_in = sweep up sh_in ovp detection voltage2 v shi_ovp2 0.85 0.95 1.05 v v sh_in = sweep down sh_out ovp detection voltage v sho_ovp1 32.5 35 37.5 v v sh_out sweep up sh_out ovp detection voltage2 v sho _ovp2 31.5 34 36.5 v v sh_out sweep down latch timer t latch2 100 200 300 v sh_out sink current at latch mode i latch_sh_in_ovp 1.3 2.5 5 ma v sh_out =5v , v sh_in =0v
9 / 22 tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 b m1r00xxxf t ypical performance curves ta= - 40 c ta= 105 c figure 3 . circuit current vs input voltage (stop switching state) ta= 2 5 c input voltage : v cc [v] circuit current : i act [ma] figure 4 . circuit curre nt vs input voltage (stop switching state vcc zoom) ta= - 40 c ta= 2 5 c ta= 105 c input voltage : v cc [v] circuit current : i act [ma] ta= - 40 c ta= 105 c ta= 2 5 c figure 5 . circuit current vs input voltage (at shut down state) input voltage : v cc [v] circuit current : i sleep [a] ta= - 40 c ta= 105 c ta= 2 5 c figur e 6 . circuit current vs sh_out voltage ( v sh_in =0v) sh_out voltage : v sh_out [v] sh_out sink current : i sh_out [a] 0 20 40 60 80 100 120 140 160 180 200 0 5 10 15 20 25 30 input voltage vcc[v] circuit current i sleep [ a 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 input voltage vcc[v] circuit current i act [ma] 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 input voltage vcc[v] sh_out sink current i sh_out [ a 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 5 10 15 20 25 30 input voltage vcc[v] circuit current i act [ma]
10 / 22 tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf t ypical performance curves - continued figure 7 . sh_in voltage vs temperature ( i sh_out =100 a) v sh_out =20v v sh_out =5v v sh_out = 3 v temperature : ta [c] sh_in voltage : v shref [v] vcc=20v vcc=5v vcc=3v figure 8 . max_ton timer vs temperature ( r max_ton =100k , v drain = - 0.3v< - >vcc x 2 ) temperature : ta [c] max_ton timer : t max_on [s] v cc =20v v cc =5v v cc =3v figure 9 . gate on threshold vs temper ature (drain sweep down) temperature : ta [c] gate on threshold voltage : v gon [mv] figure 10 . gate off threshold vs temperature ( drain sweep up) temperature : ta [c] gate off threshold voltage : v goff [mv] v sh_out =20v v sh_out =5v v sh_out =3v v sh_out =20v v sh_out =5v v sh_out =3v 0.780 0.785 0.790 0.795 0.800 0.805 0.810 0.815 0.820 -40 -20 0 20 40 60 80 100 temperature ta [ 9.0 9.2 9.4 9.6 9.8 10.0 10.2 10.4 10.6 10.8 11.0 -40 -20 0 20 40 60 80 100 temperature ta [ s -110 -105 -100 -95 -90 -40 -20 0 20 40 60 80 100 temperature ta [ gate on threshold voltage v gon [mv] -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 -40 -20 0 20 40 60 80 100 temperature ta [
11 / 22 tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf t ypical performance curves - continued ta =105c v ta= 2 5c ta= - 40 c figure 11. sh_out current vs sh_in voltage ( v sh_out =5v) sh_ in voltage : v sh_in [ m v] sh_out current : i sh_out [a] figure 1 2 . sh_out current vs sh_in voltage ( v sh_out =5v, zoom up) ta=105c v ta= - 40 c ta= 2 5c sh_ in voltage : v sh_in [ m v] sh_out current : i sh_out [a] 0 50 100 150 200 250 300 760 780 800 820 840 sh_in voltage v sh_in [v] sh_out current i sh_out [ 0 1000 2000 3000 4000 5000 740 760 780 800 820 840 860 sh_in voltage v sh_in [v] sh_out current i sh_out [
12 / 22 b m1r00xxxf tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 timing chart figure 13. start u p sequence v o u t ( v c c ) r e g 4 v ( i n t e r n a l i c ) v c c _ u v l o 2 . 3 v v c c = 2 . 3 v 4 v 4 v 5 v r e f 1 v ( i n t e r n a l i c ) 1 v d r a i n m a x _ t o n 0 . 4 v g a t e 2 0 0 u s d r a i n 2 6 5 c o u n t a u t o _ s h u t d o w n ( i n t e r n a l i c ) s h u t d o w n P 1 . 3 v b g _ 0 . 5 v ( i n t e r n a l i c ) 0 . 5 v b g _ o k ( i n t e r n a l i c ) 4 v d r v 4 v ( i n t e r n a l i c ) d r a i n 4 c o u n t d r a i n 9 c o u n t
13 / 22 b m1r00xxxf tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 applic ation example s built - in shunt regulator in the ic has been completely separated from internal and synchronous rectification control ic. therefore , the shunt regulator is possible to be used as a gnd refe rence in high side type of flyback application . figure 1 4 . flyback application circuit (low side fet) figure 1 5 . flyback application circuit (high side fet) + - v o u t g n d s h _ i n g a t e s h _ g n d d r a i n 8 6 5 1 2 3 4 v c c s h _ o u t 7 s r _ g n d m a x _ t o n c f b 2 r f b 1 r f b 2 r s h _ o u t 2 p c 1 r v c c r s h _ o u t 1 c v c c c f b 1 c o u t r m a x _ t o n r 1 c 1 m 1 r d r a i n 1 r d r a i n 2 l f b d 1 + - v o u t g n d s h _ i n g a t e s h _ g n d d r a i n 8 6 5 1 2 3 4 v c c s h _ o u t 7 s r _ g n d m a x _ t o n r m a x _ t o n r 1 c 1 c v c c r v c c c f b 1 c f b 2 r f b 1 r f b 2 r s h _ o u t 1 r s h _ o u t 2 p c 1 c o u t m 1 d 1 r d r a i n 1 r d r a i n 2 l f b
14 / 22 b m1r00xxxf tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 regarding p rotection a pplications the built - in s hunt regulator is high - voltage, low current consumption , high accuracy , and also suitable as a comparator fo r protection application . on the above current resonant circuit, the shunt regulator is used as an overvoltage protection circuit. figure 1 6 . resonant half - bridge application circuit shunt regulator used as overvol tage (ovp) protection disable max_ton by pulling up to vcc if not in continuous mode operation such as in current resonance and quasi - resonant applications shunt regulator used in feedback operation + - v o u t g n d s h _ i n g a t e s h _ g n d d r a i n 8 6 5 1 2 3 4 v c c s h _ o u t 7 s r _ g n d m a x _ t o n r d r a i n 1 c v c c 1 c f b 1 c f b 2 r f b 1 r f b 2 r s h _ o u t 1 r s h _ o u t 2 p c 1 c o u t m 1 s h _ i n g a t e s h _ g n d d r a i n 8 6 5 1 2 3 4 v c c s h _ o u t 7 s r _ g n d m a x _ t o n c v c c 2 c f b 3 r f b 3 r s h _ o u t 1 3 p c 2 m 2 r f b 4 r d r a i n 3 r d r a i n 4 l f b 2 d 2 r d r a i n 2 l f b 1 d 1
15 / 22 b m1r00xxxf tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 selection of externally connected components 1. max_ton pin setting a resistance value which is connected to the max_ ton terminal is used to set the timer to force the gate output off . ( for detailed operation , please see " each block operation / max_ton blocks") set timer is proportional to the resistance value which can be set in the range of 56k to 300k. this ic is capa ble of an accuracy of 10us 6 % at n . however, accuracy deteriorates as the resistance value gets further away from n for example, 5.6s 0.9 s dwn 3 0s 4.5s at n (see graph below ) to prevent destruction due to surge current in continuous mo de, set the max_ton timer before turning on the primary side fet (g 1 ) to forcibly off the secondary side fet (g 2 ). regarding such variations , select a resistance value of max_ton terminal so that the max_on t imer setting time is less than one cycle in the primary side ( t p > t max_on ) . - the primary side of the maximum frequency = f max [hz] - the primary side of the maximum frequency accuracy = f max [%] - the primary side of the jitter frequency = f jitter [hz] - s econdary side max_ton timer time = t max_on - s econdary side max_ton timer time accuracy = t max_on - s econdary side max_ton when the connection resistance accuracy = r 2. calculation example primary side frequency 100kh z 5% primary side jitter frequency 8khz secondary side max_ton timer accuracy = 7% secondary side max_ton connection resistance accuracy = 1% with these conditions, max_ton resistor(r max_ton ) shoul d be set to 81 n ruohvv,qdgglwlrqlwlvuhfrpphqghgwkdw the temperature characteristics of each component should also be taken into account . figure 1 7 . max_ton timer vs max_ton resistor (r max_ton ) figure 18 . primary fet and secondary fet sequence at ccm mo de r max_ton [k ? ] < 10000 [k ? ][ khz] (1+ t max_on [%]+ r[%] + f max [%])(f max [khz]+f jitter [khz]) r max_ton [k ? ] < 10000 [k ? ][ khz] (1+5%+1%+7%)(100khz+8khz) = 81.94 [k ? ] frequency variation ratio maximum frequency value s et the max_ton timer so that the fet of the primary side (g 1 ) and the secondary side (g 2 ) is not simultaneous ly on t max_on t p g 1 g 2 5 6 k 1 0 0 k 3 0 0 k 3 0 u 2 5 . 5 u 3 4 . 5 u 1 0 . 0 u 1 0 . 6 u 9 . 4 u 5 . 6 u 4 . 7 u 6 . 5 u m a x _ t o n r e s i s t o r [ o h m ] m a x _ t o n t i m e r [ s ] g 1 t m a x _ o n m a x _ t o n t i m e r c o m p u l s i o n o f f t i m e r s t a r t g 2 t p j i t t e r
16 / 22 b m1r00xxxf tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 i/o equivalent circuits pin 1 : vcc / pin 6 : gate / pin 7 : sr_gnd pin 8 : drain pin 2 : sh_in / pin 3 : sh_out / pin 4 : sh_gnd pin 5 : max_ton s r b l o c k i n t e r n a l r e g 6 . g a t e 7 . s r _ g n d 1 . v c c 8 . d r a i n 7 . s r _ g n d 2 . s h _ i n 4 . s h _ g n d 3 . s h _ o u t 5 . m a x _ t o n i n t e r n a l r e g
17 / 22 b m1r00xxxf tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 notes on the layout ( 1 ) vcc line may malfunction under the influence of switching noise . therefore, it is recommended to insert a capacitor c vcc between the vcc and sr_g nd terminal . ( 2 ) sh_in terminal is a high impedance line . to avoid crosstalk, electric al wiring should be as short as possible and not in parallel with the switching line. ( 3 ) max_ton terminal has a 0.4v output . the external components of the max_ton term inal affects the forced off time due to switching. thus, r1 and c1 should be connected to max_ton terminal as near as possible. it is also recommended to use an independent electrical wiring in connection with sr_gnd terminal. ( 4 ) the synchronous rectifica tion controller ic must accurately monitor the v ds generated in the fet. accordingly, the electrical wiring between the drain to drain and sr_gnd to source of the ic and fet respectively should be connected independently. ( 5 ) the sh_gnd of the shunt regula tor and the feedback resistors of v out are recommended to be connected to the gnd of the output with an independent electrical wiring. (6) the drain terminal is a 0 <9vzlwfklqjolqh8vhdqduurzzlulqjdqgfrqqhfwdvvkruwdvsrvvleoh ( 7 ) use an indep endent wiring if connecting a snubber circuit between the ds of the fet. the connection of the transformer output and the source of the fet should be thick and short as possible. (8) due to the drain pin detects the small voltage, a malfunction which the s witch turns on/off caused by the surge voltage may occur. so that, the filters such as the ferrite bead are reco mmended f or alleviating the surge voltage. configuration example (note 6) : l fb 1 ( a ferrite bead for suppressing the surge voltage ) : mmz160 8s202a d 1 ( a s chottky barrier diode) : rb751g - 40 r drain1 ( a filter resistor for the fet turn off ) : 0.3k - 2k r drain2 ( a current limiting resistor to the drain terminal ) : 15 0 ? (note 6) t he value i s not a guaranteed value , but for reference . please c hoose the optimum values of the components after sufficient evaluations based on the actual application. (8) figure 1 9 . flyback applicati on circuit (low side fet) l f b 1 + - v o u t g n d s h _ i n g a t e s h _ g n d d r a i n 8 6 5 1 2 3 4 v c c s h _ o u t 7 s r _ g n d m a x _ t o n r m a x _ t o n r 1 c 1 c v c c r v c c c f b 1 c f b 2 r f b 1 r f b 2 r s h _ o u t 1 r s h _ o u t 2 p c 1 c o u t m 1 r s n b c s n b ( 7 ) ( 6 ) ( 5 ) ( 4 ) ( 3 ) ( 2 ) ( 1 ) ( 5 ) d 1 r d r a i n 1 r d r a i n 2
18 / 22 b m1r00xxxf tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against re verse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s . 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a cap acitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition . 4. ground wiring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance . 5. thermal consideration should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction t emperature rating . 6. recommended operating conditions these conditions represent a range within which the expected ch aracteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and ro uting of connections . 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject wkh ,& wr vwuhvv $ozd\v glvfkdujh fdsdflwruv frpsohwho\ diwhu hdfk surfhvv ru vwhs 7kh ,&?v srzhu vxsso\ vkrxog always be turned off completely before connecting or removing it from the test s etup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage . 10. inter - pin short and mounting errors ensure that the direction and position are correct whe n mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water dr oplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few . 11. unused input terminals input pin s of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedan ce and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected o peration of the ic. so unless otherwise specified, unused input pin s should be connected to the power supply or ground line .
19 / 22 b m1r00xxxf tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 operational notes - continued 12. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate layers bet ween adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below) : when gnd > pin a and gn d > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interf erence among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided . figure 20 . exa mple of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others . 14. area of safe ope ration (aso) operate the ic such that the output voltage, output current, and the maximum junction temperature rating are all within the area of safe operation (aso) . 15. thermal shutdown circuit(tsd) bm1r00 121 f bm1r00150f (auto restart protection series) t his ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be zlwklq wkh ,&?v maximum junction temperature rating . if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored t o normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. bm1r00 001 f bm1r00030f (latch protection series) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be zlwklq wkh ,&?v maximum junction temperature rating . if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. the ic should be powered down and turned on again to resume normal operation because the tsd circuit keeps the outputs at the off state even if the tj falls below the tsd threshold. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
20 / 22 b m1r00xxxf tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 ordering informatio n b m 1 r 0 0 x x x f - e 2 part number package f: sop8 packaging and forming specification e2: embossed tape and reel ( so p8 ) marking diagram part number marking package orderable part number 00xxx sop8 bm1r00xxxf - e2 sop8 (top view) part number marking lot number 1pin mark latch protection series auto restart protection series bm1r00121 00121 1 1.3 bm1r00122 00122 1 2 bm1r00123 00123 1 3 bm1r00124 00124 1 3.6 bm1r00125 00125 1 4.6 bm1r00126 00126 1.5 1.3 bm1r00127 00127 1.5 2 bm1r00128 00128 1.5 3 bm1r00129 00129 1.5 3.6 bm1r00130 00130 1.5 4.6 bm1r00131 00131 2.3 1.3 bm1r00132 00132 2.3 2 bm1r00133 00133 2.3 3 bm1r00134 00134 2.3 3.6 bm1r00135 00135 2.3 4.6 bm1r00136 00136 2.8 1.3 bm1r00137 00137 2.8 2 bm1r00138 00138 2.8 3 bm1r00139 00139 2.8 3.6 bm1r00140 00140 2.8 4.6 bm1r00141 00141 3.5 1.3 bm1r00142 00142 3.5 2 bm1r00143 00143 3.5 3 bm1r00144 00144 3.5 3.6 bm1r00145 00145 3.5 4.6 bm1r00146 00146 none 1.3 bm1r00147 00147 none 2 bm1r00148 00148 none 3 bm1r00149 00149 none 3.6 bm1r00150 00150 none 4.6 function name part number marking compulsion on time v compulsion off time v bm1r00001 00001 1 1.3 bm1r00002 00002 1 2 bm1r00003 00003 1 3 bm1r00004 00004 1 3.6 bm1r00005 00005 1 4.6 bm1r00006 00006 1.5 1.3 bm1r00007 00007 1.5 2 bm1r00008 00008 1.5 3 bm1r00009 00009 1.5 3.6 bm1r00010 00010 1.5 4.6 bm1r00011 00011 2.3 1.3 bm1r00012 00012 2.3 2 bm1r00013 00013 2.3 3 bm1r00014 00014 2.3 3.6 bm1r00015 00015 2.3 4.6 bm1r00016 00016 2.8 1.3 bm1r00017 00017 2.8 2 bm1r00018 00018 2.8 3 bm1r00019 00019 2.8 3.6 bm1r00020 00020 2.8 4.6 bm1r00021 00021 3.5 1.3 bm1r00022 00022 3.5 2 bm1r00023 00023 3.5 3 bm1r00024 00024 3.5 3.6 bm1r00025 00025 3.5 4.6 bm1r00026 00026 none 1.3 bm1r00027 00027 none 2 bm1r00028 00028 none 3 bm1r00029 00029 none 3.6 bm1r00030 00030 none 4.6 compulsion on time v compulsion off time v function name part number marking
21 / 22 b m1r00xxxf tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 physical dimension , tape and reel information package name sop8 (unit : mm) pkg : sop8 drawing no. : ex112 - 5001 - 1 (max 5.35 (include.burr))
22 / 22 b m1r00xxxf tsz02201 - 0f4f0a2bm1r0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 revision history date revis ion changes 2 . mar .2016 00 1 data sheet revision1 release . 20. apr. 2016 002 modification: p4, p5 vout - >vcc 20.apr. 2016 002 modification: p6, 74.2mm2 - > 74.2mm x 74.2mm 20.apr. 2016 002 modification: p15, fig17 graph.
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet part number bm1r00149f package sop8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bm1r00149f - web page

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