1.300.05 updated views with modified mold geometry k cm d c b a a b c d eng.rel.no. scale size project dwg. no. c sheet rev. date approvals drawn designed checked qa app'd unless otherwise specified dimensions are in milimeters revised front guard and added marking j h cm jan05/15 tolerances are: code ident. no. decimals angles 2 0.10 material and finish do not scale drawing 1 2 3 4 5 6 7 8 8 76 54 32 1 revisions rev. description date approved e f e f ie app'd dwg app'd g or used for manufacturing purposes without permission from amphenol canada corp. ecn 1 of 1 nts title amphenol high speed interconnects this document contains proprietary information and such information may not be disclosed to others for any purpose 104 position connector P-U99-B104-XXXX cfp2 03554 k. liu c.michlik jun05/12 jun05/12 k redrawn with contact height reference added may22/14 cm added reference dimensions aug19/15 cm c.michlik jun05/12 zlj jun05/12 .x 0.2 .xx cfp2 4x25g apr20/17 part number amphenol date code insulating tape 0.2 c 15.0 5.5 0.780.2 e 0.08 c d d 0.1 d c e 1.200.05 10.45 15.30 1.200.05 15.30 34.300.05 5.500.05 32.50 4.95 #52 b #1 m a b s s s 0.05 s b 0.05 recommended pcb layout b s #104 #53 a a s 0.10 a 0.95 1.300.05 32.50 4.20 (104 plc.) 0.350.03 (104 plc.) 1.400.03 4.80 0.60 1.500.05 e 0.20 6.80 4.70 4.40 5.30 6.60 #104 #53 #52 #1 .08 d e c 6.80 4.40 31.480.04 2.30 0.850.08 3.90 4.95 solder termination, 50 to 75 micro inches of nickel x 3 contacts with 100 micro inches minimum of matte tin on 1) material: notes: : phosphor bronze : conductive polymer x x x resonance dampening feature 2) rohs compliant = 15 micro inches minimum of gold on mating end housing : solder reflow process compatible lcp, ul94v-0 u99 - b104 - under plate all over contact plating option 2 = 30 micro inches minimum of gold on mating end with 100 micro inches minimum of matte tin on solder termination, 50 to 75 micro inches of nickel under plate all over options 00t = standard construction with tape & reel packaging
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