an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. product preview information. product in design phase of development. subject to change or discontinuance without notice. SN75LVPE802 sllset1 ? january 2016 SN75LVPE802 two-channel 8 gbps sata express equalizer and redriver 1 1 features 1 ? q100 automotive qualified ? sata express support ? selectable equalization and de-emphasis ? hot plug capable ? receiver detect and oob support ? integrated output squelch ? multirate operation ? sata: 1.5 gpbs, 3 gpbs, 6 gpbs ? pcie: 2.5 gbps, 5 gbps, 8 gbps ? excellent jitter and loss compensation capability to over 24-inch (61-cm) fr4 trace ? low power ? < 220 mw (typical) ? < 50 mw (in auto low-power mode) ? < 5 mw (in standby mode) ? 20-pin 4-mm 4-mm qfn package ? high protection against esd transient ? hbm: 10,000 v ? cdm: 1,500 v ? mm: 200 v 2 applications ? tablets ? notebooks ? desktops ? docking stations 3 description the SN75LVPE802 is a versatile dual channel, sata express signal conditioner supporting data rates up to 8 gbps. the device supports sata gen 1, 2, and 3 specifications as well as pcie 1, 2, 3. the SN75LVPE802 operates from a single 3.3-v supply and has 100- line termination with self-biasing feature, making the device suitable for ac coupling. the inputs incorporate an out-of-band (oob) detector, which automatically squelches the output when the input differential voltage falls below threshold while maintaining a stable common-mode voltage. the device is also designed to handle spread spectrum clocking (ssc) transmission per sata standard. the SN75LVPE802 handles interconnect losses at its input with selectable equalization settings that can be programmed to match the loss in the channel. for data rates of 3 gbps and lower, the SN75LVPE802 equalizes signals for a span of up to 50 inches of fr4 board material. for data rates of 8 gbps, the device compensates up to 40 in of fr4 material. the equalization level is controlled by the setting of the signal control pin eq. two de-emphasis levels can be selected on the transmit side to provide 0 or 1.2 db of additional high- frequency loss compensation at the output. the device is hot-plug capable (requires use of ac coupling capacitors at differential inputs and outputs) preventing device damage under device hot-insertion such as async signal plug/removal, unpowered plug/removal, powered plug/removal, or surprise plug/removal. device information (1) part number package body size (nom) SN75LVPE802 wqfn (20) 4.00 mm x 4.00 mm (1) for all available packages, see the orderable addendum at the end of the data sheet. simplified schematics product preview 330 host controller device connector 330 220 nf 220 nf 220 nf 220 nf vcc rx1p rx1n gnd tx2n tx2p dew2 en de2 de1 vcc vcc eq2 gnd eq1 dew1 tx1p tx1n gnd rx2n rx2p vcc 470 nf 470 nf 330 330 220 nf 220 nf 220 nf 220 nf u1 SN75LVPE802 productfolder sample &buy technical documents tools & software support &community
2 SN75LVPE802 sllset1 ? january 2016 www.ti.com product folder links: SN75LVPE802 submit documentation feedback copyright ? 2016, texas instruments incorporated 4 device and documentation support 4.1 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 4.2 trademarks e2e is a trademark of texas instruments. all other trademarks are the property of their respective owners. 4.3 electrostatic discharge caution these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 4.4 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 5 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. product preview
package option addendum www.ti.com 18-jan-2016 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples SN75LVPE802rtjr preview qfn rtj 20 3000 tbd call ti call ti -40 to 85 lvp802 SN75LVPE802rtjt preview qfn rtj 20 250 tbd call ti call ti -40 to 85 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
package option addendum www.ti.com 18-jan-2016 addendum-page 2
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? 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s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. nonetheless, such components are subject to these terms. no ti components are authorized for use in fda class iii (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. only those ti components which ti has specifically designated as military grade or ? enhanced plastic ? are designed and intended for use in military/aerospace applications or environments. buyer acknowledges and agrees that any military or aerospace use of ti components which have not been so designated is solely at the buyer ' s risk, and that buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti has specifically designated certain components as meeting iso/ts16949 requirements, mainly for automotive use. in any case of use of non-designated products, ti will not be responsible for any failure to meet iso/ts16949. products applications audio www.ti.com/audio automotive and transportation www.ti.com/automotive amplifiers amplifier.ti.com communications and telecom www.ti.com/communications data converters dataconverter.ti.com computers and peripherals www.ti.com/computers dlp ? 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