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slls455b ? november 2000 ? revised march 2005 1 post office box 655303 ? dallas, texas 75265 designed for tia/eia-485, tia/eia-422, and iso 8482 applications signaling rate 1 exceeding 50 mbps fail-safe in bus short-circuit, open-circuit, and idle-bus conditions esd protection on bus inputs exceeds 6 kv common-mode bus input range ?7 v to 12 v propagation delay times <16 ns low standby power consumption <20 a pin-compatible upgrade for mc3486, ds96f175, ltc489, and sn75175 description the SN65LBC175A and sn75lbc175a are quadruple differential line receivers with 3-state outputs, designed for tia/eia-485 (rs-485), tia/eia-422 (rs-422), and iso 8482 (euro rs-485) applications. these devices are optimized for balanced multipoint bus communication at data rates up to and exceeding 50 million bits per second. the transmission media may be twisted-pair cables, printed-circuit board traces, or backplanes. the ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment. each receiver operates over a wide range of positive and negative common-mode input voltages, and features esd protection to 6 kv, making it suitable for high-speed multipoint data transmission applications in harsh environments. these devices are designed using linbicmos , facilitating low power consumption and inherent robustness. two en inputs provide pair-wise enable control, or these can be tied together externally to enable all four drivers with the same signal. the sn75lbc175a is characterized for operation over the temperature range of 0 c to 70 c. the SN65LBC175A is characterized over the temperature range from ?40 c to 85 c. copyright ? 2001, texas instruments incorporated please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. linbicmos is a trademark of texas instruments. 1 the signaling rate of a line is the number of voltage transitions that are made per second expressed in the units bps (bits per second). 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 1b 1a 1y 1,2en 2y 2a 2b gnd v cc 4b 4a 4y 3,4en 3y 3a 3b SN65LBC175A (marked as 65lbc175a) sn75lbc175a (marked as 75lbc175a) d or n package (top view) logic diagram 1a 1b 1y 2a 2b 2y 3a 3b 3y 4a 4b 4y 1,2en 3,4en
slls455b ? november 2000 ? revised march 2005 2 post office box 655303 ? dallas, texas 75265 function table (each receiver) differential inputs enable output differential inputs a ? b (v id ) enable en output y v id ?0.2 v h l v id ?0.2 v h l ?0.2 v < v id < ?0.01 v h ? ?0.2 v < v id < ?0.01 v h ? ?0.01 v v id h h ?0.01 v v id h h x l z x l z x open z short circuit h h short circuit h h open circuit h h h = high level, l = low level, x = irrelevant, z = high impedance (off), ? = indeterminate available options package t a plastic small outline ? (jedec ms-012) plastic dual-in-line (jedec ms-001) 0 c to 70 c sn75lbc175ad sn75lbc175an ?40 c to 85 c SN65LBC175Ad SN65LBC175An ? add an r suffix for taped and reeled ? for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti web site at www.ti.com. equivalent input and output schematic diagrams 16 v 16 v 100 k ? 18 k ? 4 k ? 4 k ? input a input v cc 16 v 16 v 100 k ? 18 k ? 4 k ? 4 ? input b input v cc 1 k ? 8 v 100 k ? v cc input enable input v cc 5 ? 8 v 8 v y output output
slls455b ? november 2000 ? revised march 2005 3 post office box 655303 ? dallas, texas 75265 absolute maximum ratings ? over operating free-air temperature range (unless otherwise noted) supply voltage range, v cc (see note 1) ?0.3 v to 6 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . voltage range at any bus input (steady state), a and b ?10 v to 15 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . voltage range at any bus input (transient pulse through 100 ? , see figure 5) ?30 v to 30 v . . . . . . . . . . . . . . voltage input range at 1,2en and 3,4en, v i ?0.5 v to v cc + 0.5 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . receiver output current, i o 10 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . electrostatic discharge: human body model (see note 2): a and b to gnd 6 kv . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . all pins 5 kv . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . charged-device model (see note 3): all pins 2 kv . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous power dissipation see power dissipation rating table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. all voltage values, except differential i/o bus voltages, are with respect to gnd, and are steady-state (unless otherwi se specified). 2. tested in accordance with jedec standard 22, test method a114-a. 3. tested in accordance with jedec standard 22, test method c101. dissipation rating table package t a 25 c power rating derating factor ? above t a = 25 c t a = 70 c power rating t a = 85 c power rating d 1080 mw 8.7 mw/ c 690 mw 560 mw n 1150 mw 9.2 mw/ c 736 mw 598 mw ? this is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. recommended operating conditions min nom max unit supply voltage, v cc 4.75 5 5.25 v voltage at any bus terminal a, b ?7 12 v high-level input voltage, v ih en 2 v cc v low-level input voltage, v il en 0 0.8 v output current y ?8 8 ma operating free-air temperature, t a sn75lbc175a 0 70 c operating free-air temperature, t a SN65LBC175A ?40 85 c
slls455b ? november 2000 ? revised march 2005 4 post office box 655303 ? dallas, texas 75265 electrical characteristics over recommended operating conditions parameter test conditions min typ ? max unit v it+ positive-going differential input voltage threshold ?80 ?10 v it? negative-going differential input voltage threshold ?7 v < v cm < 12 v (v cm = (v a + v b ) / 2 ) ?200 ?120 mv v hys hysteresis voltage (v it+ ? v it? ) ?40 mv v ik input clamp voltage i i = ?18 ma ?1.5 ?0.8 v v oh high-level output voltage v id = 200 mv, i oh = ?8 ma see figure 1 2.7 4.8 v v ol low-level output voltage v id = ?200 mv, i ol = 8 ma see figure 1 0.2 0.4 v i oz high-impedance-state output current v o = 0 v to v cc ?1 1 a i i line input current other input at 0 v, v = 0 v or 5 v v i = 12 v 0.9 ma i i line input current other input at 0 v, v cc = 0 v or 5 v v i = ?7 v ?0.7 ma i ih high-level input current enable inputs 100 a i il low-level input current enable inputs ?100 a r i input resistance a, b 12 k ? i cc supply current v id = 5 v 1,2en, 3,4en at 0 v 20 ma i cc supply current no load 1,2en, 3,4en at v cc 11 16 ma ? all typical values are at v cc = 5 v and 25 c. switching characteristics over recommended operating conditions parameter test conditions min typ ? max unit t r output rise time 2 4 ns t f output fall time v id = ?3 v to 3 v, see figure 2 2 4 ns t plh propagation delay time, low-to-high level output v id = ?3 v to 3 v, see figure 2 9 12 16 ns t phl propagation delay time, high-to-low level output 9 12 16 ns t pzh propagation delay time, high-impedance to high-level output see figure 3 27 38 ns t phz propagation delay time, high-level to high-impedance output see figure 3 7 16 ns t pzl propagation delay time, high-impedance to low level output see figure 4 29 38 ns t plz propagation delay time, low-level to high-impedance output see figure 4 12 16 ns t sk(p) pulse skew (| (t plh ? t phl) |) 0.2 1 ns t sk(o) output skew (see note 4) 2 ns t sk(pp) part-to-part skew (see note 5) 2 ns ? all typical values are at v cc = 5 v and 25 c. notes: 4. outputs skew (t sk(o) ) is the magnitude of the time delay difference between the outputs of a single device with all of the inputs connected together. 5. part-to-part skew (t sk(pp) ) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same input signals, the same supply voltages, at the same temperature, and have identical packages and test circuits.
slls455b ? november 2000 ? revised march 2005 5 post office box 655303 ? dallas, texas 75265 parameter measurement information v id v o i o v a v b figure 1. voltage and current definitions a b generator 50 ? generator 50 ? y c l = 15 pf (includes probe and jig capacitance) generators: prr = 1 mhz, 50% duty cycle, t r <6 ns, z o = 50 ? 90% 90% 1.5 v 1.5 v 3 v 0 v t plh t phl v oh v ol t r t f input b input a output y 10% 10% 1.5 v figure 2. switching test circuit and waveforms a b generator 50 ? y c l = 15 pf 1.5 v 1.5 v 3 v 0 v t pzh t phz v oh gnd v oh ?0.5 v 1.5 v 1.5 v 1 k ? v cc generators: prr = 1 mhz, 50% duty cycle, t r <6 ns, z o = 50 ? en c l = 15 pf (includes probe and jig capacitance) en y figure 3. test circuit waveforms, t pzh and t phz
slls455b ? november 2000 ? revised march 2005 6 post office box 655303 ? dallas, texas 75265 parameter measurement information a b generator 50 ? y 1.5 v 1.5 v 3 v 0 v t pzl t plz v ol v cc en y v ol + 0.5 v 1.5 v ?1.5 v en 1 k ? v cc generators: prr = 1 mhz, 50% duty cycle, t r <6 ns, z o = 50 ? c l = 15 pf (includes probe and jig capacitance) figure 4. test circuit waveforms, t pzl and t plz pulse generator, 15 s duration, 1% duty cycle 100 ? v test 0 v 15 s 1.5 ms v test figure 5. test circuit and waveform, transient over-voltage test
slls455b ? november 2000 ? revised march 2005 7 post office box 655303 ? dallas, texas 75265 typical characteristics figure 6 ?600 ?400 ?200 0 200 400 600 800 ?10 ?5 0 5 10 15 v cc = 0 v v cc = 5 v bus input current ? bus input voltage ? v bus input current vs bus input voltage a figure 7 0 1 2 3 4 5 6 ?150 ?100 ?50 0 50 v ic = ?7 v v ic = 0 v v ic = 12 v v ic = ?7 v v ic = 0 v v ic = 12 v v cc = 5 v t a = 25 c ? output voltage ? v differential input voltage ? mv output voltage vs differential input voltage v o figure 8 0 10 20 30 40 50 60 1 10 100 v cc = 5 v, no load v cc = 4.75 v, c l = 15 pf v cc = 5 v, c l = 15 pf v cc = 5.25 v, c l = 15 pf ? supply current ? ma signaling rate (all four channels) ? mbps supply current vs signaling rate (all four channels) i cc figure 9 11 11.5 12 12.5 13 13.5 ?40 ?20 0 20 40 60 80 t phl t plh propagation delay time ? ns propagation delay time vs free-air temperature t a ? free-air temperature ? c
slls455b ? november 2000 ? revised march 2005 8 post office box 655303 ? dallas, texas 75265 typical characteristics a, b 500 mv 5 v ?500 mv 0 v 20 ns y figure 10. receiver inputs and outputs, 50 mbps signaling rate
slls455b ? november 2000 ? revised march 2005 9 post office box 655303 ? dallas, texas 75265 application information tms320f243 dsp (controller) spisimo sn65lbc174a SN65LBC175A tms320f241 dsp (embedded application) spisimo iopa1 spiste spiste iopa0 (handshake /status) spiclk iopa0 iopa1 (enable) spiclk spisomi spisomi iopa2 iopa2 (enable) figure 11. typical application circuit, dsp-to-dsp link via serial peripheral interface servo drive SN65LBC175A encoder phase a status bit encoder phase b encoder index motion controller figure 12. typical application circuit, high-speed servomotor encoder interface
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN65LBC175Ad active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN65LBC175Adg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN65LBC175Adr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN65LBC175Adrg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN65LBC175An active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type SN65LBC175Ane4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type sn75lbc175ad active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn75lbc175adg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn75lbc175adr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn75lbc175adrg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn75lbc175an active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type sn75lbc175ane4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. package option addendum www.ti.com 14-mar-2006 addendum-page 1
in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 14-mar-2006 addendum-page 2

important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements dif ferent from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security telephony www.ti.com/telephony video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments post office box 655303 dallas, texas 75265 copyright ? 2006, texas instruments incorporated

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